CN102043980A - Noncontact interface SIM card with integrated antenna - Google Patents

Abstract

The invention discloses a noncontact interface SIM (Subscriber Identity Module) card with an integrated antenna, and relates to the field of intelligent card manufacture. The noncontact interface SIM card comprises an integrated SIM card substrate, an SIM card integrated circuit (IC), a peripheral circuit and an antenna device, wherein the SIM card IC is arranged on the integrated SIM card substrate and has noncontact and contact functions. The integrated SIM card substrate is characterized in that: after being welded, the integrated SIM card substrate and the antenna connecting part of the antenna device are sealed into a whole by plastic package. An integrated manufacturing mode is adopted in the invention and is very suitable for manufacturing the SIM card with a noncontact function; the technical defects of stuck and welded antennas are overcome; the antenna is completely and reliably sealed with the SIM card with a noncontact interface to form a whole, so that the problems of ageing, corrosion and the like because the connecting point of the antenna and the SIM card is exposed in the air are avoided, and the SIM card is firm, durable, attractive, reliable and convenient to use and has great practical value.

Description

A kind of noncontact interface SIM card with integral aerial

Technical field

The present invention relates to a kind of noncontact interface SIM card, belong to smart card manufacturing technology field with integral aerial.

Background technology

The SIM card at band noncontact interface is the SIM card of a kind of integrated contact, contactless two kinds of communication interfaces.It combines the advantage of contact and contactless IC card, the memory capacity of existing Contact Type Ic Card is big, good reliability, safe characteristics, the plug-in card that need not that non-contact IC card is arranged again, easy to operate, transaction fast, characteristics such as anti-environmental pollution and electrostatic capacity are strong, therefore, it is subject to people's attention once occurring, demonstrate good prospects for application, it is at motorbus, subway, ferries etc. are applied, particularly be applied to embedded device realization mobile payments such as portable terminal, authentications etc., these are used and bring very big facility for people's life.

In application, the SIM card at band noncontact interface needs external antenna to come inductive energy, the electric current that provides internal work to need.Generally use the adhesive type antenna at present, connect antenna and SIM card owing to adopt to paste glue, therefore exist and SIM card between owing to pasting the loose contact problem that dislocation, virtual connection and reason such as aging cause.The welded type antenna that another generally uses adopts certain several point of welding to be connected with SIM card, exists that rosin joint, solder joint come off, solder joint corrodes problem such as wear out, thereby reason causes the communication failure problem.

For example, application number is that 200920222371.9 utility model discloses a kind of gadget antenna, and this antenna comprises housing; Described enclosure interior is packaged with aerial coil, and two leading-out terminals of described aerial coil are drawn outside the housing, to be used to connect the noncontact point of IC-card chip.By antenna is independent, aerial coil is arranged in the special housing, two joints of coil are drawn outside the carrier, be connected with contactless IC card chip in the Near Field Communication equipment and finish the noncontact communication, this gadget antenna and chip are independent.

Above-mentioned patent does not solve the technological deficiency that adhesive type and welded type antenna exist, and promptly antenna and SIM card tie point are exposed to problems such as wearing out of causing easily in the air, corrosion.

Summary of the invention

One object of the present invention is to provide a kind of SIM card of the noncontact interface with integral aerial, can embed portable terminal, also supports mobile payment when supporting the SIM card function.

The present invention includes: integral type SIM card substrate be arranged at described integral type SIM card substrate on have noncontact and SIM card IC that contacts function and peripheral circuit, an antenna assembly;

Described antenna assembly comprises coiler part and the antenna interconnecting piece branch that links to each other with described coiler part by the antenna connection handle.

