CN102441546A - Method for cleaning surface of plastic shell of electronic equipment - Google Patents

Abstract

Translated fromChinese

本发明涉及一种电子器材塑胶外壳表面清洗方法，先将常温下或加热后为气态的气体制备成固态介质，接着以高速气流朝向固态介质喷射而形成数个固态介质粒子，再以空气载体(Carrier)方式利用高速气流携带固态介质粒子朝向塑胶外壳表面高速撞击，利用固态介质粒子汽化会大量吸热而将塑胶外壳表面的油渍、杂质和污染物予以低温脆化，配合固态介质粒子的高速撞击和高速气流，可以将塑胶外壳表面的油渍、杂质和污染物予以破坏去除，达到有效清洁的目的。

The present invention relates to a surface cleaning method for a plastic shell of an electronic device. First, a gas in a gaseous state at room temperature or after being heated is prepared into a solid medium. Then, a high-speed airflow is sprayed toward the solid medium to form a plurality of solid medium particles. Then, the solid medium particles are carried by the high-speed airflow in an air carrier manner to collide with the surface of the plastic shell at high speed. The solid medium particles absorb a large amount of heat when vaporized, and the oil stains, impurities and pollutants on the surface of the plastic shell are embrittled at low temperature. With the high-speed collision of the solid medium particles and the high-speed airflow, the oil stains, impurities and pollutants on the surface of the plastic shell can be destroyed and removed, thereby achieving the purpose of effective cleaning.

Description

Electronic equipment plastic shell method for cleaning surface

Technical field

The present invention relates to a kind of cleaning method of article surface, particularly relate to a kind of electronic equipment plastic shell method for cleaning surface.

Background technology

By scientific and technological flourish now, many products that are relevant to the electronics aspect are come out one after another, and are full of already in the middle of our daily life, and computer, notebook computer, mobile phone or the like are too numerous to enumerate such as.But be accompanied by the utilization exploitation of electronic product, the problem that the frequency electromagnetic waves that is produced when avoiding electronic product to use works the mischief to human body has become the topic of every profession and trade institute extensive discussions at present.

For intercepting the electromagnetic wave that each electronic product produces; Minimizing is to the extent of injury of human body, and many electronic products can be at the shell of product at present, the processing that shields; For example: the shell of products such as notebook computer, mobile phone generally is provided with and intercepts the shielding electromagnetic waves processing.Existing shielding processing means roughly include spray conductive paint mode, electroless plating mode, utilize the metallic plate isolation method, and the vacuum coating mode etc.Wherein, General shielding processing means are the best with the vacuum coating mode; The vacuum coating mode is that the inner surface at plastic shell plates the low-resistance copper film of one deck, silverskin, aluminium film or other metal films and forms conductive layer, utilizes metal conducting layer that the validity of the anti-system of electromagnetic wave shielding is provided.

Yet adopt the vacuum coating mode, surperficial oil stain, impurity and the pollutant of electronic product plastic shell that must earlier ejection formation be processed removed cleaning, guarantees that thus metal conducting layer can coating be incorporated into the surface of electronic product plastic shell.As shown in Figure 3, existing electronic equipment plastic shell method for cleaning surface generally can be handled with the mode of sand blasted surface processing or spray paint bottom the electronic equipment plastic shell, solves the bad problem of plastic shell surface attachment thus.But handling with sand blasted surface is with the plastic shell surface coarsening, and the thickness of the feasible metal conducting layer that next need plate can increase a lot, influences working (machining) efficiency and increases manufacturing cost; With the processing mode of spray paint bottom, can cause processing cost to increase, and have environmental issue.

Summary of the invention

For solving existing electronic equipment plastic shell surface treatment mode; Relevant for working (machining) efficiency difference and the high not enough and restriction of processing cost; Main purpose of the present invention is to provide a kind of electronic equipment plastic shell method for cleaning surface; The present invention is prepared into solid state medium for the gas of gaseous state down or after the heating with normal temperature, and the plastic shell jet surface of with air carrier (Carrier) mode the solid state medium particle high speed being cleaned to quilt again utilizes solid state medium particle high speed bump plastic shell surface; Cooperate solid state medium particle ejection back vaporization; A large amount of heat absorptions of meeting and oil stain, impurity and the pollutant that plastic shell is surperficial are given low temperature brittleness, can oil stain, impurity and the pollutant on plastic shell surface be destroyed removal, reach the purpose of effective cleaning.

The objective of the invention is to adopt following technical scheme to realize.

Electronic equipment plastic shell method for cleaning surface according to the present invention proposes comprises the following steps:

Preparation solid state medium step, with at normal temperatures or the heating back be the gas of gaseous state, be prepared into a solid state medium with low temperature or high pressure mode;

Produce solid state medium particle step, utilize the pneumatic supply of high pressure to spray towards this solid state medium with high velocity air, and form several solid state medium particles, and the speed of the high velocity air after producing is 0.5 to 3 overtone speed through a spray nozzle device; And

The high-speed impact step; With the jet surface of the high velocity air that carries said solid state medium particle towards the electronic equipment plastic shell; Make said solid state medium particle high speed bump plastic shell surface and vaporization; A large amount of heat absorptions during with vaporization are given low temperature brittleness with oil stain, impurity and the pollutant on plastic shell surface, and by high velocity gas stream, accomplish cleaning.

