CN101986770A - Multi-order high-density circuit board registration hole and manufacturing method thereof - Google Patents
Multi-order high-density circuit board registration hole and manufacturing method thereofDownload PDFInfo
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- CN101986770A CN101986770ACN 201010248709CN201010248709ACN101986770ACN 101986770 ACN101986770 ACN 101986770ACN 201010248709CN201010248709CN 201010248709CN 201010248709 ACN201010248709 ACN 201010248709ACN 101986770 ACN101986770 ACN 101986770A
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- blind hole
- laser blind
- circuit board
- registration holes
- density circuit
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Abstract
Description
Technical field
The present invention relates to a kind of wiring board registration holes and manufacture method, relate in particular to a kind of multistage high-density circuit board registration holes and manufacture method.
Background technology
Along with the development of electronic industry, the wiring board industry is also more and more flourishing, the technology of laser drill progressively occurred adopting.The appearance of laser drill technology, can obtain the machining accuracy meticulousr than machine drilling processing method, the aperture is contracted to 0.05mm from original minimum 0.2mm, the wiring density of wiring board and cloth hole density increase greatly, the orifice ring size narrows down to 0.075mm--0.050mm from original 0.15mm-0.20mm, and the requirement of its manufacturing technology is also more and more higher.For high-density circuit board, high-density circuit board, its number of plies is many, need in manufacturing process accurately contraposition of each layer, and its line width and pad is all very little, and the difficulty of making is very big.The prior art situation is the contraposition effect that blind hole is judged in Aligning degree situation in the employing perusal unit or the through hole hole of adopting edges of boards, and aligning accuracy is very poor like this, produces the low and inefficiency of yield.The reliability testing of laser drill high-density circuit board also is a very stubborn problem, and existing method needs dicing method could obtain corresponding data, the cost height of wasting time and energy.For multistage high-density circuit board contraposition and reliability testing, existing technology is difficult to meet the demands especially.
Summary of the invention
The technical problem that the present invention solves is: multistage high-density circuit board registration holes and manufacture method are provided, overcome multistage high-density circuit board technique of counterpoint complexity in the prior art, can not obtain the effect of accurate contraposition.
Technical scheme of the present invention is: make up a kind of multistage high-density circuit board registration holes, many group registration holes are set around in described multistage high-density circuit board graphics field, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array and innermost layer laser blind hole array adopt the lead dislocation to be connected in series the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path, and described lead does not repeat to connect between laser blind hole.
Further technical scheme of the present invention is: described many group registration holes are separately positioned on four jiaos around the described multistage high-density circuit board graphics field.
Further technical scheme of the present invention is: described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
Further technical scheme of the present invention is: around the laser blind hole of laser blind hole array welding resistance is set, described welding resistance is from laser blind hole at least 2 mils.
Further technical scheme of the present invention is: described laser blind hole array apart from the distance of circuit panel edges more than or equal to 5 millimeters.
Further technical scheme of the present invention is: the distance of described laser blind hole array and described multistage high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Technical scheme of the present invention is: a kind of multistage high-density circuit board registration holes manufacture method is provided, many group registration holes are set on every side in described multistage high-density circuit board graphics field, manufacture method comprises the steps:
Determine that registration holes is provided with the position: determine around in multistage high-density circuit board graphics field that registration holes is provided with the position;
The laser blind hole array is set: registration holes is set in definite position, described registration holes is many groups, many group registration holes are set around in described multistage high-density circuit board graphics field, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array and innermost layer laser blind hole array adopt the lead dislocation to be connected in series the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path, and described lead does not repeat to connect between laser blind hole;
The processing of laser blind hole array during plating: comprise the film that carries out graphics process on multistage high-density circuit board, the laser blind hole in multistage high-density circuit board graphics field does not need to electroplate when filling and leading up, and described registration holes adopts dry film to cover on the described film; Need electroplate when filling and leading up at the laser blind hole of multistage high-density circuit board graphics field, the part laser blind hole in the close circuit board pattern zone of laser blind hole array adopts dry film to cover on the described film in the described registration holes.
Further technical scheme of the present invention is: described many group registration holes are separately positioned on four jiaos around the described multistage high-density circuit board graphics field.
Further technical scheme of the present invention is: described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
Further technical scheme of the present invention is: the distance of described laser blind hole array and described multistage high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Technique effect of the present invention is: around in described multistage high-density circuit board graphics field many group registration holes are set, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array and innermost layer laser blind hole array adopt the lead dislocation to be connected in series the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path, and described lead does not repeat to connect between laser blind hole.Registration holes of the present invention can be finished accurate contraposition, is convenient to the problem by the conductivity detection laser blind hole of detection laser blind hole again, thereby has improved quality and efficient that wiring board is made.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is a laser blind hole array schematic diagram of the present invention.
Fig. 3 is a laser blind hole lead connection diagram of the present invention.
Fig. 4 is a laser blind hole array line schematic diagram of the present invention.
