CN102045936A - Circuit board structure - Google Patents

Abstract

The invention relates to a circuit board structure, which comprises an inner layer circuit board and a circuit daughter board. The inner circuit board is provided with a first circuit layer, a second circuit layer and a core layer positioned between the first circuit layer and the second circuit layer. The circuit sub-board is embedded in the core layer, and the wiring density of the circuit sub-board is greater than that of the inner layer circuit board. In addition, in another circuit board structure, at least one side of the circuit sub-board is correspondingly exposed in an opening area. Therefore, the invention is used for manufacturing the circuit board with local high wiring density, and can simplify the steps and reduce the manufacturing cost.

Description

Circuit board structure

Technical field

The present invention relates to a kind of wiring board, particularly relate to a kind of circuit board structure of integrating high/low wiring density.

Background technology

The market demand of consumption electronic products is big, the consumer except require powerful, more require light, thin, short, little, therefore the circuit of electronic product is more and more finer and closely woven on the market, and also develops towards multilayer in order to the printed substrate that electronic component is installed, and becomes six layers, eight layers by two layers, four layers, even to more than ten layers, so that electronic component can be installed on the printed substrate more thick and fast, dwindle the area of printed substrate, make the volume of electronic product littler.

Yet along with the number of plies of printed substrate is more and more, it is very complicated that the step of manufacturing also becomes, and makes the time of making become very long.In order to make the circuit of high wiring density, the number of plies of printed substrate is usually above four layers, but when the printed substrate of making four layers, only film, Copper Foil are asked when needed with the pressing of internal layer circuit plate, just approximately want about a few hours, if add follow-up treatment step, probably need about five hours.If the printed substrate of made is the multi-layer sheet more than four layers, as six layers, eight layers, ten layers printed substrate, then the needed time of pressing can be longer, so cost of manufacture is too high.

Comparatively speaking, the printed substrate of low wiring density step few because of the number of plies, that make is less, can finish in the short period of time, so output height, cost are low, thereby industry wishes to make with less step the printed substrate of high wiring density invariably.It should be noted that, in the wiring board of the high wiring density in part, the zone of high wiring density only accounts for the part of whole wiring board, all the other zones are the circuit of general layout (low wiring density), but for fear of lacking innovation on the processing procedure, existing known manufacture method still needs long time, so manufacturing cost do not reduce, and does not meet economic benefit.

This shows that above-mentioned existing printed substrate obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel circuit board structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.

Summary of the invention

The objective of the invention is to, overcome the defective that existing printed substrate exists, and a kind of novel circuit board structure is provided, technical problem to be solved is to make it in order to make the wiring board of local high wiring density, and can simplify step and reduce manufacturing cost, be very suitable for practicality.

The object of the invention to solve the technical problems is to adopt following technical scheme to realize.For achieving the above object,, comprise an internal layer circuit plate and a circuit daughter board according to circuit board structure of the present invention.The internal layer circuit plate has first line layer, second line layer and the core layer between first and second line layer.Be embedded in the core layer in the circuit daughter board, the wiring density of circuit daughter board is greater than the wiring density of internal layer circuit plate.

In one embodiment of this invention, above-mentioned circuit board structure more comprises two insulation film and two patterned line layer.Two the insulation films be coated at least the circuit daughter board around.Two patterned line layer are disposed at the relative both sides of internal layer circuit plate and circuit daughter board, and two insulation films are isolated from respectively between two patterned line layer and first and second line layer.

In one embodiment of this invention, two patterned line layer of above-mentioned relative both sides, internal layer circuit plate and circuit daughter board are electrically connected to each other.

In one embodiment of this invention, above-mentioned circuit daughter board has the line layer more than four layers or four layers.The number of plies of circuit daughter board is greater than the number of plies of internal layer circuit plate.

In one embodiment of this invention, the thickness of above-mentioned circuit daughter board is less than or equal to the thickness of internal layer circuit plate.

