CN102211752A

Movatterモバイル変換

Info

Publication number: CN102211752A
Application number: CN2010101419245A
Authority: CN
Inventors: 黄松辉; 蓝纬洲; 林胜隆
Original assignee: E Ink Holdings Inc
Current assignee: E Ink Holdings Inc
Priority date: 2010-04-08
Filing date: 2010-04-08
Publication date: 2011-10-12

Abstract

本发明提供一种驱动元件、驱动元件阵列模组及其结构。此驱动元件包括第一悬梁臂组、第二悬梁臂组及导电悬梁臂组。向第一悬梁臂组与第二悬梁臂组之间时施加一电位差或同极性电位时，第一悬梁臂组因为其受电场力大于其本身形变的临界力，第一悬梁臂组移动并接触到导电悬梁臂组，让导电悬梁臂组拥有和第一悬梁臂组相同的电位。当第一悬梁臂组与第二悬梁臂组之间电场力小于第一悬梁臂组本身形变的临界力时，第一悬梁臂组恢复到原来的形状。

The present invention provides a driving element, a driving element array module and a structure thereof. The driving element includes a first cantilever arm group, a second cantilever arm group and a conductive cantilever arm group. When a potential difference or a same-polarity potential is applied between the first cantilever arm group and the second cantilever arm group, the first cantilever arm group moves and contacts the conductive cantilever arm group because the electric field force on the first cantilever arm group is greater than the critical force of its own deformation, so that the conductive cantilever arm group has the same potential as the first cantilever arm group. When the electric field force between the first cantilever arm group and the second cantilever arm group is less than the critical force of the first cantilever arm group's own deformation, the first cantilever arm group returns to its original shape.

Description

Translated fromChinese

驱动元件、驱动元件阵列模组及其结构Drive element, drive element array module and its structure

技术领域technical field

本发明涉及一种驱动元件，且特别涉及一种新型的驱动元件及驱动元件阵列模组及该驱动元件阵列模组的结构。The invention relates to a driving element, and in particular to a novel driving element, a driving element array module and a structure of the driving element array module.

背景技术Background technique

传统的薄膜晶体管制作工艺中，主要都以无机材料硅、锗为主，主要原因在于无机材料与有机半导体相比，其载子迁移率(Mobility)相差达三个级别以上，所以多数的主动式显示器都是以无机半导体特别是非晶硅(a-Si)薄膜晶体管作为驱动元件。由于非晶硅(a-Si)薄膜晶体管具有控制像素信号传递功能、低温制作工艺等优点，以非晶硅(a-Si)薄膜晶体管作为驱动元件是目前市场上的主流。In the traditional manufacturing process of thin film transistors, inorganic materials such as silicon and germanium are mainly used. The main reason is that compared with organic semiconductors, the carrier mobility (Mobility) of inorganic materials differs by more than three levels, so most active transistors Displays use inorganic semiconductors, especially amorphous silicon (a-Si) thin film transistors as driving elements. Since amorphous silicon (a-Si) thin film transistors have the advantages of controlling pixel signal transmission function and low-temperature manufacturing process, using amorphous silicon (a-Si) thin film transistors as driving components is currently the mainstream in the market.

然而，为了搭载反应时间更快的显示介质以及更复杂的信号处理，高开关电流比、载子迁移率或是省电的需求，都是下一代的驱动元件所需具备的。目前虽然有些改善驱动元件特性的方式，如不同掺杂浓度的化合物半导体，低温制作工艺的多晶硅薄膜晶体管等，但仍因设备成本、良率的问题等等而不能有效地针对前述的需求进行改善。However, in order to carry display media with faster response time and more complex signal processing, high switching current ratio, carrier mobility or power saving requirements are all required for the next generation of driving components. At present, although there are some ways to improve the characteristics of driving elements, such as compound semiconductors with different doping concentrations, polysilicon thin-film transistors with low-temperature manufacturing process, etc., they still cannot effectively meet the aforementioned requirements due to equipment cost and yield problems. .

发明内容Contents of the invention

针对上述问题，本发明的目的就是在提供一种解决上述问题的驱动元件。In view of the above problems, the object of the present invention is to provide a driving element that solves the above problems.

本发明的再一目的是提供上述驱动元件形成的阵列模组。Another object of the present invention is to provide an array module formed by the above driving elements.

本发明提出一种驱动元件，其包括第一悬梁臂组、第二悬梁臂组及导电悬梁臂组。向第一悬梁臂组与第二悬梁臂组之间施加一个电位差或同极性电位时，第一悬梁臂组因为其受电场力大于其本身形变的临界力，第一悬梁臂组移动并接触到该导电悬梁臂组，让该导电悬梁臂组拥有和第一悬梁臂组一样的电位。当第一悬梁臂组与第二悬梁臂组之间电场力小于第一悬梁臂组本身形变的临界力时，第一悬梁臂组回复到原来的形状。The invention provides a driving element, which includes a first cantilever arm group, a second cantilever arm group and a conductive cantilever arm group. When a potential difference or the same polarity potential is applied between the first cantilever arm group and the second cantilever arm group, because the electric field force of the first cantilever arm group is greater than its own deformation critical force, the first cantilever arm group moves and contact with the conductive cantilever arm group, so that the conductive cantilever arm group has the same potential as the first cantilever arm group. When the electric field force between the first cantilever arm group and the second cantilever arm group is smaller than the critical force for deformation of the first cantilever arm group, the first cantilever arm group returns to its original shape.

