技术领域technical field
本发明涉及微机电封装模块，特别是指一种可简化工艺且提高产品良率的微机电封装模块。The invention relates to a micro-electromechanical packaging module, in particular to a micro-electromechanical packaging module that can simplify the process and improve the product yield.
背景技术Background technique
为了提高微机电封装模块的性能，必须在封装时考虑到机械支持与环境因素如噪声干扰的问题，其中，有些微机电封装模块的构造较为特殊，以微机电麦克风为例，由芯片的下方接收外界的信号，故基板必须形成一曲折通道与微机电麦克风的芯片相通，以达到接收信号的目的。In order to improve the performance of MEMS packaged modules, mechanical support and environmental factors such as noise interference must be taken into account during packaging. Among them, some MEMS packaged modules have a special structure. Take the MEMS microphone as an example, which is received by the bottom of the chip. External signals, so the substrate must form a meandering channel to communicate with the chip of the MEMS microphone, so as to achieve the purpose of receiving signals.
以现有技术而言，基板必须由多个板体堆叠而成，才能形成出曲折通道，但是此种结构设计不仅制造成本高，同时会让基板的厚度增加，连带影响微机电封装模块的整体体积。另外还有一种设计是将导线架当作基板使用，但是在使用前必须先将镂空处填补绝缘胶，工艺同样相当复杂，并且在回焊的过程中容易变形，导致产品的良率降低。According to the existing technology, the substrate must be stacked with multiple boards to form a zigzag channel. However, this structural design not only increases the manufacturing cost, but also increases the thickness of the substrate, which affects the overall performance of the MEMS packaging module. volume. Another design is to use the lead frame as a substrate, but the hollow must be filled with insulating glue before use. The process is also quite complicated, and it is easy to deform during the reflow process, resulting in a decrease in product yield.
发明内容Contents of the invention
本发明的主要目的在于提供一种微机电封装模块，其可减少整体厚度以降低制造成本，并可简化工艺以提升产品良率。The main purpose of the present invention is to provide a MEMS packaging module, which can reduce the overall thickness to reduce the manufacturing cost, and can simplify the process to improve the product yield.
为了达成上述目的，本发明的微机电封装模块包含有一载板、一封盖、一间隔件，以及一芯片。该封盖盖合于该载板的表面，并具有一腔室与一连通外界的接收孔；该间隔件设于该载板与该封盖之间，并于内部具有一连通该腔室与该接收孔的曲折通道；该芯片设于该间隔件而对应于该曲折通道，同时位于该封盖的腔室内并与该载板电性连接，使得外界信号能够经由该封盖的接收孔与该间隔件的曲折通道而传递至该芯片。In order to achieve the above object, the MEMS packaging module of the present invention includes a carrier board, a cover, a spacer, and a chip. The cover is closed on the surface of the carrier, and has a cavity and a receiving hole communicating with the outside world; the spacer is arranged between the carrier and the cover, and has a cavity and a receiving hole inside. The meandering channel of the receiving hole; the chip is arranged on the spacer corresponding to the meandering channel, and is located in the cavity of the cover and is electrically connected with the carrier, so that external signals can pass through the receiving hole of the cover and the meandering channel. The tortuous path of the spacer is delivered to the chip.
通过上述的设计，本发明的微机电封装模块确实能够达到减少整体厚度，降低制造成本，简化制造过程，以及提升产品良率的目的。Through the above-mentioned design, the MEMS package module of the present invention can indeed reduce the overall thickness, reduce the manufacturing cost, simplify the manufacturing process, and improve the product yield.
附图说明Description of drawings
图1为本发明第一较佳实施例的剖视图；Fig. 1 is the sectional view of the first preferred embodiment of the present invention;
图2为本发明第二较佳实施例的剖视图。Fig. 2 is a cross-sectional view of a second preferred embodiment of the present invention.
【主要元件符号说明】[Description of main component symbols]
「第一实施例」"First Embodiment"
微机电封装模块 10 载板 20MEMS package module 10 carrier board 20
封盖 30 腔室 32Cover 30 Chamber 32
柱体 34 接收孔 342Cylinder 34 Receiving hole 342
间隔件 40 曲折通道 42spacer 40 meandering channel 42
水平段 422 垂直段 424Horizontal section 422 Vertical section 424
芯片 50chip 50
「第二实施例」"Second Embodiment"
微机电封装模块 60 载板 70MEMS Package Module 60 Carrier Board 70
凹陷 72 间隔件 80Recess 72 Spacer 80
曲折通道 82meandering passage 82
具体实施方式Detailed ways
为了详细说明本发明的结构、特征及功效所在，兹列举一较佳实施例并配合下列图式说明如后。In order to describe the structure, features and functions of the present invention in detail, a preferred embodiment is listed and described below with the following drawings.
请参阅图1，为本发明第一较佳实施例所提供的微机电封装模块10，包含有一载板20、一封盖30、一间隔件40，以及一芯片50。Referring to FIG. 1 , the MEMS package module 10 provided by the first preferred embodiment of the present invention includes a carrier 20 , a cover 30 , a spacer 40 , and a chip 50 .
