CN101923505A - Test system and test method for Peripheral Component Interconnect (PCI) fast slot - Google Patents

Abstract

The invention discloses a test system and a test method of a peripheral component interconnect express slot, wherein the test system comprises: the peripheral component interconnect express pin interface, the peripheral component interconnect express slot interface, the processing module, the data transmission module and the power supply module. The peripheral component interconnect fast pin interface is used for connecting the mainboard; the peripheral component interconnection quick slot interface is used for connecting a board to be tested; the processing module carries out a mainboard test program through the peripheral component interconnection quick pin interface; the data transmission module is switched to different data transmission modes to provide the data transmission mode corresponding to the mainboard according to the mainboard test program, and further to enable the mainboard and the board to be tested to carry out the test program of the board to be tested; and the power module is used for supplying or cutting off the power supply of the board to be tested so as to provide hot plugging function.

Description

Translated fromChinese

外围组件互连快速插槽的测试系统及测试方法Test system and test method for peripheral component interconnection fast slot

技术领域technical field

本发明是有关于一种外围组件互连快速插槽(peripheral component interconnect express)的测试系统，且特别是有关于一种外围组件互连快速插槽的测试系统及测试方法。The present invention relates to a testing system for a peripheral component interconnect express, and in particular to a testing system and a testing method for a peripheral component interconnect express.

背景技术Background technique

外围组件互连快速接口是一种广为使用的计算机数据传输接口。在市面常见的主机板上，往往都设置有这样的接口，以进行数据的传输。然而制造厂商在外围组件互连快速接口的测试上，对于主机板跟具有外围组件互连快速接口的功能卡，如网络卡、显示卡或声卡，须要分别进行测试，而无法同时对主机板及功能卡进行双向的测试。并且，在对功能卡进行测试时，如欲更换功能卡，必须要先切断主机板的电源，才可进行更换的动作，以避免系统产生严重的硬件错误。这样的测试流程，是十分费时且不便的。Peripheral component interconnection fast interface is a widely used computer data transmission interface. Common motherboards in the market are often provided with such interfaces for data transmission. However, in the test of the fast interface for interconnecting peripheral components, the manufacturer needs to test the main board and the function card with the fast interface for interconnecting peripheral components, such as a network card, a display card or a sound card, respectively, and cannot test the main board and the fast interface of the peripheral component at the same time. The function card is tested in both directions. Moreover, when the function card is tested, if the function card is to be replaced, the power supply of the motherboard must be cut off before the replacement can be performed, so as to avoid serious hardware errors in the system. Such a testing process is very time-consuming and inconvenient.

因此，如何设计一个新的外围组件互连快速插槽的测试系统及测试方法，能够同时对主机板及功能卡进行测试，且提供一个在不须切断主机板电源即可更换功能卡以继续进行测试的机制，乃为此一业界亟待解决的问题。Therefore, how to design a new test system and test method for interconnecting fast slots of peripheral components can test the main board and the function card at the same time, and provide a function card that can be replaced without cutting off the power supply of the main board to continue The testing mechanism is an urgent problem for the industry.

发明内容Contents of the invention

因此，本发明的目的在于提供一种外围组件互连快速插槽的测试系统及测试方法，能够同时对主机板及功能卡进行测试，且提供一个在不须切断主机板电源即可更换功能卡以继续进行测试的机制。Therefore, the purpose of the present invention is to provide a kind of test system and test method of quick slot interconnection of peripheral components, can test motherboard and function card at the same time, and provide a function card that can be replaced without cutting off the power supply of the motherboard. to continue the testing mechanism.