Fig. 5 is a welding resistance schematic diagram of the present invention.
Fig. 6 is a flow chart of the present invention.
Embodiment
Below in conjunction with specific embodiment, technical solution of the present invention is further specified.
As shown in Figure 1 and Figure 2, the present invention makes up a kind of multistage high-density circuitboard registration holes 3,12 is provided with manygroup registration holes 3 on every side in described multistage high-density circuit board graphics field, described every group ofregistration holes 3 is the laser blind hole array of multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array and innermost layer laser blind hole array adoptlead 33 dislocation to be connected in series the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path, and described lead does not repeat to connect between laser blind hole 35.When forming a conductive path, be convenient to each laserblind hole 35 in every group of laser blind hole array is carried out fault detect, repeat to connect if exist, then may influence the effect of fault detect.
Specific implementation process of the present invention is as follows: 2 positions of determining to be provided withregistration holes 3 around 1 in described multistage high-density circuit board graphics field, to organizeregistration holes 3 then is separately positioned on the relevant position more, described every group ofregistration holes 3 is the laser blind hole array of multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array and innermost layer laser blind hole array adoptlead 33 dislocation to be connected in series the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path.As shown in Figure 3,
As shown in Figure 2, preferred implementation of the present invention is: described laser blind hole array pitch is 15mil-40mil, described laser blind hole array pitch optimum value is 20mil, and described laser blind hole array row are apart from being 20mil-100mil, and it is 40mil that described laser blind hole array is listed as apart from optimum value.The laser blind hole array is 10 row, 10 row in the specific embodiment of the invention.
As shown in Figure 4, when laser blind hole arrays of conductive path is set, described top layer laser blind hole array and innermost layer laser blind hole array adopt the be connected in series laserblind hole 35 of described every group of registration holes of lead dislocation, so that laserblind hole 35 integral body of every group of laser blind hole array are linked to be a path, whereinlead 33 connects not exist and repeats to connect.
As shown in Figure 5, preferred implementation of the present invention is: around the laser blind hole of laser blind hole array welding resistance is set, described welding resistance is from laserblind hole 35 at least 2 mils.Among the present invention, the laserblind hole 35 that laser blind hole array place has does not all cover welding resistance, and welding resistance is at least 2mil (0.05mm) from the distance of laserblind hole 35, does not go up blind hole Xi Quan with welding resistance during contraposition.
In the preferred implementation of the present invention, more than or equal to 5 millimeters, the distance of described laser blind hole array and described multistage high-density circuit board graphics field is 0.5 millimeter to 5 millimeters to described laser blind hole array apart from the distance of circuit panel edges.
The present invention is by 2 being provided with manygroup registration holes 3 in described multistage high-density circuit board graphics field around 1, described every group ofregistration holes 3 is the laser blind hole array of multiple lines and multiple rows, adoptslead 33 to be connected in series between the laser blind hole of described every group ofregistration holes 3 so that every group of laser blind hole array forms a conductive path.Registration holes of the present invention can be finished accurate contraposition, is convenient to the problem by the conductivity detection laser blind hole of detection laser blind hole again, thereby has improved quality and efficient that wiring board is made.
As shown in Figure 6, technical scheme of the present invention is: a kind of multistage high-density circuit board registration holes manufacture method is provided, many group registration holes are set on every side in described multistage high-density circuit board graphics field, manufacture method comprises the steps:
Step 100: determine that registration holes is provided with the position, that is, determine on every side that in multistage high-density circuit board graphics field registration holes is provided with the position.The present invention is when determining that registration holes is provided with the position on every side in multistage high-density circuit board graphics field, more than or equal to 5 millimeters, the distance of described laser blind hole array and described multistage high-density circuit board graphics field is 0.5 millimeter to 5 millimeters to described laser blind hole array apart from the distance of circuit panel edges.Determine the position of laser blind hole array in such zone, both can prevent too closely,, can prevent that again the laser blind hole array is too far away from the wiring board graphics field, influence the effect of contraposition to influence the effect of circuit board pattern from the wiring board graphics field.
Step 200: the laser blind hole array is set, promptly, in definite position registration holes is set, described registration holes is many groups, many group registration holes are set around in described multistage high-density circuit board graphics field, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array and innermost layer laser blind hole array adopt the lead dislocation to be connected in series the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path, and described lead does not repeat to connect between laser blind hole.
Step 300: the processing of laser blind hole array during plating, promptly, comprise the film that carries out graphics process on multistage high-density circuit board, the laser blind hole in multistage high-density circuit board graphics field does not need to electroplate when filling and leading up, and described registration holes adopts dry film to cover on the described film; Need electroplate when filling and leading up at the laser blind hole of multistage high-density circuit board graphics field, the part laser blind hole in the close circuit board pattern zone of laser blind hole array adopts dry film to cover on the described film in the described registration holes.
