CN101915678B - Method and device for mounting piezoelectric wafer used for structure health monitoring - Google Patents
Method and device for mounting piezoelectric wafer used for structure health monitoringDownload PDFInfo
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Abstract
Translated fromChinese
Description
Translated fromChinese技术领域technical field
本发明属于结构健康监测用传感器领域，涉及用于结构健康监测的压电晶片的安装方法和装置。The invention belongs to the field of sensors for structural health monitoring, and relates to a method and a device for installing piezoelectric wafers for structural health monitoring.
背景技术Background technique
结构健康监测是一种在线无损检测技术，被广泛应用于航空航天、土木机械等工程结构，用于及时发现结构损伤破坏，提高结构安全性、延长产品服役寿命、降低运行和维护成本。Structural health monitoring is an online non-destructive testing technology, which is widely used in aerospace, civil machinery and other engineering structures to detect structural damage and damage in time, improve structural safety, prolong product service life, and reduce operation and maintenance costs.
现有的结构健康监测系统主要由以下几部分组成：1)以压电晶片为核心元件、用于发射和接受检测信号的传感器；2)数据采集和处理系统；3)数据传输和损伤诊断系统。The existing structural health monitoring system is mainly composed of the following parts: 1) A sensor with a piezoelectric chip as the core component for transmitting and receiving detection signals; 2) a data acquisition and processing system; 3) a data transmission and damage diagnosis system .
作为结构健康监测系统的核心部件，压电晶片的安装方法对系统性能有重要影响。现有的压电晶片的安装方法，有粘贴式和嵌入式两种，采用这两种方法，压电晶片的布置位置一旦确定的，是无法改变的，在传感器数量不是足够多的情况下，某些部位的损伤是无法监测到的，即存在监测盲点。这两种方式还存在以下问题：1)粘接界面不均一，造成压电晶片与待测结构之间的能量传递不均一，因而需要大量实验进行校核；2)粘接界面与压电晶片寿命低于结构寿命，且不可替换；3)传感器位置固定，因而需要大量的传感器以覆盖整个待测结构，造成结构重量增加；4)嵌入式安装方式一般是将压电晶片集成于结构中，影响了结构完整性，也不适用于薄壳结构，若传感器发生故障，不易查找和更换。As the core component of the structural health monitoring system, the installation method of the piezoelectric wafer has a significant impact on the system performance. The existing installation methods of piezoelectric wafers include sticking type and embedded type. With these two methods, once the arrangement position of piezoelectric wafers is determined, it cannot be changed. If the number of sensors is not enough, The damage in some parts cannot be monitored, that is, there are monitoring blind spots. These two methods also have the following problems: 1) the bonding interface is not uniform, resulting in uneven energy transfer between the piezoelectric wafer and the structure to be tested, thus requiring a large number of experiments to check; 2) the bonding interface and the piezoelectric wafer The service life is lower than that of the structure and cannot be replaced; 3) The position of the sensor is fixed, so a large number of sensors are required to cover the entire structure to be tested, resulting in an increase in the weight of the structure; 4) The embedded installation method generally integrates the piezoelectric chip into the structure, Structural integrity is affected, and it is not suitable for thin shell structures. If the sensor fails, it is not easy to find and replace.
发明内容Contents of the invention
本发明的目的是提供一种可方便拆卸、更换的结构健康监测用压电晶片的安装方法及其装置，使压电晶片的安装位置可灵活选择、移动，压电晶片与被测结构能量耦合具有重复性和均一性，从而实现机动式的结构健康监测。The object of the present invention is to provide a method and device for installing a piezoelectric chip for structural health monitoring that can be easily disassembled and replaced, so that the installation position of the piezoelectric chip can be flexibly selected and moved, and the energy coupling between the piezoelectric chip and the structure under test can be achieved. Repeatability and uniformity enable mobile structural health monitoring.