在本发明的较佳实施例中，上述的第一悬梁臂组包括第一悬梁臂及第一悬梁臂支撑点，所述第一悬梁臂支撑点位于第一悬梁臂的一端，且其较宽于第一悬梁臂；上述的导电悬梁臂组包括导电悬梁臂及导电悬梁臂支撑点，导电悬梁臂呈弯折状且延伸于导电悬梁支撑点，导电悬梁臂一端朝向第一悬梁臂弯折；上述的第二悬梁臂组包括第二悬梁臂及位于第二悬梁臂两端之第二悬梁臂支撑点，且第二悬梁臂支撑点较宽于第二悬梁臂。In a preferred embodiment of the present invention, the above-mentioned first cantilever arm group includes a first cantilever arm and a first cantilever arm support point, the first cantilever arm support point is located at one end of the first cantilever arm, and it is wider On the first cantilever arm; the above-mentioned conductive cantilever arm group includes a conductive cantilever arm and a conductive cantilever arm support point, the conductive cantilever arm is bent and extends at the conductive cantilever support point, and one end of the conductive cantilever arm is bent toward the first cantilever arm; The above-mentioned second cantilever arm group includes a second cantilever arm and a second cantilever arm support point located at two ends of the second cantilever arm, and the second cantilever arm support point is wider than the second cantilever arm.

在本发明的较佳实施例中，上述的第一悬梁臂、导电悬梁臂及第二悬梁臂在初始状态下皆是悬空的状态。In a preferred embodiment of the present invention, the above-mentioned first cantilever arm, conductive cantilever arm and second cantilever arm are all suspended in the initial state.

在本发明的较佳实施例中，上述的导电悬梁臂组设于第一、第二悬梁臂组之间，该第一悬梁臂及第二悬梁臂之间施加一个电位差时，第一悬梁臂向第二悬梁臂方向移动并接触导电悬梁臂。In a preferred embodiment of the present invention, the above-mentioned conductive cantilever arm group is arranged between the first and second cantilever arm groups. When a potential difference is applied between the first cantilever arm and the second cantilever arm, the first cantilever arm The arm moves toward the second cantilever arm and contacts the conductive cantilever arm.

在本发明的较佳实施例中，上述的第一悬梁臂组设于导电悬梁臂组与第二悬梁臂组之间，向第一悬梁臂组与第二悬梁臂组施加同极性电位时，第一悬梁臂向远离第二悬梁臂的方向移动并接触导电悬梁臂。In a preferred embodiment of the present invention, the above-mentioned first cantilever arm group is arranged between the conductive cantilever arm group and the second cantilever arm group, when the same polarity potential is applied to the first cantilever arm group and the second cantilever arm group , the first cantilever arm moves away from the second cantilever arm and contacts the conductive cantilever arm.

本发明还提出一种驱动元件，其包括第一悬梁臂组、第二悬梁臂组及设于第一、第二悬梁臂组之间的导电悬梁臂组，当第一悬梁臂组与该第二悬梁臂组之间具有的电位差小于一个默认值时，第一悬梁臂组与导电悬梁臂组不相接触，而当电位差达到此默认值时，第一悬梁臂组与导电悬梁臂组相接触以使第一悬梁臂组与导电悬梁臂组具有相同电位。The present invention also proposes a driving element, which includes a first cantilever arm group, a second cantilever arm group, and a conductive cantilever arm group arranged between the first and second cantilever arm groups. When the first cantilever arm group and the second cantilever arm group When the potential difference between the two cantilever arm groups is less than a default value, the first cantilever arm group is not in contact with the conductive cantilever arm group, and when the potential difference reaches the default value, the first cantilever arm group and the conductive cantilever arm group contact so that the first cantilever arm set and the conductive cantilever arm set have the same potential.

在本发明的较佳实施例中，上述的第一悬梁臂组包括第一悬梁臂及第一悬梁臂支撑点，所述第一悬梁臂支撑点位于第一悬梁臂的一端，且其较宽于第一悬梁臂；上述的导电悬梁臂组包括导电悬梁臂及导电悬梁臂支撑点，所述导电悬梁臂呈弯折状且延伸于导电悬梁支撑点，导电悬梁臂一端朝向第一悬梁臂弯折；上述的第二悬梁臂组包括第二悬梁臂及位于第二悬梁臂两端的第二悬梁臂支撑点，且第二悬梁臂支撑点较宽于第二悬梁臂。In a preferred embodiment of the present invention, the above-mentioned first cantilever arm group includes a first cantilever arm and a first cantilever arm support point, the first cantilever arm support point is located at one end of the first cantilever arm, and it is wider On the first cantilever arm; the above-mentioned conductive cantilever arm group includes a conductive cantilever arm and a conductive cantilever arm support point, the conductive cantilever arm is bent and extends at the conductive cantilever support point, and one end of the conductive cantilever arm is bent toward the first cantilever arm fold; the above-mentioned second cantilever arm group includes a second cantilever arm and a second cantilever arm support point located at two ends of the second cantilever arm, and the second cantilever arm support point is wider than the second cantilever arm.

本发明又提供包含上述驱动元件的阵列模组，其包括基板、设于基板上的多个上述驱动元件、至少一个扫描线组和至少一个信号线组，该些扫描线组及信号线组与多个驱动元件电连接。The present invention further provides an array module comprising the above-mentioned driving elements, which includes a substrate, a plurality of the above-mentioned driving elements arranged on the substrate, at least one scanning line group and at least one signal line group, and these scanning line groups and signal line groups are related to the The plurality of driving elements are electrically connected.

在本发明的较佳实施例中，上述的每个扫描线组包括多条扫描线，以分别连接位于同一行的多个驱动元件的第二悬梁臂组。In a preferred embodiment of the present invention, each of the above scan line groups includes a plurality of scan lines for respectively connecting the second cantilever arm groups of the plurality of driving elements in the same row.

在本发明的较佳实施例中，上述的每个信号线组包括多条信号线，以分别连接位于同一列的多个驱动元件的第一悬梁臂组。In a preferred embodiment of the present invention, each of the above signal line groups includes a plurality of signal lines for respectively connecting the first cantilever arm groups of the plurality of driving elements in the same column.

在本发明的较佳实施例中，当连接于每一上述驱动元件的扫描线和信号线导通时，驱动元件的第一悬梁臂及第二悬梁臂之间会形成一个电位差或第一悬梁臂及第二悬梁臂施加有同极性电位。In a preferred embodiment of the present invention, when the scanning line and signal line connected to each of the above-mentioned driving elements are turned on, a potential difference or a first cantilever arm will be formed between the first cantilever arm and the second cantilever arm of the driving element Potentials of the same polarity are applied to the cantilever arm and the second cantilever arm.