The object of the invention to solve the technical problems also realizes by the following technical solutions.For achieving the above object,, comprise an internal layer circuit plate, a circuit daughter board, two insulation film and two patterned line layer according to circuit board structure of the present invention.The internal layer circuit plate has first line layer, second line layer and the core layer between first and second line layer.Be embedded in the core layer in the circuit daughter board, the wiring density of circuit daughter board is greater than the wiring density of internal layer circuit plate.Two the insulation films be coated at least the circuit daughter board around.Two patterned line layer are disposed at the relative both sides of internal layer circuit plate and circuit daughter board, and two insulation films are isolated from respectively between two patterned line layer and first and second line layer, and wherein at least one side correspondence of circuit daughter board is revealed in the open area.

In one embodiment of this invention, above-mentioned open area is to remove the part insulation film and a part of patterned line layer that are covered in a prodefined opening zone to form.

The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, circuit board structure of the present invention has following advantage and beneficial effect at least: the circuit daughter board of the high wiring density that wiring board of the present invention will be finished in advance is integrated in the internal layer circuit plate of general layout (low wiring density), and be combined as a whole with two insulation films and two patterned line layer, to simplify step and to reduce manufacturing cost.Therefore, wiring board only needs the needed time of one step press, need not spend long time, has significantly reduced the manufacturing cost of existing known multilayer circuit board.

In sum, the invention relates to a kind of circuit board structure, comprise an internal layer circuit plate and a circuit daughter board.The internal layer circuit plate has first line layer, second line layer and the core layer between first and second line layer.Be embedded in the core layer in the circuit daughter board, the wiring density of circuit daughter board is greater than the wiring density of internal layer circuit plate.In addition, in another circuit board structure, at least one side correspondence of circuit daughter board is revealed in the open area.

Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.

Description of drawings

Figure 1A～Fig. 1 E is respectively the flow chart of manufacture method of the wiring board of one embodiment of the invention.

Fig. 2 A～Fig. 2 F is respectively the flow chart of manufacture method of the wiring board of another embodiment of the present invention.

10: line motherboard 100: the circuit daughter board

102: line layer 104: insulating barrier

106: core substrate 200: the internal layer circuit plate

204: the second line layers of 202: the first line layers

206: core layer 210: release film

212: insulation film 214: tinsel

214a:patterned line layer 214b: outer-layer circuit

220,220a: wiring board A: prodefined opening zone

B: connection pad C: opening

C1: open area P, P1: conductive through hole

V, V1: conductive blind hole

Embodiment

Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of circuit board structure, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.

Relevant aforementioned and other technology contents, characteristics and effect of the present invention can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.Explanation by embodiment, should be to reach technological means that predetermined purpose takes and effect to obtain one more deeply and concrete understanding to the present invention, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the present invention is limited.

Figure 1A～Fig. 1 E is respectively the flow chart of manufacture method of the wiring board of one embodiment of the invention.Seeing also shown in Figure 1A, wherein have thecircuit daughter board 100 of high wiring density, is by cutting one line motherboard 10.Line motherboard 10 is separated into after a plurality ofcircuit daughter boards 100, and thesecircuit daughter boards 100 all have the circuit of high wiring density, and it comprises theline layer 102 more than four layers or four layers, for example six layers, eight layers or ten layers.In the present embodiment,line layer 102 andinsulating barrier 104 with multilayer is laminated on thecore substrate 106 in regular turn earlier, electrically connect the circuit ofline layer 102 again with blind hole V and plated-through-hole P, with thecircuit daughter board 100 of producing a plurality of identical topology on a line motherboard 10.The relative both sides ofcircuit daughter board 100 have a plurality of connection pad B, are arranged in thick and fast on thecircuit daughter board 100, so thatcircuit daughter board 100 can electrically connect the electronic component (not illustrating) that high-order is handled, for example central processing unit or display chip etc.