本发明的技术方案如下：Technical scheme of the present invention is as follows:
一种用于结构健康监测的压电晶片的安装方法，其特征在于，将压电晶片夹放在压电晶片座和被测结构表面之间，用一个开口部分紧密吸附在被测结构表面的凹形腔体把压电晶片座扣在内部，并通过凹形腔体内的弹簧向被测结构表面压迫压电晶片座，使压电晶片紧贴在被测结构表面；凹形腔的壳体采用密封材料，壳体上设有可封闭的气孔，凹形腔体的开口部分采用可吸附在被测结构表面的材料。A method for installing a piezoelectric chip for structural health monitoring, characterized in that the piezoelectric chip is sandwiched between a piezoelectric chip seat and the surface of the structure to be measured, and an opening is tightly adsorbed on the surface of the structure to be measured The concave cavity buckles the piezoelectric chip seat inside, and presses the piezoelectric chip seat to the surface of the measured structure through the spring in the concave cavity, so that the piezoelectric chip is close to the surface of the measured structure; the shell of the concave cavity The sealing material is adopted, and the air hole that can be closed is arranged on the shell, and the opening part of the concave cavity is made of a material that can be adsorbed on the surface of the measured structure.
所述弹簧的两端可以安装连接在压电晶片座与凹形腔体内表面之间，也可以分别套放或卡放在压电晶片座表面和凹形腔体内表面所设置的凸台或凹槽里，弹簧的自然伸缩方向与凹形腔体的开口端面相垂直，也就是与被测结构表面相垂直；压电晶片座与弹簧相连接后，在弹簧自然状态下伸出凹形腔体的开口端面，压电晶片座朝向被测结构的表面可以设有一个或两个以上用于放置压电晶片的凹槽，凹槽的深度小于压电晶片的厚度，将压电晶片放在凹槽位置，再压到被测结构表面，使受压后的压电晶片表面能与被测结构表面紧密贴合。测量时可以在各个凹槽里分别放置一个压电晶片，也可以根据需要选择其中的凹槽放置压电晶片。The two ends of the spring can be installed and connected between the piezoelectric wafer seat and the inner surface of the concave cavity, and can also be nested or clamped on the bosses or recesses provided on the surface of the piezoelectric wafer seat and the inner surface of the concave cavity. In the groove, the natural expansion and contraction direction of the spring is perpendicular to the opening end face of the concave cavity, that is, perpendicular to the surface of the measured structure; after the piezoelectric chip seat is connected to the spring, it extends out of the concave cavity in the natural state of the spring The opening end face of the piezoelectric wafer seat facing the structure to be tested can be provided with one or more than two grooves for placing the piezoelectric wafer. The depth of the groove is smaller than the thickness of the piezoelectric wafer. Put the piezoelectric wafer in the concave The position of the groove, and then pressed to the surface of the structure under test, so that the surface of the piezoelectric wafer after pressure can be closely attached to the surface of the structure under test. A piezoelectric wafer can be placed in each groove during measurement, or one of the grooves can be selected to place a piezoelectric wafer as required.
本方法利用真空吸附原理，先将凹形腔体开口部分贴合在被测结构表面，构成带有可封闭气孔的密闭腔体，弹簧在密闭腔体内呈压缩状态，顶在凹形腔体和压电晶片座之间，压迫压电晶片座，使压电晶片紧贴在被测结构表面，然后通过气孔减小密闭腔体内气压，使凹形腔体紧密吸附在被测结构表面，压电晶片持续紧贴在被测结构表面，利用压电晶片收发诊断信号，实现结构健康监测。This method uses the principle of vacuum adsorption. First, the opening part of the concave cavity is attached to the surface of the structure to be tested to form a closed cavity with closable air holes. Between the piezoelectric chip seats, the piezoelectric chip seat is pressed, so that the piezoelectric chip is close to the surface of the structure under test, and then the air pressure in the airtight cavity is reduced through the pores, so that the concave cavity is tightly adsorbed on the surface of the structure under test. The chip is continuously attached to the surface of the structure under test, and the piezoelectric chip is used to send and receive diagnostic signals to realize structural health monitoring.
减小密闭腔体内气压可以通过抽真空装置或密闭活塞装置，也可以采用可变形凹形腔体。The air pressure in the airtight cavity can be reduced by a vacuum device or a closed piston device, or a deformable concave cavity.
采用抽真空装置时，凹形腔体上的气孔上装有气嘴，与抽真空装置相连接，先将凹形腔体的开口贴合在被测结构表面形成带有气孔和气嘴的密闭腔体，再用抽真空装置抽去密闭腔体内的空气，使凹形腔体紧密吸附在被测结构表面，然后封闭气嘴。When the vacuum device is used, the air hole on the concave cavity is equipped with an air nozzle, which is connected with the vacuum device. First, the opening of the concave cavity is attached to the surface of the measured structure to form a closed cavity with air holes and air nozzles. , and then use a vacuum device to evacuate the air in the closed cavity, so that the concave cavity is tightly adsorbed on the surface of the measured structure, and then close the air nozzle.