Aforesaid electronic equipment plastic shell method for cleaning surface, wherein said gas is carbon dioxide (CO₂), argon gas (Ar), nitrogen (N₂) or helium (He).

Aforesaid electronic equipment plastic shell method for cleaning surface, the diameter of wherein said solid state medium particle is between 1 μ m to 300 μ m.

Electronic equipment plastic shell method for cleaning surface proposed by the invention, the beneficial effect that can obtain comprises:

1, the present invention utilizes the high-speed air carrier fashion directly with gas solid state medium particle at a high speed; Jet cleaning is carried out on surface to the electronic equipment plastic shell; Compared to the existing inner surface that adopts sand blasted surface to handle the alligatoring plastic shell; The present invention can reduce the thickness of the metal conducting layer of required coating, effectively reduces manufacturing cost and improves working (machining) efficiency.

2, electronic equipment plastic shell method for cleaning surface provided by the invention; The processing mode that combines metal conducting layer compared to existing first spray paint bottom again; The present invention also can effectively avoid environmental pollution problems that coating produces except saving the material cost.

Description of drawings

Fig. 1 is the cleaning step sketch map of preferred embodiment of the present invention.

Fig. 2 is the cleaning operation sketch map of preferred embodiment of the present invention.

Fig. 3 is the enforcement sketch map of existing electronic equipment plastic shell method for cleaning surface.

Description of reference numerals: 10-solid state medium; 11-solid state medium particle; The 20-pneumatic supply; The 21-control valve; The 22-spray nozzle device; The 30-high velocity air; The 40-plastic shell.

The specific embodiment

Below in conjunction with accompanying drawing and embodiment, do more detailed explanation to the present invention is above-mentioned with other technical characterictic and advantage, it should be understood that these embodiment only are used for the purpose of illustration, never limit protection scope of the present invention.

The preferred embodiment of electronic equipment plastic shell method for cleaning surface provided by the present invention is as depicted in figs. 1 and 2; Its cleaning step comprises preparation solid state medium step in regular turn, produces solid state medium particle step; And the high-speed impact step, can accomplish cleaning to electronic equipment plastic shell surface.

Described preparation solid state medium step be with at normal temperatures or heating back be the gas of gaseous state, for example carbon dioxide (CO₂), argon gas (Ar), nitrogen (N₂) and helium (He) etc., be prepared into asolid state medium 10 again after making said gas form liquid with low temperature or high pressure mode.

Described generation solid state medium particle step is to utilize thepneumatic supply 20 of acontrol valve 21 control high pressure to spray towards thissolid state medium 10 withhigh velocity air 30 through aspray nozzle device 22; And form several solidstate medium particles 11; The diameter of said solidstate medium particle 11 is between 1 μ m to 300 μ m, and the speed of thehigh velocity air 30 after producing can reach 0.5 to 3 overtone speed.

Described high-speed impact step is with air carrier (Carrier) mode; With the jet surface of the high velocity air that carries said solid statemedium particle 11 30 towards an electronic equipmentplastic shell 40; Make said solidstate medium particle 11 with transonic speed; Can a large amount of heat absorptions when high-speed impactplastic shell 40 surface and vaporization, said solidstate medium particle 11 vaporizations and oil stain, impurity and the pollutants on theseplastic shell 40 surfaces are given low temperature brittleness, cooperate the high-speed impact of said solidstate medium particle 11; Can oil stain, impurity and the pollutant on theseplastic shell 40 surfaces be destroyed removal; And take away byhigh velocity air 30, reach the effect of effective cleaning, accomplish the cleaning on electronic equipmentplastic shell 40 surfaces.

The above is merely preferred embodiment of the present invention, only is illustrative for the purpose of the present invention, and nonrestrictive.Those skilled in the art is understood, and in spirit that claim of the present invention limited and scope, can carry out many changes to it, revise, in addition equivalent, but all will fall in protection scope of the present invention.

Claims (3)

1. an electronic equipment plastic shell method for cleaning surface is characterized in that comprising the following steps:

Preparation solid state medium step, with at normal temperatures or the heating back be the gas of gaseous state, be prepared into a solid state medium with low temperature or high pressure mode;

Produce solid state medium particle step, utilize the pneumatic supply of high pressure to spray towards this solid state medium with high velocity air, and form several solid state medium particles, and the speed of the high velocity air after producing is fast to 3 overtones for O.5 through a spray nozzle device; And

The high-speed impact step; With the jet surface of the high velocity air that carries said solid state medium particle towards the electronic equipment plastic shell; Make said solid state medium particle high speed bump plastic shell surface and vaporization; A large amount of heat absorptions during with vaporization are given low temperature brittleness with oil stain, impurity and the pollutant on plastic shell surface, and by high velocity gas stream, accomplish cleaning.

2. electronic equipment plastic shell method for cleaning surface according to claim 1 is characterized in that: described gas is carbon dioxide (CO₂), argon gas (Ar), nitrogen (N₂) or helium (He).

3. electronic equipment plastic shell method for cleaning surface according to claim 1 and 2 is characterized in that: the diameter of described solid state medium particle is between 1 μ m to 300 μ m.

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