Then, see also the step shown in Figure 1B and Fig. 1 C, thecircuit daughter board 100 of finishing high wiring density is disposed in the open C of an internal layer circuit plate 200.The open C of internallayer circuit plate 200 is for example to be laser-cut into predetermined shape and size, in order to hold the lesscircuit daughter board 200 of size.In the present embodiment, internallayer circuit plate 200 hasfirst line layer 202,second line layer 204 and thecore layer 206 between first and second line layer 202,204, but as can be known from Figure 1B, the wiring density ofcircuit daughter board 100 is greater than the wiring density of internallayer circuit plate 200, and the number of plies of circuit daughter board 100 (more than four layers or four layers) also is higher than the number of plies (two layers or more) of internallayer circuit plate 200.

The thickness ofcircuit daughter board 100 can be less than or equal to the thickness of internallayer circuit plate 200 haply, decides according to the demand of design.When being embedded incore layer 206 in thecircuit daughter board 100, dispose aninsulation film 212 and atinsel 214 respectively in the relative both sides ofcircuit daughter board 100 with internallayer circuit plate 200, and carry out a hot pressing step, so that twotinsels 214 of both sides are bonded oncircuit daughter board 100 and the internallayer circuit plate 200 by twoinsulation films 212 up and down, and be combined as a whole.

Then, see also the step shown in Fig. 1 D and Fig. 1 E, after finishing the hot pressing step, more can carry out a perforation processing procedure and a plating hole processing procedure, to form electric conducting material respectively in a through hole P1 and a plurality of blind hole V1.The perforation processing procedure for example is laser hole burning processing procedure or machine drilling processing procedure.Through hole P1 can run through twotinsels 214, the twoinsulation film 212 and the internallayer circuit plates 200 of relative both sides.A plurality of blind hole V1 manifestfirst line layer 202 andsecond line layer 204 on the internallayer circuit plate 200 respectively, and manifest the connection pad B that is positioned atcircuit daughter board 100 relative both sides.In addition, plating hole processing procedure for example is that the plated conductive material is in through hole P1, with twotinsels 214 that electrically connect relative both sides to internallayer circuit plate 200, and the plated conductive material is in blind hole V1, with twotinsels 214 that electrically connect relative both sides tocircuit daughter board 100 and internallayer circuit plate 200.

Specifically, the mode that forms through hole P, P1 has two kinds, and (1) forms the entity conductive pole, (2) form the hollow conductive pole, more can insert packing material in the cavity of this hollow conductive pole, wherein packing material can be divided into (a) conductor material, for example comprises metal cream or conducting polymer etc.; (b) insulating material for example comprises resin material, ceramics material or has resin material that ceramic particle distributes etc.; (c) Heat Conduction Material for example has the resin material of metallic particles, metal compound particles or ceramics material distribution of particles etc.

The mode of aforementioned formation conducting post generally includes chemical deposition and forms the electroless-plating conductor layer in through-hole surfaces, and/or carry out galvanoplastic again be formed with electricity and electroplate conductor layer on this conductor layer.

The mode of aforementioned formation conductive blind hole V, V1 generally includes: (1) forms the electroless-plating conductor layer with chemical deposition on blind hole surface, and/or carry out galvanoplastic again be formed with electricity and electroplate conductor layer on this conductor layer, forms to have the blind hole of hollow conductive pole; (2) directly forms the electroless-plating conductor layer by blind hole surface, and continuity is deposited into formation and has the blind hole of entity conductive pole with chemical deposition.

Be formed at the blind hole V ofcircuit daughter board 100 and/or the buried via hole of internallayer circuit plate 200; in the art, can form the hollow conductive pole usually, and the resin material of in the hollow conductive pole, inserting resin material, having metallic particles or pottery magnetic distribution of particles; or metal cream, for example copper cream or silver paste etc.Can certainly keep hollow form according to circumstances directly carries out hot pressing and is flowed at hot pressing and inserted in this blind hole and/or the buried via hole by the glue that contains of semi-solid preparation film.