采用密闭活塞时，将凹形腔体上的气孔与密闭活塞装置相连通，将凹形腔体的开口贴合在被测结构表面形成密闭腔体后，向外拉动活塞，密闭腔体内的气压减小，使凹形腔体紧密吸附在被测结构表面，然后固定活塞位置，使其保持在增大气体空间、减小气压的状态。When a closed piston is used, the air hole on the concave cavity is connected with the closed piston device, and the opening of the concave cavity is attached to the surface of the structure to be tested to form a closed cavity, and the piston is pulled outward to seal the air pressure in the cavity. Decrease, so that the concave cavity is closely adsorbed on the surface of the measured structure, and then the position of the piston is fixed to keep it in the state of increasing the gas space and reducing the air pressure.
采用可变形凹形腔体，通过凹形腔体弹性变形减小密闭腔体气压时，需要增大能与被测结构表面吸附的开口部分、即吸附软体在凹形腔体中的所占比例，使吸附软体占凹形腔壳体的大部分面积。挤压吸附软体，使其弹性变形贴合在被测结构表面，然后封闭气孔，待吸附软体部分恢复形状后，密闭腔体内的气体体积增大，气压减小，使凹形腔体紧密吸附在被测结构表面。When a deformable concave cavity is used to reduce the air pressure of the closed cavity through the elastic deformation of the concave cavity, it is necessary to increase the opening part that can be adsorbed to the surface of the measured structure, that is, the proportion of the adsorption software in the concave cavity , so that the adsorption software occupies most of the area of the concave cavity shell. Squeeze the adsorption software to make it elastically deform and fit on the surface of the measured structure, and then close the air holes. After the adsorption software partially restores its shape, the volume of the gas in the closed cavity increases and the air pressure decreases, so that the concave cavity is tightly adsorbed on the The surface of the structure to be measured.
凹形腔体的开口部分可以采用弹性材料，例如丁腈橡胶、聚氨酯或含乙烯基的聚合物材料等，对于表面比较粗糙的被测结构可以选用硅橡胶，对于具有耐油性或应避免被划伤的被测结构表面，可以选用丁腈橡胶。可根据凹形腔体的形状、大小以及弹簧的伸缩度，选择弹簧弹性系数，使其弹力小于吸附力。The opening part of the concave cavity can be made of elastic materials, such as nitrile rubber, polyurethane or vinyl-based polymer materials, etc. For the rough surface of the measured structure, silicon rubber can be used. If the surface of the structure to be tested is damaged, nitrile rubber can be used. According to the shape and size of the concave cavity and the stretchability of the spring, the elastic coefficient of the spring can be selected so that the elastic force is smaller than the adsorption force.
用于本发明安装方法的装置，其特征在于，主要由凹形腔硬体、凹形腔吸附软体、压电晶片座、压电晶片、弹簧构成，凹形腔硬体和凹形腔吸附软体分别采用密封材料和可与被测结构表面吸附的密封材料，并紧密结合构成密封的凹形腔体，凹形腔吸附软体在凹形腔体的开口处，凹形腔硬体上设有可封闭的气孔，弹簧的两端分别与压电晶片座和凹形腔硬体连接，弹簧的伸缩方向与凹形腔体的开口端面相垂直；压电晶片座平行于凹形腔体开口端面的截面积小于凹形腔体的开口端面面积，其高度小于凹形腔体的高度，在弹簧受压缩后压电晶片座可置于凹形腔体内，在弹簧自然状态下压电晶片座伸出凹形腔体的开口端面，压电晶片座朝向被测结构的表面设有一个或两个以上用于放置压电晶片的凹槽，凹槽的深度小于压电晶片的厚度。The device used for the installation method of the present invention is characterized in that it is mainly composed of concave cavity hardware, concave cavity adsorption software, piezoelectric wafer seat, piezoelectric wafer, and springs, and the concave cavity hardware and concave cavity adsorption software The sealing material and the sealing material that can be adsorbed on the surface of the structure to be tested are respectively used, and tightly combined to form a sealed concave cavity. The concave cavity adsorption software is at the opening of the concave cavity, and the concave cavity hardware is equipped with a Closed air hole, the two ends of the spring are respectively connected with the piezoelectric wafer seat and the concave cavity hard body, the stretching direction of the spring is perpendicular to the opening end face of the concave cavity body; the piezoelectric wafer seat is parallel to the opening end face of the concave cavity body The cross-sectional area is smaller than the opening end face area of the concave cavity, and its height is smaller than the height of the concave cavity. After the spring is compressed, the piezoelectric chip seat can be placed in the concave cavity, and the piezoelectric chip seat protrudes under the natural state of the spring. On the opening end face of the concave cavity, the surface of the piezoelectric wafer seat facing the structure to be tested is provided with one or more than two grooves for placing piezoelectric wafers, and the depth of the grooves is smaller than the thickness of the piezoelectric wafer.