本发明还提供前述驱动元件的阵列模组的结构，其包括依次形成的基板、第一金属层、第一绝缘层、第二金属层、第二绝缘层、牺牲层及悬梁臂。The present invention also provides the structure of the array module of the driving element, which includes a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a sacrificial layer and a cantilever arm formed in sequence.

在本发明的较佳实施例中，上述的牺牲层及第二绝缘层上开有接触孔洞，该悬梁臂通过接触孔洞与第二金属层图形接触导通。In a preferred embodiment of the present invention, a contact hole is opened on the sacrificial layer and the second insulating layer, and the cantilever arm is in contact with the pattern of the second metal layer through the contact hole.

本发明所述的驱动元件及阵列模组结合了主动式驱动元件的设计和微机电系统的原理。因为不须要以硅作为半导体层，所以拥有许多非晶硅薄膜晶体管所没有的优点，例如高载子迁移率使其可以应用在更高速的处理系统，如影像处理，无漏电流的问题使其可以具有更好的开关电流比，不但能解决非晶硅(a-Si)薄膜晶体管的一些缺点，更能够提升显示器的特性，简化制作工艺，提升良率。The driving element and the array module described in the present invention combine the design of the active driving element and the principle of the micro-electromechanical system. Because there is no need to use silicon as the semiconductor layer, it has many advantages that amorphous silicon thin film transistors do not have. For example, high carrier mobility makes it applicable to higher-speed processing systems, such as image processing, and the problem of no leakage current makes it It can have a better switching current ratio, which can not only solve some shortcomings of the amorphous silicon (a-Si) thin film transistor, but also improve the characteristics of the display, simplify the manufacturing process, and increase the yield rate.

此外，本发明所述之驱动元件及阵列模组使用低温制作工艺技术，可以减少制作工艺中问题的产生等，还能简化原有的制作工艺步骤、减少成本的支出，达到提升产能的优点，这些优点使其更具有竞争力成为下一代的驱动元件。In addition, the driving element and array module described in the present invention use low-temperature manufacturing technology, which can reduce the occurrence of problems in the manufacturing process, simplify the original manufacturing process steps, reduce cost expenditures, and achieve the advantages of increasing production capacity. These advantages make it more competitive as the next generation of drive components.

上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举实施例，并配合附图，详细说明如下。The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following specific examples, and with the accompanying drawings, are described in detail as follows.

附图说明Description of drawings

图1是本发明较佳实施方式的驱动元件的立体图。Fig. 1 is a perspective view of a driving element in a preferred embodiment of the present invention.

图2A是图1所示的驱动元件在初始状态的俯视图。FIG. 2A is a top view of the driving element shown in FIG. 1 in an initial state.

图2B是图1所示的驱动元件施加一电位差时的俯视图。FIG. 2B is a top view of the driving element shown in FIG. 1 when a potential difference is applied.

图3A是另一较佳实施方式的驱动元件在初始状态的俯视图。Fig. 3A is a top view of the driving element in an initial state of another preferred embodiment.

图3B是图3A所示的驱动元件施加同极性电位时的俯视图。FIG. 3B is a top view of the driving element shown in FIG. 3A when a potential of the same polarity is applied.

图4是本发明较佳实施方式的阵列模组的示意图。FIG. 4 is a schematic diagram of an array module in a preferred embodiment of the present invention.

图5A～5B是图4沿直线BB′横截面的分层制造流程示意图。5A-5B are schematic diagrams of the layered manufacturing process of the cross-section along the line BB' of FIG. 4 .

图6A～6B是图4沿直线AA′横截面的另一分层制造流程示意图。6A-6B are schematic diagrams of another layered manufacturing process of the cross-section along the line AA' of FIG. 4 .

具体实施方式Detailed ways

为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效，以下结合附图及实施例，对依据本发明提出的电子装置其具体实施方式、结构、特征及其功效，详细说明如后。In order to further explain the technical means and functions adopted by the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and functions of the electronic device proposed according to the present invention will be described in detail below in conjunction with the accompanying drawings and examples. back.

本发明揭露一种液晶显示器驱动元件，其结合了主动式驱动元件的设计和微机电系统(Micro-Electro-Mechanical System，MEMS)的原理，主动式驱动元件的设计主要是为了控制其相对应位置上像素的作动，而微机电系统主要是将机械上的开关阀、制动器、马达等电子集成化。The present invention discloses a liquid crystal display driving element, which combines the design of the active driving element and the principle of Micro-Electro-Mechanical System (MEMS), the design of the active driving element is mainly to control its corresponding position The actuation of the upper pixel, and the micro-electromechanical system mainly integrates the mechanical switching valves, brakes, motors and other electronics.

图1所示为本发明驱动元件100的立体图。驱动元件100包括第一悬梁臂组101、导电悬梁臂组102及第二悬梁臂组103。其中，第一悬梁臂组101可由非晶硅、任意导电的金属或合金材料制成，其包括第一悬梁臂104及第一悬梁臂支撑点107。第一悬梁臂支撑点107位于第一悬梁臂104的一端，其宽度大于第一悬梁臂104的宽度。FIG. 1 is a perspective view of adriving element 100 of the present invention. Thedriving element 100 includes a firstcantilever arm group 101 , a conductivecantilever arm group 102 and a secondcantilever arm group 103 . Wherein, the firstcantilever arm group 101 can be made of amorphous silicon, any conductive metal or alloy material, and includes thefirst cantilever arm 104 and the first cantileverarm support point 107 . The first cantileverarm support point 107 is located at one end of thefirst cantilever arm 104 , and its width is greater than that of thefirst cantilever arm 104 .

导电悬梁臂组102设于第一悬梁臂组101与第二悬梁臂组103之间。导电悬梁臂组102可为任意金属或合金制成，其包括导电悬梁臂105及导电悬梁臂支撑点108。其中，导电悬梁臂105呈弯折状，其延伸于导电悬梁支撑点108，且一端朝向第一悬梁臂104弯折。The conductivecantilever arm set 102 is disposed between the firstcantilever arm set 101 and the second cantilever arm set 103 . The conductivecantilever arm set 102 can be made of any metal or alloy, and includes theconductive cantilever arm 105 and the conductive cantileverarm support point 108 . Wherein, theconductive cantilever arm 105 is in a bent shape, which extends at the supportingpoint 108 of the conductive cantilever beam, and one end is bent toward thefirst cantilever arm 104 .

