CN101975343A - Light source module and preparation method thereof - Google Patents
Light source module and preparation method thereofDownload PDFInfo
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- CN101975343A CN101975343ACN2010102984454ACN201010298445ACN101975343ACN 101975343 ACN101975343 ACN 101975343ACN 2010102984454 ACN2010102984454 ACN 2010102984454ACN 201010298445 ACN201010298445 ACN 201010298445ACN 101975343 ACN101975343 ACN 101975343A
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Classifications
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Translated fromChineseDescription
Technical field
The present invention relates to the semiconductor lighting technology, relate in particular to a kind of light source module and preparation method thereof.
Background technology
Widely used on the market led light source generally comprises an aluminium base, or pottery or other metal substrate; And printed circuit being set in the front of substrate, the reverse side of substrate supports to be located at heat abstractor or directly at the reverse side of substrate thermal component to be set.
In disclosed a kind of LED module on November 18th, 2009, this module comprises aluminium base, LED lamp as Chinese patent literature CN101581417A, and the front of aluminium base has printed circuit, and the LED lamp is arranged at the front of aluminium base, and the reverse side of aluminium base has fin; This LED module also comprises sealing plate and optical lens, optical lens is arranged on the LED lamp, a step is extended in the optical lens bottom, sealing plate is arranged on the front of described aluminium base, has lens opening on the sealing plate, described optical lens is arranged in described lens opening, and described sealing plate is pressed and is located at described step.
For another example Chinese patent literature CN101761903A on June 30th, 2010 disclosed kind be used for the heat spreader structures of LED lamp, comprise fin, between described fin and LED package support conductive graphite sheet, aluminium base are installed successively, described aluminium base upper surface is attached with silicon oxide layer and described LED package support forms insulation; Described LED package support is connected with aluminium base by insulated bolt.Adopt aluminium base additional silicon oxide layer to replace aluminum-based circuit board, thermal conductivity can reach 10W/ (m ℃) simultaneously, with the conductive graphite sheet replacement conduction oil of thermal conductivity near copper, its thermal conductivity can reach 300W/ (m ℃), the heat that can timely LED be produced is passed to fin, the heat dispersion of LED lamp is significantly improved, thereby reduce light decay, life-saving.
Aforementioned two kinds of technology have embodied the main flow of existing light source technology, for the radiating effect of obtaining, and the pcb board that adopts aluminium base to replace conventional electrical already to use.
The light source module can be divided into two kinds, and first kind is the light source module that directly encapsulates with crystal, and second kind is the body of selecting for use encapsulation manufacturer to make in batches, carries out the secondary assembling; What first kind of light source module was used for solid crystalline substance is base plate, Gu brilliant material generally is AuSn or AgSn, crystal needs sealing, and use occasion is different with requirement, and once the alleged aluminium base of Feng Zhuan base plate and the present invention does not have comparativity; Second kind of light source module just used aluminium base.
The body of aluminium base is that surface of aluminum plate is disposed with insulating barrier, circuit layer, protective layer, and aluminium base is for general on primary surface and welds luminous body, and the aluminium base back side connects thermal component, and aluminium base plays the function of circuit board and heat conduction medium.
Because of general employing silica or other insulating materials of insulating barrier, heat conductivility is not good, influences the heat radiation of luminous body, and the temperature accumulation finally causes too early light decay.For addressing this problem, also the someone proposes luminous body directly is attached at directly heat radiation on the lamp housing.As Chinese patent literature CN201145220Y in disclosed a kind of LED illuminating lamp on November 5th, 2008, it adopts aluminium section to do lamp housing, the structure of light fixture is simplified, simultaneously high-power LED luminescent part directly is mounted on the inner surface of lamp housing, the heat energy that makes led chip produce is delivered on the radiating fin of lamp housing outer surface with very short path, then be dispersed into apace in the outer air of light fixture, make the temperature rise of led chip maintain on the lower level, reach and delay the purpose that the light decay process improves working life.This side has mentioned respectively and has adopted LED light emitting diode and led chip to be mounted on two technical schemes of lamp housing, for the scheme that mounts led chip, and do not talk necessary contents such as its unexposed solid crystalline substance, gold thread protection, packaged type, because what it related to is once to encapsulate, uncorrelated with the problem of the present invention's research, do not have comparativity yet; For the technical scheme that mounts the LED light emitting diode, from this patent specification as can be known, more contents of the unexposed circuit board 4 of this scheme have reason to be estimated as common pcb board, this scheme do not provide yet between circuit board 4 and the lamp housing concrete syndeton be connected technology.On structure, the bonding wire of this scheme not protection directly contacts oxygen, and broken string appears in easy oxidation when temperature rise is arranged; On technology, common pcb board is the rigidity of hard, and it is big to mount difficulty, and insecure, has when loosening, also easily causes bonding wire to be broken, and broken string occurs.The LED lamp is when lighting and extinguish, and the temperature difference in short-term of thermal component and connected circuit, light-emitting component is generally greater than 50 ℃, and power is big more serious more.Hot Peng between the rigidity characteristics of common circuit board and itself and lamp housing coefficient difference that expands also is enough to cause bonding wire broken string to occur, is presented as that lighting device breaks down.