For making described integral type SIM card substrate and antenna interconnecting piece branch connect into an integral body, employing is arranged at described antenna interconnecting piece branch on the described integral type SIM card substrate, and dividing the corresponding placement of pad of going up on metallization via hole and the described integral type SIM card substrate with described antenna interconnecting piece, described integral type SIM card substrate is connected by the welding method realization with the antenna interconnecting piece branch of described antenna assembly.Simultaneously, have noncontact and be positioned on the described integral type SIM card substrate described, described peripheral circuit is connected with corresponding pad on the described integral type SIM card substrate by welding manner with the SIM card IC that contacts function by bonding method.

After finishing above-mentioned flow process, described SIM card IC, described peripheral circuit and described antenna interconnecting piece branch are arranged on the described integral type SIM card substrate, possessed contactless interface SIM card function.By to described integral type SIM card substrate injection, adopt the method for plastic packaging to finish the integral type encapsulation then.

The mode that the present invention adopts integral type to make, be highly suitable for having the manufacturing of the SIM card of non-contact function, it has solved the technological deficiency of adhesive type and the existence of welded type antenna, the SIM card at antenna and band noncontact interface is complete, be packaged into an integral body reliably, problems such as aging, the corrosion of promptly having avoided antenna and SIM card tie point to be exposed to causing in the air, durable again, attractive in appearance reliable, easy to use, have stronger practical value.

Description of drawings

Fig. 1 a is an embodiment of the invention integral type SIM card outer surface of substrate synoptic diagram;

Fig. 1 b is an embodiment of the invention integral type SIM card substrate inside surface synoptic diagram;

Fig. 2 is the connection diagram of embodiment of the invention integral type SIM card substrate and SIM card IC, peripheral circuit;

Fig. 3 a is the synoptic diagram of embodiment of the invention antenna assembly;

Fig. 3 b is the connection diagram that embodiment of the invention integral type SIM card substrate and antenna interconnecting piece are divided;

Fig. 4 a is the synoptic diagram of the integral type SIM card substrate before the embodiment of the invention plastic packaging;

Fig. 4 b is an embodiment of the invention plastic packaging synoptic diagram;

Fig. 5 a is that integral body was faced design sketch after embodiment of the invention plastic packaging was finished;

Fig. 5 b is a whole side-looking design sketch after embodiment of the invention plastic packaging is finished;

Fig. 5 c is a whole backsight design sketch after embodiment of the invention plastic packaging is finished.

Embodiment

Below in conjunction with the drawings and Examples explanation that describes the present invention.

The present invention includes: integral type SIM card substrate be arranged at described integral type SIM card substrate on have noncontact and SIM card IC that contacts function and peripheral circuit, an antenna assembly; Described antenna assembly comprises coiler part and the antenna interconnecting piece branch that links to each other with described coiler part by the antenna connection handle.

As Fig. 1 a, Fig. 1 b, shown in, integral type SIM card substrate is divided intooutside surface 110 and insidesurface 120;Outside surface 110 mainly is agolden finger face 111, plays with the SIM card seat to be connected effect, and following metallization viahole 102 has been communicated withoutside surface 110 and inside surface 120.Insidesurface 120 has comprised thepaste position 121 of SIM card IC, thepad 123 of peripheral circuit, thepad 122 that antenna interconnecting piece is divided.Substrate thickness is 0.19mm ± 0.03mm, and its core layer is materials such as HL382NX, and the core layer both sides are for covering the copper layer, and the outside of covering the copper layer is a solder mask.

As shown in Figure 2, SIM card IC 124 makes in the method for paste and is connected withpaste position 121 contrapositions of SIM card IC, and used stickup glue has superpower adhibit quality, ultrathin, can either connect so reliably, meets the packaging machinery dimensional requirement again.Thediscrete component 125 of peripheral circuit adopts the mode of welding to be connected with thepad 123 of peripheral circuit, is convenient to realize electric property.

Described antenna assembly comprises thataerial coil 200,antenna connection handle 202 and antenna interconnecting piece divide 201, shown in Fig. 3 a.