第二悬梁臂组103可为非晶硅、任意导电的金属或合金材料制成，其包括第二悬梁臂106及位于第二悬梁臂106两端的两个第二悬梁臂支撑点109。第二悬梁臂支撑点109较宽于第二悬梁臂106。The secondcantilever arm group 103 can be made of amorphous silicon, any conductive metal or alloy material, and includes asecond cantilever arm 106 and two second cantileverarm support points 109 located at two ends of thesecond cantilever arm 106 . Thesupport point 109 of the second cantilever arm is wider than thesecond cantilever arm 106 .

图2A所示为本发明第一较佳实施方式的驱动元件100于初始状态的俯视图。初始状态下，第一悬梁臂104、导电悬梁臂105及第二悬梁臂106皆是悬空的状态。在工作过程中，可以施加一个电位差于第一悬梁臂104及第二悬梁臂106之间，从而使第一悬梁臂104接触导电悬梁臂105。FIG. 2A is a top view of thedriving element 100 in the initial state according to the first preferred embodiment of the present invention. In an initial state, thefirst cantilever arm 104 , theconductive cantilever arm 105 and thesecond cantilever arm 106 are all suspended. During operation, a potential difference can be applied between thefirst cantilever arm 104 and thesecond cantilever arm 106 , so that thefirst cantilever arm 104 contacts theconductive cantilever arm 105 .

如图2B所示，为本发明驱动元件100施加一个电位差时的俯视图。当施加一个电位差于第一悬梁臂104及第二悬梁臂106之间时，其中电信号分别由第一悬梁臂支撑点107及第二悬梁臂支撑点109传到第一悬梁臂104及第二悬梁臂106上。第一悬梁臂104因为电场的吸引力大于其本身形变的临界力而向第二悬梁臂106的方向作移动，因而接触到相邻的导电悬梁臂105，使得相邻的导电悬梁臂105和第一悬梁臂104发生短路，因而让相邻的导电悬梁臂105拥有和第一悬梁臂104一样的电位。当第一悬梁臂104及第二悬梁臂106之间的电位差所产生的电场力小于第一悬梁臂104本身形变的临界力时，此时第一悬梁臂组101本身欲回复原始状态的拉应力会将第一悬梁臂104回弹到原来的形状，以上即构成一个微机电开关(MEMS switch)元件。As shown in FIG. 2B , it is a top view when a potential difference is applied to the drivingelement 100 of the present invention. When a potential difference is applied between thefirst cantilever arm 104 and thesecond cantilever arm 106, electric signals are transmitted to thefirst cantilever arm 104 and the second cantileverarm support point 107 and the second cantileverarm support point 109 respectively. Twocantilever arms 106 are on. Thefirst cantilever arm 104 moves toward thesecond cantilever arm 106 because the attractive force of the electric field is greater than its own deformation critical force, thereby touching the adjacentconductive cantilever arm 105, so that the adjacentconductive cantilever arm 105 and thesecond cantilever arm 105 Onecantilever arm 104 is short-circuited so that the adjacentconductive cantilever arm 105 has the same potential as thefirst cantilever arm 104 . When the electric field force generated by the potential difference between thefirst cantilever arm 104 and thesecond cantilever arm 106 is smaller than the critical force for the deformation of thefirst cantilever arm 104 itself, the firstcantilever arm group 101 itself will return to the original state. The stress will spring back thefirst cantilever arm 104 to its original shape, which constitutes a MEMS switch element.

上述实施例也可以是，当上述的第一悬梁臂组101与第二悬梁臂组103之间具有的电位差小于一个默认值时，第一悬梁臂组101与导电悬梁臂组102不相接触，而当第一悬梁臂组101与第二悬梁臂组103之间具有的电位差达到默认值时，第一悬梁臂组101与导电悬梁臂组102相接触以使第一悬梁臂组101与第二悬梁臂组103具有相同的电位。In the above embodiment, when the potential difference between the firstcantilever arm group 101 and the secondcantilever arm group 103 is smaller than a default value, the firstcantilever arm group 101 is not in contact with the conductivecantilever arm group 102 , and when the potential difference between the firstcantilever arm group 101 and the secondcantilever arm group 103 reaches a default value, the firstcantilever arm group 101 is in contact with the conductivecantilever arm group 102 so that the firstcantilever arm group 101 is in contact with the conductivecantilever arm group 102 The secondcantilever arm group 103 has the same potential.

如图3A和3B所示，为本发明另一较佳实施方式的驱动元件100a于初始状态的俯视图。其中，第一悬梁臂组101a设于导电悬梁臂组102a与第二悬梁臂组103a之间。初始状态下，第一悬梁臂104a、导电悬梁臂105a及第二悬梁臂106a皆是悬空的状态。在工作过程中，可以分别在第一悬梁臂104a及第二悬梁臂106a上施加一同极性电位，从而由于第一悬梁臂104a及第二悬梁臂106a之间电场的排斥力，使第一悬梁臂104a接触导电悬梁臂105a。As shown in FIGS. 3A and 3B , it is a top view of a driving element 100 a in an initial state according to another preferred embodiment of the present invention. Wherein, the first cantilever arm group 101a is disposed between the conductive cantilever arm group 102a and the second cantilever arm group 103a. In an initial state, the first cantilever arm 104 a , the conductive cantilever arm 105 a and the second cantilever arm 106 a are all suspended. In the working process, the same polarity potential can be applied to the first cantilever arm 104a and the second cantilever arm 106a respectively, so that the first cantilever arm 104a and the second cantilever arm 106a can make the first cantilever arm Arm 104a contacts conductive cantilever arm 105a.