为了实现上述目的，本发明提供一种外围组件互连快速插槽的测试系统，包含：外围组件互连快速接脚接口、外围组件互连快速插槽接口、处理模块、数据传输模块以及电源模块。外围组件互连快速接脚接口用以连接主机板；外围组件互连快速插槽接口用以连接待测板；处理模块用以通过外围组件互连快速接脚接口进行对主机板的主机板测试程序；数据传输模块用以切换于不同的数据传输模式，以根据主机板测试程序提供对应主机板的数据传输模式，以进一步通过外围组件互连快速接脚接口及外围组件互连快速插槽接口使主机板及待测板间进行待测板测试程序；以及电源模块，用以在待测板连接于外围组件互连快速插槽接口时，供应或切断待测板的电源，以提供热插拔作用。In order to achieve the above object, the present invention provides a test system for a peripheral component interconnection quick slot, comprising: a peripheral component interconnection quick pin interface, a peripheral component interconnection quick slot interface, a processing module, a data transmission module and a power supply module . The peripheral component interconnection quick pin interface is used to connect the motherboard; the peripheral component interconnection quick slot interface is used to connect the board to be tested; the processing module is used to perform the motherboard test on the motherboard through the peripheral component interconnection quick pin interface program; the data transmission module is used to switch between different data transmission modes, so as to provide the data transmission mode corresponding to the motherboard according to the motherboard test program, so as to further interconnect the fast pin interface and the peripheral component interconnection fast slot interface through the peripheral components The test program of the board under test is carried out between the main board and the board under test; and the power supply module is used to supply or cut off the power supply of the board under test when the board under test is connected to the fast slot interface of the peripheral component interconnection, so as to provide hot plug pulling effect.

为了实现上述目的，本发明还提供一种外围组件互连快速插槽的测试方法，包含下列步骤：提供外围组件互连快速插槽的测试系统，包含外围组件互连快速接脚接口以及外围组件互连快速插槽接口，分别用以连接主机板以及待测板；对主机板进行主机板测试程序；供应待测板电源；根据主机板测试程序切换至对应主机板的数据传输模式；根据数据传输模式，通过外围组件互连快速接脚接口及外围组件互连快速插槽接口使主机板及待测板间进行待测板测试程序；以及提供待测板热插拔作用，以于待测板测试完毕后，在主机板不断电时，切断待测板的电源，以直接移除待测板。In order to achieve the above object, the present invention also provides a method for testing a peripheral component interconnection quick slot, comprising the following steps: providing a test system for a peripheral component interconnection quick slot, including a peripheral component interconnection quick pin interface and a peripheral component The interconnection fast slot interface is used to connect the motherboard and the board to be tested respectively; the motherboard test program is performed on the motherboard; the power supply of the board to be tested is supplied; the data transmission mode of the corresponding motherboard is switched according to the motherboard test program; Transmission mode, through the peripheral component interconnection fast pin interface and the peripheral component interconnection fast slot interface, the test program of the board under test is carried out between the main board and the board under test; and the hot plug function of the board under test is provided for After the board test is completed, when the main board is powered off, cut off the power supply of the board to be tested, so as to directly remove the board to be tested.

应用本发明的优点在于通过主机板测试程序及待测板测试程序，可使用同一个测试系统对主机板及待测板均进行测试，并提供热插拔机制，在不须对主机板进行断电的情形下，直接更换待测板以进行其它待测板的测试，而轻易地达到上述的目的。The advantage of applying the present invention is that the same test system can be used to test both the mainboard and the board to be tested through the test program of the mainboard and the test program of the board to be tested, and provide a hot-swapping mechanism without disconnecting the mainboard. In the case of electricity, directly replace the board to be tested to test other boards to be tested, so as to easily achieve the above purpose.

附图说明Description of drawings

为让本发明的上述和其它目的、特征、优点与实施例能更明显易懂，所附附图的说明如下：In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the accompanying drawings are described as follows:

图1为本发明的一实施例的外围组件互连快速插槽的测试系统的方块图；Fig. 1 is the block diagram of the test system of the quick socket of peripheral component interconnection of an embodiment of the present invention;

图2为本发明的一实施例的测试系统、主机板及待测板接合的立体图；以及Fig. 2 is the perspective view of the test system of an embodiment of the present invention, main board and board under test joint; And

图3为本发明的另一实施例的外围组件互连快速插槽的测试方法的流程图。FIG. 3 is a flowchart of a testing method for a peripheral component interconnect express slot according to another embodiment of the present invention.