Summary of the invention
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art part and light source module of a kind of good heat dissipation effect and stable performance and preparation method thereof is provided.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of light source module comprises light emitting diode, it is characterized in that: also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode; Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is located at metallic heat radiating plate by the PAS sticker; Flexible PCB has through hole, and described light emitting diode is arranged in the through hole; Light emitting diode (refers to be used for the light emitting diode of surface patch, one of difference of the light emitting diode of using with common plug-in unit is that the link of internal circuit and external circuit is to treat welding electrode, rather than pin, treat that welding electrode is positioned at the side or the top edge of light emitting diode) have electrode, electrode connects described printed circuit by nation's alignment (also claiming nation's line); This light source module also comprises layer of silica gel, and described printed circuit, described nation alignment all are coated on layer of silica gel; This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer has aluminium coated; Described layer of silica gel, described substrate layer, described aluminium coated also all have and the corresponding hole of the through hole of described flexible PCB.Compare with common circuit board, flexible PCB not only rigidity is little, and has certain elasticity; when light source because of lighting or extinguishing when producing in short-term the temperature difference; flexible PCB with the synchronous breathing of metallic heat radiating plate, reduces protection nation alignment to the impulsive force of nation's alignment greatly on certain program.
The light source module is characterized in that: have soldering-tin layer between metallic heat radiating plate and the light emitting diode.
The light source module is characterized in that: described aluminium coated outer surface also has protective layer, and protective layer is the self-cleaning layer of titanium dioxide that is provided with by the vacuum plating.
The light source module is characterized in that: described aluminium coated is coloured transparent.
The light source module is characterized in that: have soldering-tin layer between metallic heat radiating plate and the light emitting diode; Described aluminium coated outer surface also has protective layer, and protective layer is the self-cleaning layer of titanium dioxide that is provided with by the vacuum plating; Described substrate layer is the PET material, and described flexible circuit flaggy is the PI material.
A kind of light source module comprises light emitting diode, it is characterized in that: also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode; Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is attached at metallic heat radiating plate by silica gel, and described silica gel constitutes first layer of silica gel; Flexible PCB and described first layer of silica gel synchronously have through hole, and described light emitting diode is arranged in the through hole; Light emitting diode has electrode, and electrode connects described printed circuit by nation's alignment; This light source module also comprises second layer of silica gel, and described printed circuit, described nation alignment all are coated on second layer of silica gel; This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer has aluminium coated; Described second layer of silica gel, described substrate layer, described aluminium coated also all have and the corresponding hole of the through hole of described flexible PCB.
Purpose of the present invention can also be achieved through the following technical solutions:
A kind of light source module comprises light emitting diode, it is characterized in that: also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode; Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is located at metallic heat radiating plate by the PAS sticker; Flexible PCB has through hole, and described light emitting diode is arranged in the through hole; Light emitting diode has electrode, and electrode connects described printed circuit by nation's alignment; This light source module also comprises layer of silica gel, and described printed circuit, described nation alignment all are coated on layer of silica gel; This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer is by the pressure sensitive adhesive aluminium foil layer that has been sticked; Described layer of silica gel, described substrate layer, described aluminium foil layer also all have and the corresponding hole of the through hole of described flexible PCB.