如图3B所示，为驱动元件100a施加同极性电位时的俯视图当第一悬梁臂104a及第二悬梁臂106a上均施加一个正电压V+或一个负电压V一，第一悬梁臂104a因为电场的排斥力大于其本身形变的临界力而向远离第二悬梁臂106a的方向作移动，因而接触到相邻的导电悬梁臂105a，使得相邻的导电悬梁臂105a和第一悬梁臂104a发生短路，因而让相邻的导电悬梁臂105a拥有和第一悬梁臂104a一样的电位。当第一悬梁臂104a及第二悬梁臂106a之间的电位差所产生的电场力小于第一悬梁臂104a本身形变的临界力时，此时第一悬梁臂组101a本身欲回复原始状态的拉应力会将第一悬梁臂104a回弹到原来的形状，以上即构成一个微机电开关(MEMS switch)元件。As shown in FIG. 3B , the top view when the same polarity potential is applied to the driving element 100a. When both the first cantilever arm 104a and the second cantilever arm 106a are applied with a positive voltage V+ or a negative voltage V-, the first cantilever arm 104a is due to The repulsive force of the electric field is greater than the critical force of its own deformation and moves away from the second cantilever arm 106a, thus touching the adjacent conductive cantilever arm 105a, so that the adjacent conductive cantilever arm 105a and the first cantilever arm 104a short circuit, thereby allowing the adjacent conductive cantilever arm 105a to have the same potential as the first cantilever arm 104a. When the electric field force generated by the potential difference between the first cantilever arm 104a and the second cantilever arm 106a is smaller than the critical force for the deformation of the first cantilever arm 104a itself, the first cantilever arm group 101a itself wants to return to the original state. The stress will spring back the first cantilever arm 104a to its original shape, which forms a MEMS switch element.

图4所示为多个上述第一实施例中的驱动元件100以阵列形式排列而形成的一个阵列模组300，其中每个驱动元件100对应液晶显示面板(图未示)上相应位置的像素。阵列模组300形成于一个基板301上。基板301由玻璃基板或其它透明基板任一种制成。阵列模组300还包括多个扫描线组302和多个信号线组303。每个扫描线组302包括多条扫描线，以分别连接位于同一行的多个驱动元件100的第二悬梁臂组103，且相邻驱动元件100通过基板301电性相连接。每个信号线组303包括多条信号线，以分别连接位于同一列的多个驱动元件100的第一悬梁臂组101。FIG. 4 shows anarray module 300 formed by arranging a plurality ofdrive elements 100 in the first embodiment above in an array, wherein eachdrive element 100 corresponds to a pixel at a corresponding position on a liquid crystal display panel (not shown). . Thearray module 300 is formed on asubstrate 301 . Thesubstrate 301 is made of glass substrate or any other transparent substrate. Thearray module 300 also includes a plurality ofscan line groups 302 and a plurality of signal line groups 303 . Eachscan line group 302 includes a plurality of scan lines for respectively connecting the secondcantilever arm groups 103 of the plurality of drivingelements 100 in the same row, and adjacent drivingelements 100 are electrically connected through thesubstrate 301 . Eachsignal line group 303 includes a plurality of signal lines for respectively connecting the firstcantilever arm groups 101 of the plurality of drivingelements 100 in the same column.

当于这个驱动元件100的第一悬梁臂104及第二悬梁臂106之间形成一电位差时(例如：连接于驱动元件100的扫描线和信号线导通时)，会形成一个电位差于这个驱动元件100的第一悬梁臂104及第二悬梁臂106之间。其中，电信号分别由第一悬梁臂支撑点107及第二悬梁臂支撑点109传到第一悬梁臂104及第二悬梁臂106上。第一悬梁臂104因为电场的吸引力大于第一悬梁臂104本身形变的临界力而向第二悬梁臂106的方向作移动，因而接触到相邻的导电悬梁臂105，使得相邻的导电悬梁臂105和第一悬梁臂104发生短路，因而让相邻的导电悬梁臂105拥有和第一悬梁臂104一样的电位。当第一悬梁臂104及第二悬梁臂106之间的电位差为0V，或其间的电位差所造成的电场吸引力小于第一悬梁臂104本身形变的临界力(例如：设计使连接于驱动元件100的扫描线和信号线未导通时处于同样电位或两者间的电位差小于一个特定值)，则第一悬梁臂104和第二悬梁臂106的电场吸引力会降低，因此第一悬梁臂组101本身欲回复为原始状态的拉应力就会将第一悬梁臂104回弹到原来的形状。从而，根据驱动元件100连接的扫描线和信号线的通断，控制其相对应位置上像素的作动。When a potential difference is formed between thefirst cantilever arm 104 and thesecond cantilever arm 106 of the driving element 100 (for example: when the scanning line and the signal line connected to the drivingelement 100 are turned on), a potential difference between Between thefirst cantilever arm 104 and thesecond cantilever arm 106 of the drivingelement 100 . Wherein, the electric signal is transmitted to thefirst cantilever arm 104 and thesecond cantilever arm 106 respectively from the first cantileverarm support point 107 and the second cantileverarm support point 109 . Thefirst cantilever arm 104 moves toward the direction of thesecond cantilever arm 106 because the attractive force of the electric field is greater than the critical force of deformation of thefirst cantilever arm 104 itself, thereby touching the adjacentconductive cantilever arm 105, so that the adjacentconductive cantilever arm 104 Thearm 105 and thefirst cantilever arm 104 are shorted, thereby allowing the adjacentconductive cantilever arm 105 to have the same potential as thefirst cantilever arm 104 . When the potential difference between thefirst cantilever arm 104 and thesecond cantilever arm 106 is 0V, or the electric field attraction caused by the potential difference therebetween is smaller than the critical force of the deformation of thefirst cantilever arm 104 itself (for example: the design connects to the drive The scanning line and the signal line of theelement 100 are at the same potential or the potential difference between the two is less than a specific value when they are not turned on), then the electric field attraction of thefirst cantilever arm 104 and thesecond cantilever arm 106 will decrease, so the first The tensile stress of the cantilever arm set 101 itself to return to the original state will make thefirst cantilever arm 104 rebound to the original shape. Therefore, according to the on-off of the scanning line and the signal line connected to the drivingelement 100 , the action of the pixel at the corresponding position is controlled.