Then, twotinsels 214 of the relative both sides of patterning are to form two patterned line layer 214a.So, wiring board 220 of the present invention completes haply, and it comprises acircuit daughter board 100, an internallayer circuit plate 200, twoinsulation film 212 and two patterned line layer 214a.Be embedded in thecircuit daughter board 100 in the internallayer circuit plate 200, and the wiring density ofcircuit daughter board 100 is greater than the wiring density of internallayer circuit plate 200, with zone as the high wiring density of wiring board 220.In addition, twoinsulation films 212 be coated oncircuit daughter board 100 around, and be isolated between twopatterned line layer 214a and first and second line layer 202,204.In addition,circuit daughter board 100 can electrically connect by outer fieldpatterned line layer 214a and electronic component (not illustrating) with internallayer circuit plate 200, to transmit signal.

Fig. 2 A～Fig. 2 F is respectively the flow chart of manufacture method of the wiring board of another embodiment of the present invention.Seeing also shown in Fig. 2 A, wherein have thecircuit daughter board 100 of high wiring density, is by cutting one line motherboard 10.Line motherboard 10 is separated into after a plurality ofcircuit daughter boards 100, and thesecircuit daughter boards 100 all have the circuit of high wiring density, and it comprises the line layer more than four layers or four layers, for example six layers, eight layers or ten layers.Relevant description please refer to the foregoing description, does not repeat them here.

Then, see also the step shown in Fig. 2 B and Fig. 2 C, thecircuit daughter board 100 of finishing high wiring density is disposed in the open C of an internal layer circuit plate 200.The wiring density ofcircuit daughter board 100 is greater than the wiring density of internallayer circuit plate 200, and the number of plies of circuit daughter board 100 (more than four layers or four layers) also is higher than the number of plies (two layers or more) of internal layer circuit plate 200.Different with the foregoing description is, carries out before the hot pressing step, can form arelease film 210 earlier on a side ofcircuit daughter board 100, to isolate theinsulation film 212 of a side that is positioned atcircuit daughter board 100 equally.Release film 210 can follow-up finish perforation processing procedure, plating hole processing procedure and patterned circuit processing procedure after, oncircuit daughter board 100, lift off and remove, to manifestcircuit daughter board 100 in an open area, shown in Fig. 2 F.The perforation processing procedure of relevant Fig. 2 D and Fig. 2 E, plating hole processing procedure and patterned circuit processing procedure please refer to the foregoing description, do not repeat them here.

See also the step shown in Fig. 2 E and Fig. 2 F,wiring board 220a has prodefined opening zone A, corresponding to the position atrelease film 210 places, can keep a part of outer-layer circuit 214b on the A of prodefined opening zone, but also can not keep this part outer-layer circuit 214b.The present invention can and removepart insulation film 212 and a part oftinsel 214 that is covered in the prodefined opening zone by laser cutting prodefined opening zone A, to manifest release film 210.Then, removerelease film 210, to manifestcircuit daughter board 100 in an open area C1.

In another embodiment, though be not illustrated among the figure, well imagine that wiring board for example has two prodefined opening zones, correspond respectively to the position at two release film places, wherein two release films are positioned at the relative both sides of circuit daughter board.Can remove part insulation film and a part of tinsel of relative both sides, to manifest two release films by above-mentioned explanation equally.Then, remove release film again, with the relative both sides that manifest the circuit daughter board in two open areas.

So,wiring board 220a of the present invention completes haply, and it comprises acircuit daughter board 100, an internallayer circuit plate 200, twoinsulation film 212 and two patterned line layer 214a.Be embedded in thecircuit daughter board 100 in the internallayer circuit plate 200, and the wiring density ofcircuit daughter board 100 is greater than the wiring density of internallayer circuit plate 200, with zone as the high wiring density of wiring board 220a.In addition, twoinsulation films 212 be coated oncircuit daughter board 100 around, and be isolated between twopatterned line layer 214a and first and second line layer 202,204.In addition, at least one side correspondence ofcircuit daughter board 100 is revealed among the open area C1.Open area C1 can hold one or more electronic components (not illustrating), and can electrically connect by the connection pad B of conducting sphere or conducting block (not illustrating) andcircuit daughter board 100, to transmit signal.