载板20可为陶瓷基板或者由双层板体堆叠而成，本实施例是以陶瓷基板为例。The carrier board 20 can be a ceramic substrate or stacked by double-layer boards. This embodiment takes the ceramic substrate as an example.
封盖30的周缘盖合于载板20的表面，并具有一腔室32与一柱体34，柱体34由腔室32的顶壁向下延伸而出，并具有一连通外界的接收孔342。The peripheral edge of the cover 30 covers the surface of the carrier board 20, and has a cavity 32 and a column 34. The column 34 extends downward from the top wall of the cavity 32, and has a receiving hole communicating with the outside world. 342.
间隔件40设置于载板20与封盖30之间，并于内部具有一曲折通道42，曲折通道42区分为一水平段422与二垂直段424，该二垂直段424位于水平段422的两端，并分别连通封盖30的腔室32与接收孔342。The spacer 40 is disposed between the carrier plate 20 and the cover 30, and has a meandering channel 42 inside. The meandering channel 42 is divided into a horizontal section 422 and two vertical sections 424, and the two vertical sections 424 are located on both sides of the horizontal section 422. end, and communicate with the cavity 32 of the cover 30 and the receiving hole 342 respectively.
芯片50设于间隔件40而对应于曲折通道42的其中一垂直段424，同时位于封盖30的腔室32内并与载板20电性连接，使得外界信号能够从封盖30的接收孔342经由间隔件40的曲折通道42传递至封盖30的腔室32内让芯片50接收。The chip 50 is arranged on the spacer 40 and corresponds to one of the vertical sections 424 of the meandering channel 42, and is located in the cavity 32 of the cover 30 and is electrically connected to the carrier 20, so that external signals can be transmitted from the receiving hole of the cover 30. 342 passes through the tortuous channel 42 of the spacer 40 into the cavity 32 of the cover 30 for the chip 50 to receive.
经由上述结构可知，本发明的微机电封装模块10采用单层陶瓷基板或双层板体作为结构稳固的载板20，并采用厚度相当薄的间隔件40而在其内部形成曲折通道42，并非使用由多个堆叠而成的板体或者导线架作为基板，可确实达到减少整体厚度、降低制造成本、简化制造过程，以及提高产品良率的目的。It can be seen from the above structure that the micro-electromechanical package module 10 of the present invention uses a single-layer ceramic substrate or a double-layer board as the carrier plate 20 with a stable structure, and uses a relatively thin spacer 40 to form a meandering channel 42 inside it. Using a plurality of stacked boards or lead frames as the substrate can indeed reduce the overall thickness, reduce the manufacturing cost, simplify the manufacturing process, and improve the product yield.
请再参阅图2，为本发明第二较佳实施例所提供的微机电封装模块60，其主要结构与上述实施例大致相同，惟其差异在于载板70的表面形成一凹陷72与间隔件80的曲折通道82连通，如此便能扩大曲折通道82的容积供外界信号通过，以同样达到本发明的目的。Please refer to FIG. 2 again. The micro-electromechanical packaging module 60 provided by the second preferred embodiment of the present invention has the same main structure as the above-mentioned embodiment, but the difference is that a recess 72 and a spacer 80 are formed on the surface of the carrier plate 70. The meandering channel 82 communicates with each other, so that the volume of the meandering channel 82 can be enlarged for external signals to pass through, so as to achieve the purpose of the present invention as well.
本发明于前揭实施例中所揭露的构成元件，仅为举例说明，并非用来限制本案的范围，其它等效元件的替代或变化，亦应为本案的申请专利范围所涵盖。The constituent elements disclosed in the foregoing embodiments of the present invention are for illustration only and are not intended to limit the scope of the present application. Substitution or changes of other equivalent elements should also be covered by the scope of the patent application of the present application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010115747.3ACN102153044B (en) | 2010-02-12 | 2010-02-12 | MEMS Packaging Module |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010115747.3ACN102153044B (en) | 2010-02-12 | 2010-02-12 | MEMS Packaging Module |
| Publication Number | Publication Date |
|---|---|
| CN102153044A CN102153044A (en) | 2011-08-17 |
| CN102153044Btrue CN102153044B (en) | 2015-08-26 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010115747.3AActiveCN102153044B (en) | 2010-02-12 | 2010-02-12 | MEMS Packaging Module |
| Country | Link |
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| CN (1) | CN102153044B (en) |
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| CN2626974Y (en)* | 2003-05-16 | 2004-07-21 | 中国科学院上海微系统与信息技术研究所 | Structure realizing gas tight packaging of micro-electro-mechanical system device |
| CN101189180A (en)* | 2005-03-17 | 2008-05-28 | 许密特有限公司 | Thin package for a micro component |
| CN101301993A (en)* | 2007-05-11 | 2008-11-12 | 北京大学 | A kind of MEMS device vacuum packaging method |
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