【主要组件符号说明】[Description of main component symbols]

10：测试系统                 100：外围组件互连快速接脚接口10: Test system 100: Peripheral component interconnection fast pin interface

101：电源                    104：处理模块101: Power supply 104: Processing module

102：外围组件互连快速插槽接口106：数据传输模块102: Peripheral component interconnection fast slot interface 106: Data transmission module

108：电源模块                110：串行式电气式可抹除只读存储器108: Power module 110: Serial electrical erasable read-only memory

12：主机板            121：测试数据12: Motherboard 121: Test data

120：主机板外围组件互连快速插槽接口14：待测板120: Express slot interface for interconnection of peripheral components of the motherboard 14: Board to be tested

140：待测板外围组件互连快速接脚接口141：测试结果140: Quick pin interface for interconnection of peripheral components of the board to be tested 141: Test results

具体实施方式Detailed ways

请参照图1，为本发明的一实施例的外围组件互连快速插槽的测试系统10的方块图。测试系统10包含：外围组件互连快速接脚接口100、外围组件互连快速插槽接口102、处理模块104、数据传输模块106以及电源模块108。外围组件互连快速接脚接口100用以连接主机板12，而外围组件互连快速插槽接口102用以连接待测板14。须注意的是，主机板12实质上亦包含主机板外围组件互连快速插槽接口120，而待测板14上亦包含待测板外围组件互连快速接脚接口140。因此，测试系统10的外围组件互连快速接脚接口100连接主机板12的主机板外围组件互连快速插槽接口120，而测试系统10的外围组件互连快速插槽接口102是连接待测板14的待测板外围组件互连快速接脚接口140。Please refer to FIG. 1 , which is a block diagram of atest system 10 for a peripheral component interconnect express socket according to an embodiment of the present invention. Thetesting system 10 includes: a peripheral component interconnectionquick pin interface 100 , a peripheral component interconnectionquick slot interface 102 , aprocessing module 104 , adata transmission module 106 and apower supply module 108 . The peripheral component interconnectionquick pin interface 100 is used for connecting themotherboard 12 , and the peripheral component interconnectionquick socket interface 102 is used for connecting the board undertest 14 . It should be noted that themotherboard 12 substantially also includes the peripheral component interconnectionquick slot interface 120 of the motherboard, and the board undertest 14 also includes the peripheral component interconnectionquick pin interface 140 of the board under test. Therefore, the peripheral component interconnectionquick pin interface 100 of thetest system 10 is connected to the motherboard peripheral component interconnectionquick slot interface 120 of themotherboard 12, and the peripheral component interconnectionquick slot interface 102 of thetest system 10 is connected to the The board peripheral components under test ofboard 14 are interconnected withquick pin interface 140 .

请同时参照图2。图2为本发明的一实施例的测试系统10、主机板12及待测板14接合的立体图。本实施例中，测试系统10为一测试板，在连接主机板12及待测板14后，成为三层式的结构。Please also refer to Figure 2. FIG. 2 is a perspective view of the connection of thetest system 10 , themain board 12 and the board undertest 14 according to an embodiment of the present invention. In this embodiment, thetest system 10 is a test board, which forms a three-layer structure after connecting themain board 12 and the board undertest 14 .

请继续参照图1。处理模块104用以通过外围组件互连快速接脚接口100进行对主机板12的主机板测试程序。主机板测试程序实质上包含连接(hot-plug)测试、总线宽度测试、总线速度测试以及电源测试。连接测试是用以确定测试系统10的外围组件互连快速接脚接口100与主机板12的主机板外围组件互连快速插槽接口120已经建立了实质的连接。总线宽度测试及总线速度测试用以测试出主机板12的主机板外围组件互连快速插槽接口120的传输频宽以及传输速度。而电源测试则用以测试主机板12的电源供应是否正常。上述的测试，均是对于主机板12的主机板外围组件互连快速插槽接口120上的各脚位进行的必要测试，以确保不论是数据传输或是电源的供应都是正常运作的。Please continue to refer to Figure 1. Theprocessing module 104 is used for performing a motherboard test program on themotherboard 12 through the peripheral component interconnectionquick pin interface 100 . The motherboard test program essentially includes a hot-plug test, a bus width test, a bus speed test, and a power supply test. The connection test is used to confirm that a substantial connection has been established between the PIIquick pin interface 100 of thetesting system 10 and the MPIquick slot interface 120 of themotherboard 12 . The bus width test and the bus speed test are used to test the transmission bandwidth and transmission speed of the motherboard peripheral components interconnectionexpress slot interface 120 of themotherboard 12 . The power test is used to test whether the power supply of themotherboard 12 is normal. The above-mentioned tests are all necessary tests for the pins on the motherboard peripheral component interconnectionquick slot interface 120 of themotherboard 12 to ensure normal operation of both data transmission and power supply.