可以理解，阵列模组300也可由驱动元件100a以阵列形式排列而形成。其中，驱动元件100a利用第一悬梁臂104a及第二悬梁臂106a之间的排斥力来实现其功能。It can be understood that thearray module 300 can also be formed by arranging the driving elements 100a in an array. Wherein, the driving element 100a utilizes the repulsive force between the first cantilever arm 104a and the second cantilever arm 106a to realize its function.

图5A～5B所示为图4沿虚线BB′横截面的分层制造流程图，用以说明第二悬梁臂106的制造流程。首先于玻璃基板上400镀上第一金属层(图未示)，通过黄光蚀刻制作工艺之后形成第一金属层图形401，该第一金属层可为任意导电的金属或合金，如银(Ag)、铬(Cr)、钼铬(MoCr)合金、铝钕(AlNd)合金、镍硼(NiB)合金等。接着在第一金属层图形401上镀上第一绝缘层402，第一绝缘层402可为二氧化硅(SiO2)、氮化硅(SiNx)等。再来，于第一绝缘层402上形成第二金属层(图未示)，通过黄光蚀刻制作工艺之后形成第二金属层图形403，第二金属层也可为任意导电金属或合金，如银、铬、钼铬合金、铝钕合金、镍硼合金等。第二金属层图形403上再镀上一第二绝缘层404，第二绝缘层404可为二氧化硅、氮化硅等。在本实施例中，镀上第二绝缘层404之后再形成一牺牲层405，牺牲层405可为钼、聚合物(polymer)等。之后，在牺牲层405及第二绝缘层404上挖出接触孔洞4051，再形成一悬梁臂图形406于牺牲层405上，悬梁臂图形406可为非晶硅、任意导电的金属或合金等。悬梁臂图形406通过接触孔洞与第二金属层图形403做接触导通，最后将牺牲层405移除(release)，即形成一个微机电开关(MEMS switch)元件。而此整个制作流程，可以由六道光罩完成。FIGS. 5A-5B are a layered manufacturing flow diagram of the cross-section along the dotted line BB′ in FIG. 4 to illustrate the manufacturing process of thesecond cantilever arm 106 . First, the first metal layer (not shown) is plated on theglass substrate 400, and the firstmetal layer pattern 401 is formed after the yellow photolithography process. The first metal layer can be any conductive metal or alloy, such as silver ( Ag), chromium (Cr), molybdenum chromium (MoCr) alloy, aluminum neodymium (AlNd) alloy, nickel boron (NiB) alloy, etc. Then, a first insulatinglayer 402 is plated on the firstmetal layer pattern 401, and the first insulatinglayer 402 can be silicon dioxide (SiO2), silicon nitride (SiNx) or the like. Next, a second metal layer (not shown) is formed on the first insulatinglayer 402, and the secondmetal layer pattern 403 is formed after the photolithography process. The second metal layer can also be any conductive metal or alloy, such as silver , chromium, molybdenum chromium alloy, aluminum neodymium alloy, nickel boron alloy, etc. A second insulatinglayer 404 is plated on the secondmetal layer pattern 403, and the second insulatinglayer 404 can be silicon dioxide, silicon nitride, or the like. In this embodiment, asacrificial layer 405 is formed after the second insulatinglayer 404 is plated, and thesacrificial layer 405 can be molybdenum, polymer, or the like. Afterwards, acontact hole 4051 is dug out on thesacrificial layer 405 and the second insulatinglayer 404, and then acantilever pattern 406 is formed on thesacrificial layer 405. Thecantilever pattern 406 can be amorphous silicon, any conductive metal or alloy, etc. Thecantilever arm pattern 406 is in contact with the secondmetal layer pattern 403 through the contact hole, and finally thesacrificial layer 405 is removed to form a MEMS switch element. The entire production process can be completed by six masks.

图6A～6B所示为图4沿直线AA′的横截面的另一制造流程图。其与图5的区别在于，在图5的基础上，增加了一个导电透明层503于第二绝缘层404上。首先于玻璃基板上400镀上第一金属层(图未示)，通过黄光蚀刻制作工艺之后形成第一金属层图形401，该第一金属层可为任意导电的金属或合金，如银(Ag)、铬(Cr)、钼铬(MoCr)合金、铝钕(AlNd)合金、镍硼(NiB)合金等。接着在第一金属层图形401上镀上第一绝缘层402，第一绝缘层402可为二氧化硅(SiO2)、氮化硅(SiNx)等。再来，在第一绝缘层402上形成第二金属层(图未示)，通过黄光蚀刻制作工艺之后形成第二金属层图形403，第二金属层也可为任意导电金属或合金，如银、铬、钼铬合金、铝钕合金、镍硼合金等。第二金属层图形403上再镀上第二绝缘层404，第二绝缘层404可为二氧化硅、氮化硅等。再于第二绝缘层404上形成导电透明层503，导电透明层503可以由导电透明材料氧化铟锡(Tin doped Indium Oxide，ITO)、铟锌氧化物(Indium Zinc Oxide，IZO)、氧化锌(ZnO)任一种制成。然后，在导电透明层503上再形成一牺牲层405，牺牲层405可为钼、聚合物(polymer)等。之后，在牺牲层405及导电透明层503上挖出接触孔洞4051，再形成一个悬梁臂图形406于牺牲层405上，悬梁臂图形406可为非晶硅、任意导电的金属或合金等。悬梁臂图形406通过接触孔洞与透明导电层503做接触导通，最后将牺牲层405移除(release)，即形成一个微机电开关(MEMS switch)元件。6A-6B show another manufacturing flow chart of the cross-section along the line AA' of FIG. 4 . The difference from FIG. 5 is that, on the basis of FIG. 5 , a conductivetransparent layer 503 is added on the second insulatinglayer 404 . First, the first metal layer (not shown) is plated on theglass substrate 400, and the firstmetal layer pattern 401 is formed after the yellow photolithography process. The first metal layer can be any conductive metal or alloy, such as silver ( Ag), chromium (Cr), molybdenum chromium (MoCr) alloy, aluminum neodymium (AlNd) alloy, nickel boron (NiB) alloy, etc. Then, a first insulatinglayer 402 is plated on the firstmetal layer pattern 401, and the first insulatinglayer 402 can be silicon dioxide (SiO2), silicon nitride (SiNx) or the like. Next, a second metal layer (not shown) is formed on the first insulatinglayer 402, and the secondmetal layer pattern 403 is formed after the photolithography process. The second metal layer can also be any conductive metal or alloy, such as silver , chromium, molybdenum chromium alloy, aluminum neodymium alloy, nickel boron alloy, etc. A second insulatinglayer 404 is plated on the secondmetal layer pattern 403, and the second insulatinglayer 404 can be silicon dioxide, silicon nitride, or the like. Then form a conductivetransparent layer 503 on the second insulatinglayer 404, the conductivetransparent layer 503 can be made of conductive transparent material indium tin oxide (Tin doped Indium Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), zinc oxide ( ZnO) made of either. Then, asacrificial layer 405 is formed on the conductivetransparent layer 503 , and thesacrificial layer 405 can be molybdenum, polymer, or the like. Afterwards, acontact hole 4051 is dug out on thesacrificial layer 405 and the conductivetransparent layer 503, and acantilever pattern 406 is formed on thesacrificial layer 405. Thecantilever pattern 406 can be amorphous silicon, any conductive metal or alloy, etc. Thecantilever pattern 406 is in contact with the transparentconductive layer 503 through the contact hole, and finally thesacrificial layer 405 is removed to form a MEMS switch element.

