A kind of active matrix/organic light emitting display and manufacturing approach thereofTechnical field
The present invention relates to a kind of active matrix/organic light emitting display and manufacturing approach thereof, relate in particular to a kind of array base palte and manufacturing approach thereof that can effectively increase storage capacitors.
Background technology
In recent years, because in light weight, advantage such as volume is little, flat-panel monitor especially LCD (LCD) and OLED (OLED) is widely used in display terminals such as cell phone, digital camera, notebook computer and panel TV.Owing to have brightness, viewing angle properties, response speed and the display effect that is superior to LCD, OLED is acknowledged as flat-panel monitor of future generation, and particularly the advantage of active-matrix OLED (AMOLED) is more outstanding.AMOLED realizes luminous Presentation Function through on thin-film transistor (TFT) array base palte, forming the OLED pixel device.
In making that in order to improve exploration on display resolution ratio Pixel Dimensions dwindles; The area that can be used to place reservior capacitor in each pixel also must relatively dwindle; With the maintenance aperture ratio of pixels, so the researcher seeks the minimized method of the area that reservior capacitor is required all the time.At present, the dot structure of active matrix/organic light emitting display is as shown in Figure 1, and Fig. 2 is the equivalent circuit diagram of Fig. 1 dot structure; This pixel comprisesgate line 111, thefirst metal electrodes 112, as the grid of driving transistors; One data wire, 121, thesecond metal electrodes 122 are as drive signal.Wherein storage capacitors 12 is made up offirst metal electrode 112, insulating barrier andsecond metal electrode 122, because metal level is a light-proof material, therefore when increasing the metal electrode area with the increase charge storage capacity, will reduce aperture ratio of pixels.In order to remain in the time that shows a two field picture, the display effect of pixel does not change, and must design the electric capacity with certain storage capacitors value.Yet, when improving resolution,, can influence aperture ratio of pixels unavoidably in order to keep the area of reservior capacitor.Therefore, under the situation that does not influence aperture ratio of pixels, increase charge storage capacity; Or under the situation of the pixel aperture ratio that increases OLED, keep charge storage capacity, becoming in the AMOLED manufacture process has one of problem to be solved.
Summary of the invention
To the problems referred to above, the purpose of this invention is to provide a kind of active matrix/organic light emitting display and manufacturing approach thereof, to solve the contradiction between capacitance and the aperture opening ratio with novel storage capacitor structure.
The objective of the invention is to be achieved through following technical scheme:
The invention provides a kind of active matrix/organic light emitting display, comprise a substrate; Be disposed at a plurality of pixels on this substrate, and be arranged; Many the data wires of configured in parallel between pixel; Configured in parallel is between pixel and the multi-strip scanning line vertical with data wire.The reservior capacitor that has a lamination reservior capacitor structure in the pixel region of above-mentioned pixel, this lamination reservior capacitor structure comprises first reservior capacitor, second reservior capacitor, the 3rd reservior capacitor.First reservior capacitor is made up of first conductive layer, second conductive layer and first insulating barrier between this first conductive layer and this second conductive layer, and wherein first conductive layer is a polysilicon layer, and second conductive layer is a first metal layer.Second reservior capacitor is made up of second conductive layer, the 3rd conductive layer and second insulating barrier between this second conductive layer and the 3rd conductive layer, and wherein the 3rd conductive layer is second metal level.The 3rd reservior capacitor is made up of the 3rd conductive layer, the 4th conductive layer and the 3rd insulating barrier between the 3rd conductive layer and the 4th conductive layer, and wherein the 4th conductive layer is a transparent electrode layer.Above-mentioned first conductive layer and the 3rd conductive layer form and electrically contact, and said second conductive layer and the 4th conductive layer form and electrically contact, and first reservior capacitor, second reservior capacitor and the 3rd reservior capacitor are parallel with one another.
The present invention also provides a kind of manufacturing approach of active matrix/organic light emitting display, may further comprise the steps:
Form first reservior capacitor, this first reservior capacitor is made up of first conductive layer, second conductive layer and first insulating barrier between this first conductive layer and this second conductive layer;
Form second reservior capacitor, this second reservior capacitor is made up of second conductive layer, the 3rd conductive layer and second insulating barrier between this second conductive layer and the 3rd conductive layer;
Connect first conductive layer and the 3rd conductive layer electrically contacts with formation;
Form the 3rd reservior capacitor, the 3rd reservior capacitor is made up of the 3rd conductive layer, the 4th conductive layer and the 3rd insulating barrier between the 3rd conductive layer and the 4th conductive layer;
Connect second conductive layer and the 4th conductive layer electrically contacts with formation.
Technical scheme of the present invention can effectively improve the storage capacitors value of pixel, reduces the not area of luminescent metal, improves aperture ratio of pixels, and then improves the brightness of pixel, promotes the image quality of panel.