而在其它实施例中，为因应其它的功能，亦可由使用者在设定测试系统10时，增加对系统管理总线(system management bus；SM bus)、数据传输压力、烧录以及远程唤醒等功能的测试，以使主机板对各脚位的测试程序更加完整。其中系统管理总线测试用以对主机板12上的其它已知地址的模块进行测试，数据传输压力测试是用以测试在连续且大量的数据传输后，主机板外围组件互连快速插槽接口120是否仍能正常工作。测试系统10在一实施例中还包含串行式电气式可抹除只读存储器(Electrically Erasable Programmable Read Only Memory；EEPROM)110，烧录测试即用以对串行式电气式可抹除只读存储器110进行烧录动作的测试。而远程唤醒测试则是用以测试透过网络封包(未绘示)来对主机板12进行唤醒动作的测试。In other embodiments, in response to other functions, the user can also add functions such as system management bus (system management bus; SM bus), data transmission pressure, programming and remote wake-up when setting thetest system 10. The test to make the motherboard test program for each pin more complete. Wherein the system management bus test is used to test other modules with known addresses on themain board 12, and the data transmission stress test is used to test thefast slot interface 120 of the main board peripheral component interconnection after continuous and a large amount of data transmission. whether it still works properly. In one embodiment, thetest system 10 also includes a serial electrical erasable read-only memory (Electrically Erasable Programmable Read Only Memory; EEPROM) 110, and the burning test is used for the serial electrical erasable read-only memory. Thememory 110 performs a test of the programming operation. The remote wake-up test is used to test the wake-up action of themotherboard 12 through network packets (not shown).

数据传输模块106用以切换于不同的数据传输模式，以根据主机板测试程序提供对应主机板12的数据传输模式。在一实施例中，数据传输模式可包含Gen1x4、Gen1x8、Gen1x16、Gen2x4、Gen2x8及Gen2x16。在前述的主机板测试程序完成后，处理模块104即可得知主机板外围组件互连快速插槽接口120的数据传输速度及宽度，而可进一步使数据传输模块106切换至对应主机板12的主机板外围组件互连快速插槽接口120的数据传输模式。在确定数据传输模式后，测试系统10即可进一步通过外围组件互连快速接脚接口100及外围组件互连快速插槽接口102，使主机板12及待测板14间，进行待测板测试程序。Thedata transmission module 106 is used for switching between different data transmission modes, so as to provide a data transmission mode corresponding to themotherboard 12 according to the motherboard test program. In one embodiment, the data transmission modes may include Gen1x4, Gen1x8, Gen1x16, Gen2x4, Gen2x8, and Gen2x16. After the aforementioned main board test program is completed, theprocessing module 104 can know the data transmission speed and width of the main board peripheral component interconnectionfast slot interface 120, and can further make thedata transmission module 106 switch to the correspondingmain board 12. The data transmission mode of the motherboard peripheral component interconnectionfast slot interface 120 . After determining the data transmission mode, thetest system 10 can further pass the peripheral component interconnectionfast pin interface 100 and the peripheral component interconnectionfast slot interface 102, so that themotherboard 12 and the board undertest 14 can be tested for the board under test. program.

待测板测试程序包含系统管理总线测试、烧录测试、总线宽度测试、总线速度测试以及待测板功能测试。其中总线宽度及总线速度测试是用以测试出待测板外围组件互连快速接脚接口140的数据传输宽度及速度。系统管理总线测试是用以对待测板14上的其它已知地址的模块进行测试。待测板14在一实施例中亦可包含串行式电气式可抹除只读存储器(未绘示)，烧录测试即用以对待测板14上的串行式电气式可抹除只读存储器进行烧录动作的测试。待测板的功能实质上是因应不同的待测板而有不同的功能测试。举例来说，待测板14可为显示卡、声卡或网络卡。因此，待测板功能测试可因应上述的不同的种类而进行显示测试、音效播放测试或网络传输测试等等。其中，用以进行待测板测试程序的测试数据121是由主机板14经由测试系统10的外围组件互连快速接脚接口100、数据传输模块106以及外围组件互连快速插槽接口102传输至待测板14。而待测板测试程序产生的测试结果141是由待测板14经由外围组件互连快速插槽接口102、数据传输模块106以及外围组件互连快速接脚接口104传输至主机板12。The test program of the board under test includes system management bus test, burning test, bus width test, bus speed test and board function test. The bus width and bus speed tests are used to test the data transmission width and speed of thefast pin interface 140 for interconnecting the peripheral components of the board to be tested. The system management bus test is used to test other modules with known addresses on theboard 14 to be tested. Theboard 14 to be tested may also include a serial electrical erasable read-only memory (not shown) in one embodiment, and the burning test is used to test the serial electrical erasable read-only memory on theboard 14 Read the memory to test the burning action. The function of the board to be tested is essentially different functional tests for different boards to be tested. For example, the board undertest 14 can be a display card, a sound card or a network card. Therefore, the function test of the board under test can be performed according to the above-mentioned different types, such as display test, sound effect play test or network transmission test, and so on. Wherein, thetest data 121 for carrying out the test program of the board to be tested is transmitted to The board to be tested 14. Thetest result 141 generated by the test program of the board under test is transmitted from the board undertest 14 to themotherboard 12 via the peripheral component interconnectionquick slot interface 102 , thedata transmission module 106 and the peripheral component interconnectionquick pin interface 104 .