Purpose of the present invention can also be achieved through the following technical solutions:
A kind of flexible circuit thin-film material is exclusively used in led light source, it is characterized in that having following film structure from the outer to the inner: aluminium coated-substrate layer-second adhesive layer-flexible PCB-first adhesive layer; Wherein, substrate layer is PET or PC or PMMA material, and second adhesive layer is a silica gel material, and flexible PCB is that PI material and its outer surface have printed circuit, and first adhesive layer is the PAS glue material.
Purpose of the present invention can also be achieved through the following technical solutions:
A kind of preparation method of light source module, it is characterized in that may further comprise the steps: S1. provides metallic heat radiating plate; S2. surface treatment is promptly carried out cleaning surfaces to metallic heat radiating plate and is handled; S3. print solder paste is promptly at the surface printing tin cream of metallic heat radiating plate; S4. surface mount promptly provides light emitting diode, and is mounted on the surface of metallic heat radiating plate; S5. welding promptly is welded in the metallic heat radiating plate surface by solder reflow with light emitting diode; S6., flexible PCB is provided, and the outer surface of flexible PCB has the contact that is used for the light emitting diode wiring, and the inner surface of flexible PCB is provided with first adhesive layer, and flexible PCB has the through hole that is complementary with the light emitting diode position; S7. flexible PCB is sticked; S8. bonding wire, i.e. bonding wire between the contact of the electrode of light emitting diode and flexible PCB; S9., surperficial pad pasting is provided, and the film structure of surperficial pad pasting is: aluminium coated-substrate layer-second adhesive layer, wherein second adhesive layer is soft silica gel material.
The preparation method of light source module is characterized in that: the described welding of S5 step also comprises preheating step, promptly through before the welding zone metallic heat radiating plate is being preheated to 190-210 ℃, and preheating realizes by hot blast or infra-red radiation mode.
Light source module of the present invention, light emitting diode directly is arranged at metallic heat radiating plate by the MST mode, and heat radiation directly is suitable for the automation batch jobs on the other hand on the one hand.Compared with prior art, flexible PCB is more convenient and reliable with combining of metallic heat radiating plate, and circuit board can not become flexible, and the probability of nation's alignment broken string reduces, and the performance of light source module is more stable.
Description of drawings
Fig. 1 is the schematic diagram of first embodiment of the invention.
Fig. 2 is the flow chart of fifth embodiment of the invention.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing.
With reference to figure 1, first embodiment of the invention is a kind of light source module, compriseslight emitting diode 102, also comprises metallicheat radiating plate 101, andlight emitting diode 102 directly is arranged at metallicheat radiating plate 101 by the SMT mode; This light source module also comprisesflexible PCB 105, andflexible PCB 105 fronts have printedcircuit 106, andflexible PCB 105 reverse side are located at metallicheat radiating plate 101 by the PAS sticker, i.e. rete shown in 104 among Fig. 1;Flexible PCB 105 has through hole, and describedlight emitting diode 102 is arranged in the through hole; Thelight emitting diode 102 of present embodiment refers to be used for the light emitting diode of surface patch, one of difference of the light emitting diode of using with common plug-in unit is that the link of internal circuit and external circuit is to treat welding electrode, rather than pin, treat that welding electrode is positioned at the side or the top edge of light emitting diode.In the present embodiment,light emitting diode 102 haselectrode 107, andelectrode 107 connects described printedcircuit 106 by nation'salignment 108; This light source module also comprises layer ofsilica gel 109, and described printedcircuit 106, describednation alignment 108 all are coated on layer ofsilica gel 109; This light source module also comprises thesubstrate layer 110 that is arranged on the layer of silica gel, and the outer surface of substrate layer has aluminium coated 111; Described layer ofsilica gel 109, describedsubstrate layer 110, described aluminium coated 111 also all have and the corresponding hole of the through hole of described flexible PCB 105.Compare with common circuit board, flexible PCB not only rigidity is little, and has certain elasticity; when light source because of lighting or extinguishing when producing in short-term the temperature difference; flexible PCB with the synchronous breathing of metallic heat radiating plate, reduces protection nation alignment to the impulsive force of nation's alignment greatly on certain program.