凹形腔硬体的气孔上可以安装气嘴，将装置吸附到被测结构表面时把气嘴与抽真空装置相连接，气孔也可以与密闭活塞装置相连通。An air nozzle can be installed on the air hole of the concave cavity hardware, and when the device is adsorbed to the surface of the structure to be tested, the air nozzle can be connected with the vacuum device, and the air hole can also be connected with the airtight piston device.
凹形腔硬体上的气孔与密闭活塞装置相连通时，可以将活塞装置的活塞筒安装在凹形腔体外部，在活塞筒上开两个U型槽，活塞在活塞筒底部时，活塞手柄在U型槽里，沿着U型槽向外拉动活塞手柄移出U形槽后，再转动手柄使其卡放在活塞筒边缘，使活塞保持在增大气体空间后的状态。When the air hole on the hardware of the concave cavity is connected with the closed piston device, the piston barrel of the piston device can be installed outside the concave cavity, and two U-shaped grooves are opened on the piston barrel. When the piston is at the bottom of the piston barrel, the piston The handle is in the U-shaped groove. Pull the piston handle outward along the U-shaped groove to move out of the U-shaped groove, and then turn the handle so that it is stuck on the edge of the piston barrel, so that the piston remains in the state after increasing the gas space.
压电晶片座与凹形腔硬体之间可以安装一个伸出凹形腔体的中空导杆，中空导杆与压电晶片座之间为固定连接，与凹形腔硬体之间装有密封圈，凹形腔硬体和密封圈可沿中空导杆移动，弹簧套在中空导杆上，其位置、长度和伸缩方向与未安装中空导杆的装置相同，中空导杆伸出凹形腔体部分的端点可以封闭，也可以将中空导杆的中空部分作为气孔，而无需在凹形腔硬体上再开设气孔，气孔上可以安装气嘴，将装置吸附到被测结构表面时把气嘴与抽真空装置相连接；压电晶片座以及凹形腔硬体与中空导杆接触部分均可作成中空凸台形式，其中压电晶片座的中空凸台可以带有内螺纹，与中空导杆配合连接；凹形腔体受压后，同密封圈一起沿中空导杆向被测结构滑动，密封圈使凹形腔体保持密封状态。A hollow guide rod protruding from the concave cavity can be installed between the piezoelectric wafer base and the concave cavity hardware. The hollow guide rod and the piezoelectric wafer base are fixedly connected, and a The sealing ring, the concave cavity hard body and the sealing ring can move along the hollow guide rod, and the spring sleeve is on the hollow guide rod. Its position, length and expansion and contraction direction are the same as those of the device without the hollow guide rod. The end point of the cavity part can be closed, and the hollow part of the hollow guide rod can also be used as an air hole, instead of opening an air hole on the concave cavity hardware, an air nozzle can be installed on the air hole, and when the device is adsorbed to the surface of the structure to be tested, the The air nozzle is connected with the vacuum device; the contact part of the piezoelectric chip seat and the concave cavity hardware and the hollow guide rod can be made into a hollow boss form, and the hollow boss of the piezoelectric chip seat can have an internal thread, which is consistent with the hollow The guide rods are matched and connected; after the concave cavity is under pressure, it slides along the hollow guide rod to the structure under test together with the sealing ring, and the sealing ring keeps the concave cavity in a sealed state.
本发明装置采用抽真空装置或活塞装置减小气压、吸附凹形腔体时，凹形腔体的吸附软体一般只起到紧密贴合到被侧结构表面的作用，凹形腔体可以主要由硬体构成。When the device of the present invention adopts a vacuum device or a piston device to reduce the air pressure and absorb the concave cavity, the adsorption software of the concave cavity generally only plays the role of closely fitting to the surface of the side structure, and the concave cavity can be mainly composed of Hardware composition.