电源模块108用以于待测板14连接于外围组件互连快速插槽接口102时，供应或切断待测板14的电源101，以提供热插拔作用。因此，在主机板12维持电源的情况下，通过电源模块108的设置，可直接切断待测板14的电源而移除待测板，并再更换后对下一个待测板进行测试。这样的设计方式，将可避免一般在主机板未切断电源时，直接移除待测板时造成的严重硬件错误。与以往必须关闭主机板电源才能进行其它待测板的测试流程相较，将是省时省力的一项优势。Thepower module 108 is used to supply or cut off thepower supply 101 of the board undertest 14 when the board undertest 14 is connected to the peripheral component interconnectionquick slot interface 102 , so as to provide a hot swap function. Therefore, when the power supply of themotherboard 12 is maintained, through the setting of thepower module 108 , the power of the board undertest 14 can be directly cut off to remove the board under test, and the next board under test can be tested after replacement. Such a design method will avoid serious hardware errors caused by directly removing the board under test when the main board is not powered off. Compared with the previous testing process where the power of the motherboard must be turned off to proceed with other boards to be tested, it will be an advantage of saving time and effort.

图3为本发明的另一实施例的外围组件互连快速插槽的测试方法的流程图。请参照图3，外围组件互连快速插槽的测试方法包含下列步骤：在步骤301，提供外围组件互连快速插槽的测试系统，包含外围组件互连快速接脚接口以及外围组件互连快速插槽接口，分别用以连接主机板以及待测板。接着在步骤302，对主机板进行主机板测试程序。在步骤303，供应待测板电源。须注意的是，步骤303并非限制于步骤302后进行，而可以在待测板连接上测试系统的外围组件互连快速插槽后，直接开始供应电源。接着在步骤304，根据主机板测试程序切换至对应主机板的数据传输模式。根据数据传输模式，可进行步骤305，通过外围组件互连快速接脚接口及外围组件互连快速插槽接口使主机板及待测板间进行待测板测试程序；最后在步骤306，测试系统提供待测板热插拔作用，以在待测板测试完毕后，在主机板不断电时，切断待测板的电源，以直接移除待测板。FIG. 3 is a flowchart of a testing method for a peripheral component interconnect express slot according to another embodiment of the present invention. Please refer to Fig. 3, the test method of the peripheral component interconnection express slot comprises the following steps: instep 301, the test system of the peripheral component interconnection express slot is provided, comprising the peripheral component interconnection express pin interface and the peripheral component interconnection express socket The slot interface is used to connect the main board and the board under test respectively. Then instep 302, a motherboard test procedure is performed on the motherboard. Instep 303, power is supplied to the board under test. It should be noted thatstep 303 is not limited to be performed afterstep 302 , but can directly start supplying power after the board under test is connected to the peripheral component interconnection express slot of the test system. Then instep 304, switch to the data transmission mode of the corresponding motherboard according to the motherboard testing program. According to the data transmission mode, step 305 can be carried out, and the board test program is carried out between the motherboard and the board to be tested through the peripheral component interconnection fast pin interface and the peripheral component interconnection fast slot interface; finally instep 306, the test system Provide the function of hot-swapping of the board under test, so that after the test of the board is completed, when the power supply of the main board is cut off, the power of the board under test is cut off, so that the board under test can be removed directly.

