CN102200259A - Combined-type backing plate for backlight module - Google Patents

Abstract

The invention discloses a combined-type backing plate for a backlight module. The backing plate comprises a first backing plate block and a second backing plate block which are independent and made of different materials; a side edge of the first backing plate block and a side edge of a second backing plate block are connected mutually; and a partial region of the first backing plate block which is adjacent to or overlapped with a luminous element is provided with a thicker thickness of other regions relative to the first backing plate block. The combined-type backing plate has one of the advantages that the backing plate is simple and easy to manufacture, and has at least one of the advantages of favorable radiating properties and mechanism strength.

Description

The combined type backboard that is used for module backlight

[technical field]

The invention relates to a kind of combined type backboard that is used for module backlight.

[background technology]

Fig. 7 is a component decomposition map, shows a kind of existing design of backlight module that U.S. Patent Publication discloses for US20080165307 number.As shown in Figure 7,module 100 backlight comprisesbackboard 102,light source 104 and 106,reflector plate 108 and LGP 110.Backboard 102 has 102a of wedge type portion andflat part 102b, and the 102a of wedge type portion is towards the direction attenuation gradually away from light source 104,106.Backboard 102 has and the consistent profile in LGP 110 bottom surfaces towards a side of LGP 110.According to above-mentioned existing design,backboard 102 uses identical materials integrally formed, so when needing a bigger backboard size, not only make comparatively difficulty and need more large-scale machining machine and tool and improve manufacturing cost, mechanism's intensity ofbackboard 102 integral body is also relatively poor and be easy to be out of shape under the high temperature simultaneously.

[summary of the invention]

The invention provides a kind of combined type backboard that is used for module backlight, this kind combined type backboard have make simple and easy, the good heat dissipation characteristics and the advantage of one at least of mechanism's intensity be provided.

Other purposes of the present invention and advantage can be further understood from the disclosed technical characterictic of the present invention.

For reaching one of above-mentioned or partly or all purposes or other purposes, one of the present invention embodiment provides a kind of combined type backboard that is used for module backlight, one first backboard block that this combined type backboard comprises independently and material is different and one second backboard block, the first backboard block and the second backboard block interconnect with a side separately, and first backboard block subregion contiguous or a superimposed light-emitting component has the thicker thickness in other zone of the relative first backboard block.

In an embodiment, the thickness of the first backboard block is towards successively decreasing away from the direction of light-emitting component.

In an embodiment, the first backboard block and the second backboard block are riveted mutually.

In an embodiment, the second backboard block has more several support portions, and a bottom side of the subregion of first backboard block vicinity or superimposed light-emitting component and a bottom side of each support portion roughly are positioned on the same horizontal plane.

In an embodiment, the second backboard block is in being formed with a kink with the first backboard block junction, and kink is riveted on the first backboard block.

In an embodiment, the combined type backboard more comprises an aluminum strip and is riveted on the side that the first backboard block and the second backboard block link to each other, and aluminum strip forms at least one notch to engage a LGP.

In an embodiment, first backboard block subregion contiguous or superimposed light-emitting component forms at least one draw-in groove.

In an embodiment, the first backboard block is constituted by the aluminium extruded type material, and the second backboard block is constituted by steel.

Another embodiment of the present invention provides a kind of combined type backboard that is used for module backlight, this combined type backboard comprises independently one first backboard block, one second backboard block and one the 3rd backboard block at least, and the first backboard block and the 3rd backboard block connect a relative first side of the second backboard block and a second side respectively.The first backboard block and the 3rd backboard block are constituted by one first material, and the second backboard block is constituted by one second material, this first material is different materials with this second material, contiguous or superimposed one first light-emitting component in the subregion of the first backboard block and have the thicker thickness in other zone of the relative first backboard block.Contiguous or superimposed one second light-emitting component in the subregion of the 3rd backboard block and have the thicker thickness in other zone of relative the 3rd backboard block.

Described combined type backboard, wherein, the thickness of this first backboard block court successively decreases away from the direction of this first light-emitting component, and the thickness of the 3rd backboard block is towards successively decreasing away from the direction of this second light-emitting component.

In an embodiment, first material is the aluminium extruded type material, and second material is steel.

In sum, the combined type backboard of the present invention's embodiment has following one of them advantage at least: the backboard block that is provided with light-emitting component (thermal source) uses the aluminium or the aluminum alloy materials of the high thermal conduction characteristic of tool, middle backboard block adopts the relatively poor but lower-cost galvanized steel plain sheet of heat conductivility, can save manufacturing cost but can obviously not influence the radiating effect of backboard integral body, and can increase the structural strength of combined type backboard and not yielding under high temperature.In addition, because of the size of each backboard block less relatively, so in making or processing is handled comparatively simple and easy and do not needed large-scale machining machine and tool.