当利用凹形腔体变形减小密闭腔体内气压，从而产生吸附力时，凹形腔吸附软体占凹形腔壳体的大部分面积，受挤压后可大幅度弹性变形。When the deformation of the concave cavity is used to reduce the air pressure in the airtight cavity to generate the adsorption force, the adsorption software of the concave cavity occupies most of the area of the concave cavity shell, and can be elastically deformed to a large extent after being squeezed.
采用可大幅度弹性变形吸附软体时，装置可以采用上述中空导杆结构，并且在凹形腔硬体外部安装一个密封套筒，套在中空导杆伸出凹形腔部分的外部，中空导杆上固定安装一个环状密封滑块，密封滑块在密封套筒和中空导杆之间，既起密封作用，又可以随中空导杆沿密封套筒内壁滑动，当凹形腔吸附软体恢复部分形状时，带动密封套筒向上滑动，而中空导杆因弹簧压缩不会随着一同离开被侧结构；中空导杆的外端点可以作为气孔，用气塞封闭。When adopting a large elastic deformation adsorption software, the device can adopt the above-mentioned hollow guide rod structure, and a sealing sleeve is installed outside the concave cavity hard body, which is sleeved on the outside of the part of the hollow guide rod protruding from the concave cavity, and the hollow guide rod A ring-shaped sealing slider is fixedly installed on the top, and the sealing slider is between the sealing sleeve and the hollow guide rod, which not only acts as a seal, but also slides along the inner wall of the sealing sleeve with the hollow guide rod. When the shape is formed, the sealing sleeve is driven to slide upward, and the hollow guide rod will not leave the side structure together due to the compression of the spring; the outer end point of the hollow guide rod can be used as an air hole, which is closed with an air plug.
为连接压电晶片上的导线，可以在放置压电晶片的凹槽和压电晶片座的一个表面(如与弹簧连接的表面)之间开有通孔，凹槽之间也可以开有通孔，导线穿过通孔，延伸到凹形腔体外，穿过凹形腔体部分采取密封措施，导线也可以通过气嘴或气孔塞穿出凹形腔体外，穿过部分采取密封措施。In order to connect the wires on the piezoelectric wafer, a through hole can be provided between the groove where the piezoelectric wafer is placed and a surface of the piezoelectric wafer seat (such as the surface connected to the spring), and a through hole can also be opened between the grooves. The wire passes through the through hole and extends out of the concave cavity, and sealing measures are taken for the part passing through the concave cavity.
本发明通过真空吸附方式将压电晶片安装在待测结构表面，压电晶片可方便地拆卸、更换、调换安装位置；通过调整弹簧长度和弹簧系数控制弹簧弹力，从而调整压电晶片相对被测结构表面的压紧力，保证了压电晶片与被测结构的耦合性能的可重复性和均一性；用较少的压电晶片就可以实现大面积薄壳结构(如机身与机翼)的灵活监测与诊断，从而实现了机动式的结构健康监测，提高了监测与诊断效率。The invention installs the piezoelectric chip on the surface of the structure to be tested by means of vacuum adsorption, and the piezoelectric chip can be easily disassembled, replaced, and the installation position can be changed; the elastic force of the spring is controlled by adjusting the spring length and spring coefficient, thereby adjusting the piezoelectric chip relative to the measured structure. The pressing force on the surface of the structure ensures the repeatability and uniformity of the coupling performance between the piezoelectric wafer and the structure under test; large-area thin-shell structures (such as fuselage and wings) can be realized with fewer piezoelectric wafers Flexible monitoring and diagnosis, thus realizing mobile structural health monitoring and improving the efficiency of monitoring and diagnosis.
附图说明Description of drawings
图1为一种安装用于结构健康监测的压电晶片的装置示意图。Figure 1 is a schematic diagram of a device for installing piezoelectric wafers for structural health monitoring.
图中1为凹形腔硬体，2为凹形腔吸附软体，3为压电晶片、4为压电晶片座、5为弹簧、6为电源线、7为气孔，8为气嘴，9为连接导线的通孔。In the figure, 1 is the concave cavity hardware, 2 is the concave cavity adsorption software, 3 is the piezoelectric chip, 4 is the piezoelectric chip seat, 5 is the spring, 6 is the power cord, 7 is the air hole, 8 is the air nozzle, 9 Holes for connecting wires.