应用本发明的优点在于通过主机板测试程序及待测板测试程序，可使用同一个测试系统对主机板及待测板均进行测试，并提供热插拔机制，在不须对主机板进行断电的情形下，直接更换待测板以进行其它待测板的测试。The advantage of applying the present invention is that the same test system can be used to test both the mainboard and the board to be tested through the test program of the mainboard and the test program of the board to be tested, and provide a hot-swapping mechanism without disconnecting the mainboard. In the case of power failure, directly replace the board to be tested to test other boards to be tested.

虽然本发明已以实施方式揭露如上，然其并非用以限定本发明，任何熟悉此技术的人员，在不脱离本发明的精神和范围内，当可作各种的更动与润饰，因此本发明的保护范围当视权利要求书所界定的范围为准。Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Any person familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The protection scope of the invention should be determined by the scope defined in the claims.

Claims (10)

1. the test macro of a peripheral component interconnection rapid slot is characterized in that, comprises:

The quick pin interface of one periphery component interconnection is in order to connect a motherboard;

One peripheral component interconnection rapid slot interface is in order to connect a board under test;

One processing module is in order to carry out the host board testing program to this motherboard by the quick pin interface of this periphery component interconnection;

One data transmission module, in order to switch on different data-transmission modes, so that a pair of data-transmission mode that should motherboard to be provided according to this host board testing program, carry out a board under test test procedure between this motherboard and this board under test further to make by the quick pin interface of this periphery component interconnection and this peripheral component interconnection rapid slot interface; And

A power supply of this board under test is supplied or cut off to one power module when being used to this board under test and being connected in this peripheral component interconnection rapid slot interface,, so that a hot plug action to be provided.

2. the test macro of peripheral component interconnection rapid slot according to claim 1 is characterized in that, this host board testing program comprises one and connects test, highway width test, bus speed test and a power supply test.

3. the test macro of peripheral component interconnection rapid slot according to claim 2 is characterized in that, this host board testing program also comprises System Management Bus test, a data transmission pressure test, burning test and Remote Wake Up test.

4. the test macro of peripheral component interconnection rapid slot according to claim 3 is characterized in that, also comprises a string type electric EEPROM, and this burning test is that this string type electric EEPROM is tested.

5. the test macro of peripheral component interconnection rapid slot according to claim 1, it is characterized in that this board under test test procedure comprises System Management Bus test, burning test, highway width test, bus speed test and board under test functional test.

6. the test macro of peripheral component interconnection rapid slot according to claim 5, it is characterized in that, in order to the test data of carrying out this board under test test procedure is to transfer to this board under test by this motherboard via the quick pin interface of this periphery component interconnection, this data transmission module and this peripheral component interconnection rapid slot interface, and the test result that this board under test test procedure produces is to transfer to this motherboard by this board under test via the quick pin interface of this peripheral component interconnection rapid slot interface, this data transmission module and this periphery component interconnection.

7. the method for testing of a peripheral component interconnection rapid slot is characterized in that, comprises the following step:

The test macro of one peripheral component interconnection rapid slot is provided, comprises a quick pin interface of a periphery component interconnection and a peripheral component interconnection rapid slot interface, respectively in order to connect a motherboard and a board under test;

This motherboard is carried out a host board testing program;

Supply this board under test one power supply;

Switch to data-transmission mode that should motherboard according to this host board testing program;

According to this data-transmission mode, make by the quick pin interface of this periphery component interconnection and this peripheral component interconnection rapid slot interface and to carry out a board under test test procedure between this motherboard and this board under test; And

This board under test one hot plug action is provided, after finishing, when this motherboard does not cut off the power supply, cuts off this power supply of this board under test, directly to remove this board under test in this board under test test.

8. the method for testing of peripheral component interconnection rapid slot according to claim 7 is characterized in that, the step of this motherboard being carried out this host board testing program also comprises the following step:

Carry out one and connect test;

Carry out highway width test;

Carry out bus speed test; And

Carry out a power supply test.

9. the method for testing of peripheral component interconnection rapid slot according to claim 8, it is characterized in that, this host board testing program also comprises System Management Bus test, a data transmission pressure test, burning test and Remote Wake Up test, and this board under test test procedure comprises System Management Bus test, burning test, highway width test, bus speed test and board under test functional test.

10. the method for testing of peripheral component interconnection rapid slot according to claim 9, it is characterized in that, this test macro also comprises a string type electric EEPROM, and this burning test is that this string type electric EEPROM is tested.

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