In the present embodiment, has soldering-tin layer 103 between metallicheat radiating plate 101 and the light emitting diode 102.Described aluminium coated 111 outer surfaces also have the protective layer (not shown), and protective layer is to plate the self-cleaning layer of the titanium dioxide that is provided with by vacuum, protect 111 genus of aluminizing not to be subjected to scratch on the one hand, are convenient to cleaning on the other hand.In the present embodiment, described aluminium coated 111 is coloured transparent, and as a kind of conversion scheme of originally executing example, aluminium coated 111 also can be that the hyaline layer of decorating look is arranged.In the present embodiment, describedsubstrate layer 110 is the PET material, and describedflexible circuit flaggy 105 is the PI material.
Second embodiment of the present invention is a kind of light source module, comprises light emitting diode, it is characterized in that: also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode; Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is attached at metallic heat radiating plate by silica gel, and described silica gel constitutes first layer of silica gel; Flexible PCB and described first layer of silica gel synchronously have through hole, and described light emitting diode is arranged in the through hole; Light emitting diode has electrode, and electrode connects described printed circuit by nation's alignment; This light source module also comprises second layer of silica gel, and described printed circuit, described nation alignment all are coated on second layer of silica gel; This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer has aluminium coated; Described second layer of silica gel, described substrate layer, described aluminium coated also all have and the corresponding hole of the through hole of described flexible PCB.
The 3rd embodiment of the present invention is a kind of light source module, comprises light emitting diode, and it is characterized in that: also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode; Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is located at metallic heat radiating plate by the PAS sticker; Flexible PCB has through hole, and described light emitting diode is arranged in the through hole; Light emitting diode has electrode, and electrode connects described printed circuit by nation's alignment; This light source module also comprises layer of silica gel, and described printed circuit, described nation alignment all are coated on layer of silica gel; This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer is by the pressure sensitive adhesive aluminium foil layer that has been sticked; Described layer of silica gel, described substrate layer, described aluminium foil layer also all have and the corresponding hole of the through hole of described flexible PCB.
The 4th embodiment of the present invention is a kind of flexible circuit thin-film material, is exclusively used in led light source, it is characterized in that having following film structure from the outer to the inner: aluminium coated-substrate layer-second adhesive layer-flexible PCB-first adhesive layer; Wherein, substrate layer is PET or PC or PMMA material, and second adhesive layer is a silica gel material, and flexible PCB is that PI material and its outer surface have printed circuit, and first adhesive layer is the PAS glue material.
With reference to figure 2, the 5th embodiment of the present invention is a kind of preparation method of light source module, and it is characterized in that may further comprise the steps: S1. provides metallic heat radiating plate; S2. surface treatment is promptly carried out cleaning surfaces to metallic heat radiating plate and is handled; S3. print solder paste is promptly at the surface printing tin cream of metallic heat radiating plate; S4. surface mount promptly provides light emitting diode, and is mounted on the surface of metallic heat radiating plate; S5. welding promptly is welded in the metallic heat radiating plate surface by solder reflow with light emitting diode; S6., flexible PCB is provided, and the outer surface of flexible PCB has the contact that is used for the light emitting diode wiring, and the inner surface of flexible PCB is provided with first adhesive layer, and flexible PCB has the through hole that is complementary with the light emitting diode position; S7. flexible PCB is sticked; S8. bonding wire, i.e. bonding wire between the contact of the electrode of light emitting diode and flexible PCB; S9., surperficial pad pasting is provided, and the film structure of surperficial pad pasting is: aluminium coated-substrate layer-second adhesive layer, wherein second adhesive layer is soft silica gel material.In the present embodiment, the described welding of S5 step also comprises preheating step, promptly through before the welding zone metallic heat radiating plate is being preheated to 190-210 ℃, and preheating realizes by hot blast or infra-red radiation mode.
Claims (10)
1. a light source module comprises light emitting diode, it is characterized in that:
Also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode;
Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is located at metallic heat radiating plate by the PAS sticker;
Flexible PCB has through hole, and described light emitting diode is arranged in the through hole;
Light emitting diode has electrode, and electrode connects described printed circuit by nation's alignment;
This light source module also comprises layer of silica gel, and described printed circuit, described nation alignment all are coated on layer of silica gel;
This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer has aluminium coated;
Described layer of silica gel, described substrate layer, described aluminium coated also all have and the corresponding hole of the through hole of described flexible PCB.