图2为图1所示的装置吸附到被测结构表面后的示意图。Fig. 2 is a schematic diagram of the device shown in Fig. 1 after being adsorbed to the surface of the structure to be tested.
图3为带有中空导杆的安装用于结构健康监测的压电晶片的装置示意图。Fig. 3 is a schematic diagram of a device with a piezoelectric wafer installed for structural health monitoring with a hollow guide rod.
图中10为中空导杆，中空部分作为气孔7，8为气嘴，11为密封圈。Among the figure, 10 is a hollow guide rod, and the hollow part is used as an
图4为图3所示的装置吸附到被测结构表面后的示意图。FIG. 4 is a schematic diagram of the device shown in FIG. 3 after being adsorbed to the surface of the structure to be tested.
图5为一种与密闭活塞相连的安装用于结构健康监测的压电晶片的装置示意图。Fig. 5 is a schematic diagram of a device for installing a piezoelectric chip connected to a sealed piston for structural health monitoring.
图中12为密封垫圈，13为活塞筒，14为活塞，15为活塞手柄，16为螺母。Among the figure, 12 is a sealing washer, 13 is a piston cylinder, 14 is a piston, 15 is a piston handle, and 16 is a nut.
图6为图5所示装置向外拉动活塞14后，活塞手柄15卡放在活塞筒13边缘的示意图。FIG. 6 is a schematic diagram of the piston handle 15 stuck on the edge of the
图7为图5所示装置的外观示意图。FIG. 7 is a schematic diagram of the appearance of the device shown in FIG. 5 .
图中活塞筒13设有两个U型槽17，可沿U型槽17向外拉动活塞手柄15，再旋转活塞手柄15卡放在活塞筒13边缘。In the figure, the
图8为一种吸附软体可以大幅度弹性变形的安装压电晶片的装置示意图。Fig. 8 is a schematic diagram of a device for installing a piezoelectric chip in which the adsorption software can be greatly elastically deformed.
图中1为凹形腔硬体，2为可大幅度变形的凹形腔吸附软体，18为密封套筒，19为密封滑块，20为密封垫圈，21为气塞。Among the figure, 1 is the concave cavity hard body, 2 is the concave cavity adsorption software that can be greatly deformed, 18 is the sealing sleeve, 19 is the sealing slider, 20 is the sealing washer, and 21 is the air plug.
图9为图8所示装置吸附到被测结构表面后的示意图。FIG. 9 is a schematic diagram of the device shown in FIG. 8 after being adsorbed to the surface of the structure to be tested.
图10为一种本发明的压电晶片座截面图。Fig. 10 is a cross-sectional view of a piezoelectric wafer seat of the present invention.
图中22为圆形凹槽，23为矩形凹槽，24为卡放弹簧或连接中孔导杆的中空凸台，25为凹槽间连接导线的通孔，9为凹槽和压电晶片座表面间的导线通孔。In the figure, 22 is a circular groove, 23 is a rectangular groove, 24 is a hollow boss for clamping a spring or connecting a guide rod in the middle hole, 25 is a through hole for connecting wires between the grooves, and 9 is a groove and a piezoelectric wafer Conductor hole between the surfaces of the seat.
图11为图10所示压电晶片座的底视图。FIG. 11 is a bottom view of the piezoelectric wafer holder shown in FIG. 10 .
具体实施方式Detailed ways
下面结合实施例对本发明做进一步说明。The present invention will be further described below in conjunction with embodiment.