Description of drawings
Fig. 1 is a kind of dot structure sketch map of active matrix/organic light emitting display;
Fig. 2 is a kind of dot structure equivalent circuit diagram of active matrix/organic light emitting display;
Fig. 3 is the dot structure sketch map of active matrix/organic light emitting display of the present invention;
Fig. 4 A forms the sketch map of polysilicon semiconductor layer for the present invention;
Fig. 4 B is the sketch map of deposition gate insulation layer;
Fig. 4 C is for forming the sketch map of grid and the first metal layer;
Fig. 4 D is the sketch map of deposition interlayer insulating film;
Fig. 4 E is for forming the sketch map of contact hole pattern;
Fig. 4 F is the sketch map of formation source, drain electrode and second metal level;
Fig. 4 G is the sketch map of deposit passivation layer;
Fig. 4 H is for forming the sketch map of contact hole pattern;
Fig. 4 I is for forming the sketch map of transparent electrode layer;
Fig. 5 is the equivalent circuit diagram of lamination reservior capacitor of the present invention.
Embodiment
For making foregoing of the present invention more obviously understandable, hereinafter is special lifts preferred embodiment, and combines accompanying drawing to elaborate as follows.
Embodiment
Fig. 3 is the dot structure sketch map of active matrix/organic light emitting display of the present invention.This dot structure comprises, onescan line 301, onedata wires 302, onedrive voltage line 303, one switching thin-film transistors 304, a drivethin film transistors 305, astorage capacitors 306 and a viewing area 307.Fig. 4 A~4I is the formation sketch map of each processing step of A-A ' section among Fig. 3.Shown in Fig. 4 A, at first on array base palte 20 (like glass substrate), deposit a resilient coating (not shown) successively, then continue the deposition semi-conductor layer, be generally amorphous silicon layer.Adopt the method for photoetching then, form semiconductor island figure 201 and 202, adopt quasi-molecule laser annealing (ELA) or solid phase crystallization methods such as (SPC) again, form polysilicon layer.Then, adopt the chemical vapor deposition (CVD) method, on polysilicon layer, continue deposition gate insulation layer 31, shown in Fig. 4 B.Sputter the first metal layer on gate insulation layer 31 adopts photoetching method to formgrid 211 and thefirst metal layer 212, shown in Fig. 4 C.Then, shown in Fig. 4 D, adopt the CVD method to form insulating barrier 32.Adopt the method for photoetching, oninsulating barrier 32, form contact hole pattern, adopt the method for etching, on insulating barrier, form contact hole 321,322,323 and 324, the position is shown in Fig. 4 E.Then, shown in Fig. 4 F, deposition second metal level oninsulating barrier 32, and the method for employing photoetching form thesource electrode 221 and thedrain electrode 222 of switching TFT, and second metal level 223.Wherein,drain electrode 222 is connected with thefirst metal layer 212 throughcontact hole 324 again, and as the grid of drive TFT, the while is also as the electrode of storage capacitance;Second metal level 223 andpolysilicon layer 202 is connected throughcontact hole 323, forms the electrode of storage capacitors.Then, shown in Fig. 4 G, adopt the method for CVD, continue deposition passivation insulation 33, and shown in Fig. 4 H, utilize lithographic technique, form contact hole 331.At last, the method as Fig. 4 I adopts sputter forms transparent electrode layers such as a tin indium oxide (ITO) or indium zinc oxide, and adopts the method for photoetching, formationtransparent electrode layer 231.
Fig. 5 is the equivalent circuit diagram of lamination reservior capacitor of the present invention, and as shown in the figure, the structure of the present invention's lamination reservior capacitor comprises the first reservior capacitor C1, the second reservior capacitor C2, the 3rd reservior capacitor C3.C1 is made up of firstconductive layer 51, secondconductive layer 52 and first insulating barrier 501 between this first conductive layer and this second conductive layer; Wherein firstconductive layer 51 ispolysilicon layer 202; Secondconductive layer 52 is thefirst metal layer 212, the first insulating barriers 501 and is gate insulation layer 31.C2 is made up of secondconductive layer 52, the 3rdconductive layer 53 and second insulating barrier 502 between this second conductive layer and the 3rd conductive layer, and wherein the 3rdconductive layer 53 is second metal level, 223, the second insulating barriers 502 and is insulating barrier 32.C3 is made up of the 3rdconductive layer 53, the 4thconductive layer 54 and the 3rd insulating barrier 503 between the 3rd conductive layer and the 4th conductive layer, and wherein the 4thconductive layer 54 istransparent electrode layer 231, the three insulating barriers 503 and is passivation insulation 33.Firstconductive layer 51 and the 3rdconductive layer 53 form throughcontact hole 323 and electrically contact, and have identical current potential, and secondconductive layer 52 and the 4thconductive layer 54 form throughcontact hole 324 and electrically contact, and have identical current potential.In conjunction with Fig. 5,, can learn that said capacitor C 1, C2 and C3 are parallel with one another, total capacitance C=C1+C2+C3 according to the relation between each electric capacity.Therefore, adopt technical scheme of the present invention, under the situation that does not change pixel aperture ratio, can effectively increase the storage capacitors value, and then improve the brightness of pixel, promote the image quality of panels such as mobile communication equipment, video playback apparatus, display device.
Certainly, the present invention also can only adopt any three conductive layers composition storage capacitors in first to fourth conductive layer, can reach the effect that increases storage capacitors equally.
Though the present invention is to disclose as above than preferable embodiment; Yet it is not in order to limit the present invention; Anyly be familiar with this technological personage, do not breaking away from the spirit and scope of the present invention, when doing various changes and retouching; Therefore, protection scope of the present invention is as the criterion when the claim with application defines.