Other purposes of the present invention and advantage can be further understood from the disclosed technical characterictic of the present invention.State with other purposes, feature and advantage and can become apparent on the present invention for allowing, embodiment cited below particularly also cooperates appended graphicly, is described in detail below.

[description of drawings]

Fig. 1 is the combined type backboard schematic diagram that is used for module backlight according to one embodiment of the invention.

Fig. 2 and Fig. 3 are schematic diagram, show the mode of splicing different backboard blocks according to one embodiment of the invention.

Fig. 4 shows the member schematic diagram according to one embodiment of the invention.

Fig. 5 is the combined type backboard schematic diagram according to another embodiment of the present invention.

Fig. 6 is the combined type backboard schematic diagram according to another embodiment of the present invention.

Fig. 7 is the component decomposition map of an existing module backlight.

A light-emitting component setting area

10 combined type backboards

11 inner surfaces

12a, 12b, 14 backboard blocks

15 support portions

16 kinks

18 aluminum strips

The 18a notch

22 light-emitting components

26 draw-in grooves

28 glue frames

100 modules backlight

102 backboards

102a wedge type portion

The 102b flat part

104,106 light sources

108 reflector plates

110 LGPs

The H horizontal plane

P, Q side

The R thickened areas

[specific embodiment]

About addressing other technologies content, characteristics and effect before the present invention, in the following detailed description that cooperates with reference to graphic embodiment, can clearly present.The direction term of being mentioned in following examples, for example: upper and lower, left and right, front or rear etc. only are the directions with reference to annexed drawings.Therefore, the direction term of use is to be used for illustrating not to be to be used for limiting the present invention.

Fig. 1 is the combined type backboard schematic diagram that is used for module backlight according to one embodiment of the invention.As shown in Figure 1, combined type backboard 10 comprises onefirst backboard block 12a, onesecond backboard block 14 and one the3rd backboard block 12b, thefirst backboard block 12a and the3rd backboard block 12b connect thesecond backboard block 14 relative a first side P and a second side Q respectively, and form an inner surface 11.In an embodiment, the light-emitting component (not illustrating) of module backlight can be arranged at the light-emitting component setting area A among Fig. 1.In present embodiment, thefirst backboard block 12a and the3rd backboard block 12b are constituted by the aluminium extruded type material that can implement extrusion modling processing, for example model is the aluminium or the aluminum alloy materials of AL1000, AL3000 or AL6000 series, and thesecond backboard block 14 is constituted by steel, for example can use inferior plumbous galvanized steel plain sheet (SECC) material of electrolysis.The inferior plumbous galvanized steel plain sheet of electrolysis can be corrosion-resistant, mechanism's intensity strong and price is cheap than aluminum alloy materials, but shortcoming is that heat conductivility is relatively poor.Therefore, design by present embodiment, be provided with thebackboard block 12a of light-emitting component (thermal source), aluminium or the aluminum alloy materials that 12b makes the high thermal conduction characteristic of apparatus, and because the spread length of heat is limited, the material in centre position is to integral heat sink not influence basically, so the secondmiddle backboard block 14 can adopt the relatively poor but inferior plumbous galvanized steel plain sheet (SECC) of lower-cost electrolysis of heat conductivility, and can save manufacturing cost but can obviously not influence the radiating effect of backboard integral body, and can increase the structural strength of combined type backboard 10 and not yielding under high temperature.Therefore, the mode that present embodiment utilizes different backboard blocks to engage, except that above-mentioned advantage can be provided, because of the size of each backboard block less relatively, so in make or the processing processing on comparatively simple and easy and do not need large-scale machining machine and tool.

Fig. 2 and Fig. 3 are schematic diagram, show the mode of splicing different backboard blocks according to one embodiment of the invention.As shown in Figure 2, in an embodiment, thefirst backboard block 12a of unlike material (the3rd backboard block 12b) can rivet mutually with the second backboard block 14.Thesecond backboard block 14 is in being formed with akink 16 with thefirst backboard block 12a or the3rd backboard block 12b junction, be riveted to thefirst backboard block 12a (the3rd backboard block 12b) bykink 16, can connect different backboard blocks and form combined type backboard 10 the second backboard block 14.In addition, thesecond backboard block 14 also can haveseveral support portions 15, and thesecond backboard block 14 is supported in support portion 15.Moreover as shown in Figure 3, analuminum strip 18 can be riveted on the side that thefirst backboard block 12a, thesecond backboard block 14, the3rd backboard block 12b link to each other to improve mechanism's intensity of splicing place.In an embodiment, as shown in Figure 4,aluminum strip 18 can form at least onenotch 18a engaging a LGP (figure do not show), and the quantity ofnotch 18a and position can change arbitrarily on demand.