In sum, the circuit daughter board of the high wiring density that wiring board of the present invention will be finished in advance is integrated in the internal layer circuit plate of general layout (low wiring density), and be combined as a whole with two insulation films and two patterned line layer, to simplify step and to reduce manufacturing cost.Therefore, wiring board only needs the needed time of one step press, need not spend long time, has significantly reduced the manufacturing cost of existing known multilayer circuit board, meets economic benefit, really the invention for supplying to utilize on the industry.

The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.

Claims (8)

Translated fromChinese

1.一种线路板结构，其特征在于包括：1. A circuit board structure, characterized in that it comprises:一内层线路板，具有第一线路层、第二线路层及位于该第一及该第二线路层之间的一核心层；以及an inner circuit board having a first circuit layer, a second circuit layer and a core layer between the first and the second circuit layer; and一线路子板，内埋于该核心层中，该线路子板的布线密度大于该内层线路板的布线密度。A circuit sub-board is embedded in the core layer, and the wiring density of the circuit sub-board is greater than that of the inner layer circuit board.2.如权利要求1所述的线路板结构，其特征在于更包括：2. The circuit board structure according to claim 1, further comprising:二绝缘胶片，至少包覆于该线路子板的周围；以及Two insulating films, at least wrapped around the circuit sub-board; and二图案化线路层，配置于该内层线路板与该线路子板的相对两侧，且该二绝缘胶片分别隔离于该二图案化线路层与该第一及该第二线路层之间。Two patterned circuit layers are disposed on opposite sides of the inner circuit board and the circuit sub-board, and the two insulating films are respectively isolated between the two patterned circuit layers and the first and second circuit layers.3.如权利要求2所述的线路板结构，其特征在于其中相对两侧的该二图案化线路层、该内层线路板以及该线路子板彼此电性连接。3 . The circuit board structure according to claim 2 , wherein the two patterned circuit layers on opposite sides, the inner circuit board and the circuit sub-board are electrically connected to each other. 4 .4.如权利要求1所述的线路板结构，其特征在于其中所述的线路子板具有四层或四层以上的线路层。4. The circuit board structure according to claim 1, wherein said circuit sub-board has four or more circuit layers.5.如权利要求4所述的线路板结构，其特征在于其中所述的线路子板的层数大于该内层线路板的层数。5. The circuit board structure according to claim 4, wherein the number of layers of the circuit sub-board is greater than the number of layers of the inner circuit board.6.如权利要求5所述的线路板结构，其特征在于其中所述的线路子板的厚度小于或等于该内层线路板的厚度。6. The circuit board structure according to claim 5, wherein the thickness of the circuit sub-board is less than or equal to the thickness of the inner circuit board.7.一种线路板结构，其特征在于包括：7. A circuit board structure, characterized in that it comprises:一内层线路板，具有第一线路层、第二线路层及位于该第一及该第二线路层之间的一核心层；An inner circuit board having a first circuit layer, a second circuit layer and a core layer between the first circuit layer and the second circuit layer;一线路子板，内埋于该核心层中，该线路子板的布线密度大于该内层线路板的布线密度；A circuit sub-board is embedded in the core layer, and the wiring density of the circuit sub-board is greater than that of the inner circuit board;二绝缘胶片，至少包覆于该线路子板的周围；以及Two insulating films, at least wrapped around the circuit sub-board; and二图案化线路层，配置于该内层线路板与该线路子板的相对两侧，且该二绝缘胶片分别隔离于该二图案化线路层与该第一及该第二线路层之间，其中该线路子板的至少一侧对应显露于一开口区域中。Two patterned circuit layers are disposed on opposite sides of the inner circuit board and the circuit sub-board, and the two insulating films are respectively isolated between the two patterned circuit layers and the first and the second circuit layers, Wherein at least one side of the circuit sub-board is correspondingly exposed in an opening area.8.如权利要求7所述的线路板结构，其特征在于其中所述的开口区域是移除覆盖于一预定开口区域的一部分绝缘胶片以及一部分图案化线路层所形成。8 . The circuit board structure according to claim 7 , wherein the opening area is formed by removing a part of the insulating film and a part of the patterned circuit layer covering a predetermined opening area.

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