实施例1，一种用于结构健康监测的压电晶片的安装方法及其装置。
如图1所示，由凹形腔硬体1、凹形腔吸附软体2、压电晶片3、压电晶片座4、弹簧5构成；凹形腔硬体1内、外表面以及压电晶片座4的连接弹簧处均采用中空凸台形式，弹簧套在凸台上；凸台中心分别开有气孔7、连接导线通孔9，气孔7上装有气嘴8。导线穿出部分采用聚氨酯材料密封。As shown in Figure 1, it is composed of concave cavity
压电晶片座4设有一个放置压电晶片的凹槽，其深度小于压电晶片厚度。The
凹形腔体的开口面和上表面均为圆形，半径为1.78cm，凹形腔硬体1采用不锈钢，凹形腔吸附软体2采用聚氨酯，二者箍紧连接，具有密封性。弹簧自然状态时比压缩状态长ΔL＝5mm，设环境大气压P0＝1.01×105Pa，腔体密封后抽真空的绝对压力P1＝1Kpa，经计算，采用弹性系数k＝10N/mm的弹簧，可使弹力小于吸附力。The opening surface and the upper surface of the concave cavity are circular, with a radius of 1.78 cm. The
将气嘴8与真空发生器接通，压电晶片3在凹槽里，压电晶片导线与外接电源连接，将装置放置在结构表面，相对被测结构表面垂直压迫凹形腔，弹簧5被压缩，压电晶片3紧贴在被测结构表面，凹形腔和被测结构表面构成一个密闭腔体；起动抽真空设备，使密闭腔体内的绝对气压减小到P1＝1KPa，然后封闭气嘴8，使整个装置吸附在被测结构表面，如图2所示。Connect the
最后，启动压电晶片电源，压电晶片发射信号对结构进行激励，提取结构响应信号，监测结构健康状况。Finally, start the power supply of the piezoelectric chip, and the piezoelectric chip emits signals to excite the structure, extract the response signal of the structure, and monitor the health status of the structure.
实施例2，带有中空导杆的安装用于结构健康监测的压电晶片的装置。Example 2, a device with hollow guide rods for mounting piezoelectric wafers for structural health monitoring.
如图3、图4所示，压电晶片座4与凹形腔硬体1之间装有一个伸出凹形腔体的中空导杆10，中空导杆10与压电晶片座4之间为固定连接，与凹形腔硬体1之间装有密封圈11，凹形腔硬体1和密封圈11可沿中空导杆10移动，弹簧5套在中空导杆10上，中空导杆伸出凹形腔体的中空部分为气孔7，装有气嘴8。As shown in Fig. 3 and Fig. 4, a
压电晶片座4的结构如图10、图11所示，一面布置有5个放置压电晶片的凹槽，其中一个圆形凹槽22在中心位置，4个矩形凹槽23均匀分布在四周，凹槽的深度小于压电晶片的厚度；压电晶片座的另一面设有连接中空导杆10的中空凸台24，有内螺纹，凹槽间开有连接电源线的通孔25，圆形凹槽23和凸台24之间也开有有连接电源线的通孔9。The structure of the
凹形腔体的开口面和上表面均为圆形，半径为2.52cm，凹形腔吸附软体2采用丁腈橡胶。弹簧自然状态时比压缩状态长ΔL＝10mm，设环境大气压P0＝1.01×105Pa，抽真空后密封腔体内的绝对压力P1＝1Kpa，计算得出采用弹性系数k＝10N/mm的弹簧，可使弹力小于吸附力。The opening surface and the upper surface of the concave cavity are circular, with a radius of 2.52 cm, and the concave
安装过程同实施例1。The installation process is the same as in
实施例3，采用密闭活塞的压电晶片安装方法及其装置。
如图5、图6、图7所示，安装压电晶片的装置如实施例1，但在凹形腔硬体外表面上装有密闭活塞的活塞筒13，用密封垫圈12密封，气孔7与活塞相连通。压电晶片座的结构同实施例2。As shown in Fig. 5, Fig. 6 and Fig. 7, the device for installing the piezoelectric wafer is as in
活塞14的连杆穿过活塞手柄15的中心通孔，然后用螺母16固定，可使活塞手柄灵活转动。活塞手柄15被拉动前放在活塞筒13上的两个U型槽17里，向外拉动活塞14至活塞手柄移出U形槽后，转动活塞手柄15，使其卡放在活塞筒13边缘，就能固定活塞位置，使活塞保持在增大气体空间、减小气压后的状态。The connecting rod of
凹形腔吸附软体2采用硅橡胶，凹形腔体的开口面和上表面均为圆形，半径为2.5cm，凹形腔体内高度为15mm，体积约30cm3；活塞筒内径为2cm，活塞在活塞筒内可滑动的最大距离(即U型槽的高度)为5cm，活塞被拉出后，密闭腔体内的总体积V1＝92.83cm3，设环境大气压P0＝1.01×105Pa，则腔体内气压P1＝P0V0/V1≈32643Pa，计算得出内外压差产生的压力为136.71N；弹簧自然状态时比压缩状态长ΔL＝5mm，当弹性系数k＝10N/mm时，弹力为50N，远小于吸附力。The concave