As shown in Figure 5, in an embodiment, contiguous or the superimposed light-emitting component 22 of the subregion R of thefirst backboard block 12a, and subregion R has a thickness thicker with respect to other zone of thefirst backboard block 12a, and the integral thickness of thefirst backboard block 12a is towards successively decreasing away from the direction of light-emitting component 22, therefore the even heat dispersing of the first backboard block 12a.In addition, formed a draw-ingroove 26 clips oneglue frame 28 because the thickness of subregion R is thicker, and becauseglue frame 28 clips are in draw-ingroove 26, but not be covered in side outside thefirst backboard block 12a, therefore the outside of thefirst backboard block 12a can be directly and air carry out heat exchange, increased area of dissipation and can improve radiating efficiency.In addition, as shown in Figure 6, in an embodiment, the bottom side of thefirst backboard block 12a (the3rd backboard block 12b) the subregion R that thickness is thicker, roughly be positioned on the same horizontal plane with the bottom side of thesupport portion 15 of thesecond backboard block 14, to improve the support strength and inner surface 11 (as Fig. 1) flatness of combined type backboard 10.

Certainly, the above-mentioned usefulness of utilizing three backboard blocks only to splice and combine to illustration does not limit fully, the visual actual demand of the quantity of backboard block, material and connected mode is changed, and for example also can only use the light path design of thefirst backboard block 12a and thesecond backboard block 14 and the one-sided light inlet of arranging in pairs or groups.

The above, only for the present invention's preferred embodiment, when the scope that can not limit the invention process with this, promptly the simple equivalent of being done according to the present patent application claim and invention description content generally changes and modifies, and all still belongs in the scope that patent of the present invention contains.Arbitrary embodiment of the present invention in addition or claim must not reached whole purposes or advantage or the characteristics that the present invention discloses.

Claims (12)

1. combined type backboard that is used for a module backlight, at least comprise independently and different one first backboard block and the one second backboard blocks of material, this first backboard block and this second backboard block interconnect with a side separately, and this first backboard block subregion contiguous or a superimposed light-emitting component has the thicker thickness in other zone of this first backboard block relatively.

2. combined type backboard as claimed in claim 1 is characterized in that: the thickness of this first backboard block is towards successively decreasing away from the direction of this light-emitting component.

3. combined type backboard as claimed in claim 1 is characterized in that: this first backboard block and this second backboard block are riveted mutually.

4. combined type backboard as claimed in claim 1, it is characterized in that: this second backboard block has more several support portions, and a bottom side of this subregion of this first backboard block vicinity or superimposed this light-emitting component and a bottom side of each those support portion roughly are positioned on the same horizontal plane.

5. combined type backboard as claimed in claim 1 is characterized in that: this second backboard block is in being formed with a kink with this first backboard block junction, and this kink is riveted on this first backboard block.

6. combined type backboard as claimed in claim 1 is characterized in that: more comprise an aluminum strip and be riveted on the side that this first backboard block and this second backboard block link to each other.

7. combined type backboard as claimed in claim 6 is characterized in that: this aluminum strip forms at least one notch to engage a LGP.

8. combined type backboard as claimed in claim 1 is characterized in that: this first backboard block this subregion contiguous or superimposed this light-emitting component forms at least one draw-in groove.

9. combined type backboard as claimed in claim 1 is characterized in that: this first backboard block is constituted by the aluminium extruded type material, and this second backboard block is constituted by steel.

10. combined type backboard that is used for a module backlight, at least comprise independently one first backboard block, one second backboard block and one the 3rd backboard block, this first backboard block and the 3rd backboard block connect a relative first side of this second backboard block and a second side respectively, wherein this first backboard block and the 3rd backboard block are constituted by one first material, this second backboard block is constituted by one second material, this first material is different materials with this second material, contiguous or superimposed one first light-emitting component in the subregion of this first backboard block and have the thicker thickness in other zone of this first backboard block relatively, and the subregion of the 3rd backboard block is contiguous or superimposed one second light-emitting component and have the thicker thickness in other zone of the 3rd backboard block relatively.

11. combined type backboard as claimed in claim 10 is characterized in that: the thickness court of this first backboard block successively decreases away from the direction of this first light-emitting component, and the thickness of the 3rd backboard block is towards successively decreasing away from the direction of this second light-emitting component.

12. combined type backboard as claimed in claim 10 is characterized in that: this first material is the aluminium extruded type material, and this second material is steel.

Images