Antenna interconnecting piece on the described antenna assembly divide offer on 201 the metallization viahole 203,pad 122 corresponding placements on last metallization viahole 203 and the described integral type SIM card substrate, and by welding manner connection last metallization viahole 203 andpad 122, realized being electrically connected of antenna assembly and SIM card, shown in Fig. 3 b.

After finishing above-mentioned flow process, shown in Fig. 4 a, overlook from theinside surface 120 of integral type SIM card substrate 100, thediscrete component 125 of SIM card IC124, peripheral circuit, antenna interconnecting piece divide 201,antenna connection handle 202 and 200 complete the connecting together of aerial coil part, for follow-up plastic packaging has been carried out early-stage preparations.

Shown in Fig. 4 b, plastic packaging uses resin materials such as KE-1100AS-3C, its plastic packagingexternal form 300 is coincide with the each several part shown in Fig. 4 a, by technologies such as pressurization, heat seals, makes the integral type SIM card substrate 100 shown in Fig. 4 adivide 201 to finish whole plastic packaging with antenna interconnecting piece.View behind the plastic packaging is shown in Fig. 5 a, Fig. 5 b, Fig. 5 c.

The above; only be the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in scope disclosed by the invention; the variation that can expect easily or replacement all should be encompassed in the protection domain of claim of the present invention.

Claims (7)

1. noncontact interface SIM card with integral aerial comprises: integral type SIM card substrate be arranged at described integral type SIM card substrate on have noncontact and SIM card IC that contacts function and peripheral circuit, an antenna assembly; Described antenna assembly comprises coiler part and the antenna interconnecting piece branch that links to each other with described coiler part by the antenna connection handle, wherein said antenna interconnecting piece branch is arranged on the described integral type SIM card substrate, the corresponding placement of pad on metallization via hole on described antenna interconnecting piece is divided and the described integral type SIM card substrate, described integral type SIM card substrate is connected by the welding method realization with the antenna interconnecting piece branch of described antenna assembly; It is characterized in that the antenna interconnecting piece of described integral type SIM card substrate and described antenna assembly is divided by being welded to connect, and is packaged into an integral body by plastic packaging again.

2. a kind of noncontact interface SIM card with integral aerial according to claim 1 is characterized in that the material that described plastic packaging uses is the KE-1100AS-3C resin material.

3. a kind of noncontact interface SIM card according to claim 1 with integral aerial, it is characterized in that, it is 0.76mm ± 0.08mm that the antenna interconnecting piece of described integral type SIM card substrate and described antenna assembly is divided the thickness behind the plastic packaging, and length is 25mm ± 0.1mm, and width is 15mm ± 0.1mm.

4. a kind of noncontact interface SIM card with integral aerial according to claim 1 is characterized in that, described integral type SIM card substrate is identical with general SIM card shape with shape after the antenna interconnecting piece of described antenna assembly is divided plastic packaging.

5. a kind of noncontact interface SIM card according to claim 1 with integral aerial, it is characterized in that described integral type SIM card substrate thickness is 0.19mm ± 0.03mm, its core layer is the HL382NX material, the core layer both sides are for covering the copper layer, and the outside of covering the copper layer is a solder mask.

6. a kind of noncontact interface SIM card with integral aerial according to claim 1 is characterized in that described integral type SIM card substrate is divided into inside and outside two surfaces; Outside surface is the golden finger face, is used for and deck or other plug connector physical connections;

Inside surface adopts to paste with described SIM IC and is connected; Described inside surface and described peripheral circuit adopt and are welded to connect; The antenna interconnecting piece of described inside surface and described antenna assembly divides employing to be welded to connect; Inside and outside two surfaces of described integral type SIM card substrate realize connecting by the metallization via hole.

7. a kind of noncontact interface SIM card according to claim 1 with integral aerial, it is characterized in that, the core material that the antenna interconnecting piece of described antenna assembly is divided is polyester or polyimide material, its thickness average value is 0.13mm ± 0.5mm, maximal value is 0.15mm, and the antenna interconnecting piece of described antenna assembly is arranged with the metallization via hole.

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