可以理解，本发明的驱动元件100及阵列模组300可应用在所有显示器上当作开关，如电泳式显示器、液晶显示器、粉体移动显示器、电湿润式显示器(EWD)、胆固醇液晶(Ch-LCD)、有机无机材料发光显示器(OLED、LED)、微机电显示器(MEMS display)等。It can be understood that thedrive element 100 and thearray module 300 of the present invention can be used as switches on all displays, such as electrophoretic displays, liquid crystal displays, powder moving displays, electrowetting displays (EWD), cholesteric liquid crystal (Ch-LCD) ), organic and inorganic material light-emitting displays (OLED, LED), micro-electromechanical displays (MEMS display), etc.

综上所述，本发明所述的驱动元件100及阵列模组300结合了主动式驱动元件的设计和微机电系统的原理，因为不需要以硅作为半导体层，所以拥有许多非晶硅薄膜晶体管所没有的优点，例如高载子迁移率使其可以应用在更高速的处理系统，如影像处理，无漏电流的问题使其可以具有更好的开关电流比。本发明所述的驱动元件制作方法是使用低温制作工艺技术，可以减少制作工艺中问题的产生等，还能简化原有的制作工艺步骤、减少成本的支出，达到提升产能的优点，这些优点使其更具有竞争力成为下一代的驱动元件。To sum up, the drivingelement 100 and thearray module 300 of the present invention combine the design of the active driving element and the principle of the micro-electro-mechanical system. Because silicon is not used as the semiconductor layer, there are many amorphous silicon thin film transistors The advantages that it does not have, such as high carrier mobility, can be applied to higher speed processing systems, such as image processing, and the problem of no leakage current makes it possible to have a better on-off current ratio. The manufacturing method of the driving element described in the present invention uses a low-temperature manufacturing process technology, which can reduce the occurrence of problems in the manufacturing process, simplify the original manufacturing process steps, reduce cost expenditures, and achieve the advantages of increasing production capacity. These advantages make It is more competitive to become the next generation of drive components.

以上所述，仅是本发明的实施例而已，并非对本发明作任何形式上的限制，虽然本发明已以实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。The above description is only an embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with the embodiment, it is not intended to limit the present invention. Without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or be modified into equivalent embodiments with equivalent changes, but if it does not deviate from the technical solution of the present invention, the technical essence of the present invention can be used for the above Any simple modifications, equivalent changes and modifications made in the embodiments still fall within the scope of the technical solution of the present invention.

Claims

Translated fromChinese

2.根据权利要求1所述的驱动元件，其特征在于，该第一悬梁臂组包括一个第一悬梁臂及一个第一悬梁臂支撑点，所述第一悬梁臂支撑点位于第一悬梁臂的一端，且该第一悬梁臂支撑点宽于第一悬梁臂；该导电悬梁臂组包括一个导电悬梁臂及一个导电悬梁臂支撑点，所述导电悬梁臂呈弯折状且延伸于该导电悬梁支撑点，该导电悬梁臂一端朝向第一悬梁臂弯折；该第二悬梁臂组包括第二悬梁臂及分别位于该第二悬梁臂两端的第二悬梁臂支撑点，且所述第二悬梁臂支撑点宽于第二悬梁臂。2. The driving element according to claim 1, wherein the first cantilever arm group comprises a first cantilever arm and a first cantilever arm support point, and the first cantilever arm support point is located at the first cantilever arm one end of the first cantilever arm, and the supporting point of the first cantilever arm is wider than the first cantilever arm; A cantilever support point, one end of the conductive cantilever arm is bent towards the first cantilever arm; the second cantilever arm group includes a second cantilever arm and a second cantilever arm support point respectively located at two ends of the second cantilever arm, and the second cantilever arm group The support point of the cantilever arm is wider than the second cantilever arm.

3.根据权利要求2所述的驱动元件，其特征在于，该第一悬梁臂、导电悬梁臂及第二悬梁臂在初始状态下皆是悬空的状态。3 . The driving element according to claim 2 , wherein the first cantilever arm, the conductive cantilever arm and the second cantilever arm are all suspended in an initial state. 4 .

4.根据权利要求2所述的驱动元件，其特征在于，该导电悬梁臂组设于该第一、第二悬梁臂组之间，该第一悬梁臂及第二悬梁臂之间施加一电位差时，第一悬梁臂向第二悬梁臂方向移动并接触该导电悬梁臂。4. The driving element according to claim 2, wherein the conductive cantilever arm group is arranged between the first and second cantilever arm groups, and a potential is applied between the first cantilever arm and the second cantilever arm group When there is a difference, the first cantilever arm moves toward the second cantilever arm and contacts the conductive cantilever arm.