Preferred implementation of the present invention is: described many group registration holes are separately positioned on four jiaos around the described multistage high-density circuit board graphics field.Described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.The distance of described laser blind hole array and described multistage high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. multistage high-density circuit board registration holes, it is characterized in that, many group registration holes are set around in described multistage high-density circuit board graphics field, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array and innermost layer laser blind hole array adopt the lead dislocation to be connected in series the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path, and described lead does not repeat to connect between laser blind hole.
2. multistage high-density circuit board registration holes according to claim 1 is characterized in that, described many group registration holes are separately positioned on four jiaos around the described multistage high-density circuit board graphics field.
3. multistage high-density circuit board registration holes according to claim 1 is characterized in that described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
4. multistage high-density circuit board registration holes according to claim 1 is characterized in that, around the laser blind hole of laser blind hole array welding resistance is set, and described welding resistance is from laser blind hole at least 2 mils.
5. multistage high-density circuit board registration holes according to claim 1 is characterized in that, described laser blind hole array apart from the distance of circuit panel edges more than or equal to 5 millimeters.
6. multistage high-density circuit board registration holes according to claim 1 is characterized in that, the distance of described laser blind hole array and described multistage high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
7. a multistage high-density circuit board registration holes manufacture method is characterized in that, many group registration holes are set on every side in described multistage high-density circuit board graphics field, and manufacture method comprises the steps:
Determine that registration holes is provided with the position: determine around in multistage high-density circuit board graphics field that registration holes is provided with the position;
The laser blind hole array is set: registration holes is set in definite position, described registration holes is many groups, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows, the corresponding stack of described each rank laser blind hole array, described top layer laser blind hole array adopts lead dislocation series connection repeatedly not to be connected the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path with innermost layer laser blind hole array;
The processing of laser blind hole array during plating: comprise the film that carries out graphics process on multistage high-density circuit board, the laser blind hole in multistage high-density circuit board graphics field does not need to electroplate when filling and leading up, and described registration holes adopts dry film to cover on the described film; Need electroplate when filling and leading up at the laser blind hole of multistage high-density circuit board graphics field, the part laser blind hole in the close circuit board pattern zone of laser blind hole array adopts dry film to cover on the described film in the described registration holes.
8. multistage high-density circuit board registration holes manufacture method according to claim 7 is characterized in that, described many group registration holes are separately positioned on four jiaos around the described multistage high-density circuit board graphics field.
9. multistage high-density circuit board registration holes manufacture method according to claim 7 is characterized in that described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
10. multistage high-density circuit board registration holes manufacture method according to claim 7 is characterized in that, the distance of described laser blind hole array and described multistage high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010248709CN101986770B (en) | 2010-08-06 | 2010-08-06 | Multi-order high-density circuit board registration hole and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010248709CN101986770B (en) | 2010-08-06 | 2010-08-06 | Multi-order high-density circuit board registration hole and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101986770Atrue CN101986770A (en) | 2011-03-16 |
| CN101986770B CN101986770B (en) | 2013-04-03 |
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| CN 201010248709Expired - Fee RelatedCN101986770B (en) | 2010-08-06 | 2010-08-06 | Multi-order high-density circuit board registration hole and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280737A (en)* | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | Blind hole offset detection method for high-order HDI printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5377404A (en)* | 1992-09-29 | 1995-01-03 | Berg; N. Edward | Method for fabricating a multi-layer printed circuit board |
| WO1997046349A1 (en)* | 1996-06-05 | 1997-12-11 | Burgess Larry W | Blind via laser drilling system |
| WO2007005639A2 (en)* | 2005-06-30 | 2007-01-11 | Controlled Semiconductor, Inc. | Lead frame isolation using laser technology |
| CN101494954A (en)* | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| EP1363327B1 (en)* | 2002-05-17 | 2010-09-08 | Avago Technologies General IP (Singapore) Pte. Ltd | Method providing electrical interconnection using a detachable substrate |
- 2010
- 2010-08-06CNCN 201010248709patent/CN101986770B/ennot_activeExpired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5377404A (en)* | 1992-09-29 | 1995-01-03 | Berg; N. Edward | Method for fabricating a multi-layer printed circuit board |
| WO1997046349A1 (en)* | 1996-06-05 | 1997-12-11 | Burgess Larry W | Blind via laser drilling system |
| EP1363327B1 (en)* | 2002-05-17 | 2010-09-08 | Avago Technologies General IP (Singapore) Pte. Ltd | Method providing electrical interconnection using a detachable substrate |
| WO2007005639A2 (en)* | 2005-06-30 | 2007-01-11 | Controlled Semiconductor, Inc. | Lead frame isolation using laser technology |
| CN101494954A (en)* | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280737A (en)* | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | Blind hole offset detection method for high-order HDI printed circuit board |
| CN113280737B (en)* | 2021-05-14 | 2023-08-29 | 惠州中京电子科技有限公司 | Blind hole offset detection method for high-order HDI printed circuit board |
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| CN101986770B (en) | 2013-04-03 |
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