安装时，活塞14先位于活塞筒13底部，手柄15放在U型槽17里，将装置放在结构表面，压电晶片座4上的压电晶片3与被测结构表面接触，相对被测结构表面垂直方向压迫凹形腔，弹簧5压缩，压电晶片3紧贴在被测结构表面，凹形腔硬体1和被测结构表面构成一个密闭腔体；拉动活塞手柄15沿着活塞筒U型槽17向外移动，当移出U型槽时，旋转活塞手柄15，使其卡放在活塞筒13边缘上。最后启动压电晶片电源，压电晶片发射信号对结构进行激励，提取结构响应信号，监测结构健康状况。During installation, the
实施例4，凹形腔吸附软体大幅度弹性变形的压电晶片安装方法和装置。
如图8所示，该装置带有同实施例2的中空导杆，凹形腔硬体1外部呈凸台形状处通过螺纹安装一个密封套筒18，密封套筒18和中空导杆10的伸出凹形腔部分之间装有环状密封滑块19，密封套筒18和凹形腔硬体1之间有密封垫圈20，中空导杆10与密封滑块19为固定连接，可以带动密封滑块19沿密封套筒18内壁滑动，吸附软体2占凹形腔壳体的大部分面积，气孔7上装有气塞21，导线6从中空导杆10侧壁伸出，用聚氨酯密封。As shown in Figure 8, the device has the same hollow guide rod as in
压电晶片座4一面开有一个用于放置压电晶片的圆型凹槽，另一面与中空导杆10连接处为中空凸台，内有螺纹，与中空导杆10配合连接，压电晶片凹槽和中空凸台之间开有连接导线通孔9。One side of the
凹形腔体与结构表面接触的开口面(凹形面)和非接触端(平行于结构表面)均为圆形，凹形腔硬体1材料为不锈钢，凹形腔吸附软体2的材料为丁腈橡胶，二者之间箍紧连接，具有密封性。The opening surface (concave surface) and the non-contact end (parallel to the structural surface) of the concave cavity in contact with the structural surface are both circular, the material of the concave cavity
凹形腔体与被测结构表面平行方向的有效面积约为20cm2(半径r≈2.5cm)，可大幅度变形的凹形腔吸附软体自然状态时的高度为25mm，设环境大气压P0＝1.01×105Pa，凹形腔吸附软体部分恢复形状后的高度为10mm，腔体内气压P1＝P0V0/V1≈10100Pa，计算得出内外压差产生的压力为181N；弹簧自然状态时比压缩状态长ΔL＝5mm，当弹性系数k＝10N/mm时，弹力为50N，远小于吸附力。The effective area of the concave cavity parallel to the surface of the measured structure is about 20cm2 (radius r≈2.5cm), and the height of the concave cavity that can be greatly deformed is 25mm when it absorbs the soft body in its natural state. The ambient atmospheric pressure P0 = 1.01×105 Pa, the height of the concave cavity after absorbing the soft part to restore its shape is 10mm, the air pressure in the cavity P1 =P0 V0 /V1 ≈10100Pa, the calculated pressure generated by the internal and external pressure difference is 181N; the spring naturally The state is longer than the compressed state by ΔL=5mm, and when the elastic coefficient k=10N/mm, the elastic force is 50N, which is much smaller than the adsorption force.
安装时，压电晶片导线6与外接电源连接，打开气塞21，然后将装置放置在结构表面，压动凹形腔硬体1和密封套筒14沿着中空导杆10向垂直于结构表面的方向运动，压缩弹簧5，直至可大幅度变形的凹形腔吸附软体2被压在被测结构表面且充分变形，使凹形腔体体积为最小，再用气塞21封闭中空导杆上的气孔7。然后凹形腔吸附软体2开始部分恢复形状，带动密封套筒18在密封滑块19处向上滑动，而中空导杆不会随着一同离开被侧结构，密封后的凹形腔体体积变大(如图9所示)，形成负压，整个装置则吸附在被测结构上，密闭腔内的压缩弹簧5对压电晶片座4及压电晶片3施加压紧力。最后启动压电晶片电源，压电晶片发射信号对结构进行激励，提取结构响应信号，监测结构健康状况。During installation, the
上述四种装置中，压电晶片座在规格相同的情况下，不同凹槽数量的压电晶片座可以置换。Among the above four devices, piezoelectric wafer holders with different numbers of grooves can be replaced if the piezoelectric wafer holders have the same specification.
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