5.根据权利要求2所述的驱动元件，其特征在于，该第一悬梁臂组设于该导电悬梁臂组与第二悬梁臂组之间，向该第一悬梁臂组与第二悬梁臂组施加同极性电位时，该第一悬梁臂向远离第二悬梁臂的方向移动并接触该导电悬梁臂。5. The driving element according to claim 2, wherein the first cantilever arm group is disposed between the conductive cantilever arm group and the second cantilever arm group, and faces the first cantilever arm group and the second cantilever arm group When a potential of the same polarity is applied to the group, the first cantilever arm moves away from the second cantilever arm and contacts the conductive cantilever arm.

6.一种驱动元件，其特征在于包括：一个第一悬梁臂组、一个第二悬梁臂组及设于第一、第二悬梁臂组之间的一个导电悬梁臂组，当该第一悬梁臂组与该第二悬梁臂组之间具有的电位差小于默认值时，该第一悬梁臂组与该导电悬梁臂组不相接触，而当该电位差达到该默认值时，该第一悬梁臂组与该导电悬梁臂组相接触以使该第一悬梁臂组与该导电悬梁臂组具有相同电位。6. A driving element, characterized in that it comprises: a first cantilever arm group, a second cantilever arm group and a conductive cantilever arm group arranged between the first and second cantilever arm groups, when the first cantilever arm group When the potential difference between the arm group and the second cantilever arm group is smaller than a default value, the first cantilever arm group is not in contact with the conductive cantilever arm group, and when the potential difference reaches the default value, the first cantilever arm group The cantilever arm set is in contact with the conductive cantilever arm set so that the first cantilever arm set has the same potential as the conductive cantilever arm set.

7.根据权利要求6所述的驱动元件，其特征在于，该第一悬梁臂组包括一个第一悬梁臂及一个第一悬梁臂支撑点，所述第一悬梁臂支撑点位于第一悬梁臂的一端，且该第一悬梁臂支撑点宽于第一悬梁臂；该导电悬梁臂组包括一个导电悬梁臂及一个导电悬梁臂支撑点，所述导电悬梁臂呈弯折状且延伸于该导电悬梁支撑点，导电悬梁臂一端朝向第一悬梁臂弯折；该第二悬梁臂组包括第二悬梁臂及位于第二悬梁臂两端的第二悬梁臂支撑点，且该第二悬梁臂支撑点较宽于第二悬梁臂。7. The driving element according to claim 6, wherein the first cantilever arm group comprises a first cantilever arm and a first cantilever arm support point, and the first cantilever arm support point is located at the first cantilever arm one end of the first cantilever arm, and the supporting point of the first cantilever arm is wider than the first cantilever arm; A cantilever support point, one end of the conductive cantilever arm is bent towards the first cantilever arm; the second cantilever arm group includes a second cantilever arm and a second cantilever arm support point at both ends of the second cantilever arm, and the second cantilever arm support point Wider than the second cantilever arm.

8.根据权利要求7所述的驱动元件，其特征在于，该第一悬梁臂、导电悬梁臂及第二悬梁臂在初始状态下皆是悬空的状态。8 . The driving element according to claim 7 , wherein the first cantilever arm, the conductive cantilever arm and the second cantilever arm are all suspended in an initial state.

9.一种包含如权利要求1所述驱动元件的阵列模组，其特征在于其包括：一个基板、多个所述驱动元件设于该基板上、至少一个扫描线组和至少一个信号线组，所述扫描线组及信号线组与所述多个驱动元件电连接。9. An array module comprising driving elements according to claim 1, characterized in that it comprises: a substrate, a plurality of said driving elements are arranged on the substrate, at least one scanning line group and at least one signal line group , the scanning line group and the signal line group are electrically connected to the plurality of driving elements.

10.根据权利要求9所述所述的阵列模组，其特征在于，该每个扫描线组包括多条扫描线，以分别连接位于同一行的多个驱动元件的第二悬梁臂组。10 . The array module according to claim 9 , wherein each scan line group comprises a plurality of scan lines for respectively connecting the second cantilever arm groups of the plurality of driving elements in the same row. 11 .

11.根据权利要求9所述所述的阵列模组，其特征在于，该每个信号线组包括多条信号线，以分别连接位于同一列的多个驱动元件的第一悬梁臂组。11 . The array module according to claim 9 , wherein each signal wire group comprises a plurality of signal wires for respectively connecting the first cantilever arm groups of the plurality of driving elements in the same column.

12.根据权利要求9所述所述的阵列模组，其特征在于，当连接于每一个驱动元件的扫描线和信号线导通时，该驱动元件的第一悬梁臂及第二悬梁臂之间会形成一个电位差或第一悬梁臂及第二悬梁臂施加有同极性电位。12. The array module according to claim 9, wherein when the scanning line and the signal line connected to each driving element are turned on, the first cantilever arm and the second cantilever arm of the driving element A potential difference will be formed between them or the same polarity potential will be applied to the first cantilever arm and the second cantilever arm.

13.一种包含如权利要求1所述驱动元件的阵列模组的结构，其包括依次形成的一个基板、一个第一金属层、一个第一绝缘层、一个第二金属层、一个第二绝缘层、一个牺牲层及一个悬梁臂，其中该第一金属层、第一绝缘层、第二金属层、第二绝缘层、牺牲层及悬梁臂形成至少一个驱动元件。13. A structure comprising an array module of the driving element as claimed in claim 1, comprising a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer formed in sequence layer, a sacrificial layer and a cantilever arm, wherein the first metal layer, the first insulating layer, the second metal layer, the second insulating layer, the sacrificial layer and the cantilever arm form at least one driving element.

14.根据权利要求13所述的阵列模组的结构，其特征在于，该牺牲层及第二绝缘层上开有接触孔洞，该悬梁臂通过接触孔洞与该第二金属层图形接触导通。14 . The structure of the array module according to claim 13 , wherein contact holes are opened on the sacrificial layer and the second insulating layer, and the cantilever arm is in contact with the pattern of the second metal layer through the contact holes.