2. light source module according to claim 1 is characterized in that: have soldering-tin layer between metallic heat radiating plate and the light emitting diode.
3. light source module according to claim 1 is characterized in that: described aluminium coated outer surface also has protective layer, and protective layer is the self-cleaning layer of titanium dioxide that is provided with by the vacuum plating.
4. light source module according to claim 1 is characterized in that: described aluminium coated is coloured transparent.
5. light source module according to claim 1 is characterized in that: have soldering-tin layer between metallic heat radiating plate and the light emitting diode; Described aluminium coated outer surface also has protective layer, and protective layer is the self-cleaning layer of titanium dioxide that is provided with by the vacuum plating; Described substrate layer is the PET material, and described flexible circuit flaggy is the PI material.
6. a light source module comprises light emitting diode, it is characterized in that:
Also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode;
Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is attached at metallic heat radiating plate by silica gel, and described silica gel constitutes first layer of silica gel;
Flexible PCB and described first layer of silica gel synchronously have through hole, and described light emitting diode is arranged in the through hole;
Light emitting diode has electrode, and electrode connects described printed circuit by nation's alignment;
This light source module also comprises second layer of silica gel, and described printed circuit, described nation alignment all are coated on second layer of silica gel;
This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer has aluminium coated;
Described second layer of silica gel, described substrate layer, described aluminium coated also all have and the corresponding hole of the through hole of described flexible PCB.
7. a light source module comprises light emitting diode, it is characterized in that:
Also comprise metallic heat radiating plate, light emitting diode directly is arranged at metallic heat radiating plate by the SMT mode;
Also comprise flexible PCB, the flexible PCB front has printed circuit, and reverse side is located at metallic heat radiating plate by the PAS sticker;
Flexible PCB has through hole, and described light emitting diode is arranged in the through hole;
Light emitting diode has electrode, and electrode connects described printed circuit by nation's alignment;
This light source module also comprises layer of silica gel, and described printed circuit, described nation alignment all are coated on layer of silica gel;
This light source module also comprises the substrate layer that is arranged on the layer of silica gel, and the outer surface of substrate layer is by the pressure sensitive adhesive aluminium foil layer that has been sticked;
Described layer of silica gel, described substrate layer, described aluminium foil layer also all have and the corresponding hole of the through hole of described flexible PCB.
8. a flexible circuit thin-film material is exclusively used in led light source, it is characterized in that having following film structure from the outer to the inner: aluminium coated-substrate layer-second adhesive layer-flexible PCB-first adhesive layer; Wherein, substrate layer is PET or PC or PMMA material, and second adhesive layer is a silica gel material, and flexible PCB is that PI material and its outer surface have printed circuit, and first adhesive layer is the PAS glue material.
9. the preparation method of a light source module is characterized in that may further comprise the steps:
S1., metallic heat radiating plate is provided;
S2. surface treatment is promptly carried out cleaning surfaces to metallic heat radiating plate and is handled;
S3. print solder paste is promptly at the surface printing tin cream of metallic heat radiating plate;
S4. surface mount promptly provides light emitting diode, and is mounted on the surface of metallic heat radiating plate;
S5. welding promptly is welded in the metallic heat radiating plate surface by solder reflow with light emitting diode;
S6., flexible PCB is provided, and the outer surface of flexible PCB has the contact that is used for the light emitting diode wiring, and the inner surface of flexible PCB is provided with first adhesive layer, and flexible PCB has the through hole that is complementary with the light emitting diode position;
S7. flexible PCB is sticked;
S8. bonding wire, i.e. bonding wire between the contact of the electrode of light emitting diode and flexible PCB;
S9., surperficial pad pasting is provided, and the film structure of surperficial pad pasting is: aluminium coated-substrate layer-second adhesive layer, wherein second adhesive layer is soft silica gel material.
10. the preparation method of light source module according to claim 9 is characterized in that: the described welding of S5 step also comprises preheating step, promptly through before the welding zone metallic heat radiating plate is being preheated to 190-210 ℃, and preheating realizes by hot blast or infra-red radiation mode.
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