CN101907944A - Embedded touch control display device - Google Patents

Abstract

The invention relates to an embedded touch control display device. The device comprises a display and a touch inductive component, wherein the touch inductive component is attached to the outer side of an outermost layer substrate of the display and comprises electrodes in two directions; the electrodes in the two directions intersect with one another and are formed on the same conductive film layer; the electrodes in a first direction are arranged continuously on the conductive film layer; the electrodes in a second direction are partitioned into a plurality of electrode blocks by taking the electrodes in the first direction as intervals; at a crossing point, two adjacent electrode blocks in the electrodes in the second direction are connected through a conductive bridge; the conductive bridge is isolated from the electrodes in the first direction through an insulating layer; the device is characterized in that: the conductive bridge is a metal strip formed on the outermost layer substrate of the display; and the insulating layer is a metal inorganic compound insulating layer formed on a surface layer in a middle section of the metal strip. The touch inductive component has a firm bridging structure which is difficult to damage at the crossing point, so that the embedded touch control display device has high reliability and long service life.

Description

A kind of embedded touch control display device

Technical field

The present invention relates to display device, specifically, relate to a kind of embedded touch control display device that is embedded with the touch sensible parts.

Background technology

Before transparent touch screen being arranged on the picture of display, constitute and show touch-control system, show the demonstration touch control manner that cooperatively interacts with touch sensible by picture, has extremely strong interactivity, become at present the main flow input mode of hand-held device, portable set, for example Apple, HTC's electricity mobile phone that manufacturer produced, panel computers such as (HTC) all adopt the demonstration touch control manner to import basically; And aspect software, no matter be the cell phone platform Android that Google releases, or the PC operating system Windows7 of Microsoft's release, also all support to show touch control manner.As seen, show touch control manner and correlation technique thereof, have very vast application prospect.

In the touch-screen, projection-type capacitive touch screen can be realized multiple spot and touch sensible accurately, and simple in structure, transmittance is high, is the main flow direction of current demonstration touch technology development.The touch sensible parts of projection-type capacitive touch screen are generally the induction matrix of a plurality of column electrodes, the interlaced formation of row electrode.In a kind of design proposal, the column electrode of touch sensible parts, row electrode are separately positioned on the two sides of a slice transparency carrier, to prevent that it is in the mutual short circuit of cross-point.In the another kind of design proposal, the column electrode of touch sensible parts and row electrode are arranged on the same one side (can be the outside surface or the inside surface of transparency carrier) of a slice transparency carrier, and separate by certain insulation course at the cross-point of column electrode and row electrode, to prevent that it is in the mutual short circuit of cross-point, in this case, column electrode and row electrode all are formed on the same conductive film layer, can prevent that electrode is catoptrical inconsistent.

At present, plug-in mode is still adopted in the combination of most of touch-screens and display, that is to say that touch-screen and display are separate devices, and just simply touch-screen are fixed on display the place ahead, form touch control display system, under this mode, touch-screen and display need supporting substrate separately, thereby whole touch control display system need occupy bigger thickness, can not satisfy the ultra-thin requirement of some hand-held devices and portable set, nor be beneficial to the saving production cost.

In order to solve the problem that above-mentioned plug-in mode exists, a lot of manufacturers propose the touch sensible parts in the touch-screen are combined in the display, form the touch control display system of " embedded ", i.e. embedded touch control display device.For example, adopt at display under the situation of LCD, the row, column electrode can be separately positioned on the inside and outside surface of the Benq's plate of passing through inside; Or the row, column electrode all is arranged on the outside surface of the Benq's plate of passing through inside, and certain medium is set on cross-point row-column electrode is separated; Or the row, column electrode all is arranged on the inside surface of the Benq's plate of passing through inside, and certain medium is set on cross-point and structure separates row-column electrode.For on the display (as organic active display (OLED), plasma scope (PDP), cold cathode electron emission display device flat-panel monitors such as (FED)) of other types, the touch sensible parts being set, similar three kinds of above-mentioned situations are arranged also.

In general, the touch sensible parts all are arranged on the extexine (being the outside of display outermost layer substrate) of display, with respect to the some or all of display interior that is arranged on of touch sensible parts, no matter in manufacture process or aspect the device work, do not need to consider influencing each other of touch sensible parts and these two kinds of different devices of function of display, thereby have bigger technical feasibility.And, can realize being separated from each other of display manufacturing and the manufacturing of touch sensible parts, that is to say, form the manufacture of a kind of " display manufacturing--touch sensible component processing ", this touch-screen that will help more specialty adds and industrial and commercial the various types of displays of a plurality of display manufacturer manufacturings is carried out back processing, thus the overlapping investment of avoiding dissimilar how tame display manufacturer to cause for adding touch sensible parts on the product of oneself.Moreover the manufacture of this " display manufacturing---touch sensible component processing " can reduce the influencing each other of bad defective that is occurred in display production and the touch sensible component processing process and the overall yield that causes reduction to greatest extent.

As indicated above, the extexine (being the outside of display outermost layer substrate) that is arranged on display at the column electrode and the row electrode of touch sensible parts, and column electrode and row electrode all are formed under the situation on the same conductive film layer, must be at the cross-point of column electrode and row electrode by certain bridge formation structure, column electrode and row electrode are separated and guarantee its conducting on direction separately, its characteristics are: the electrode of first direction (as column electrode or row electrode) is provided with on conductive film layer continuously; The electrode of second direction (corresponding, as to be row electrode or column electrode) electrode with first direction on conductive film layer serves as to be divided into some electrode blocks at interval; On cross-point, connect by adjacent two electrode blocks in the electrode of conducting bridge with second direction, form the electrode of second continuous direction, and separate by insulation course between the electrode of conducting bridge and first direction, with the electrode that prevents both direction in the mutual short circuit of cross-point.In the specific design, the layer structure at cross-point place has following two kinds of designs: (1) is followed successively by display outermost layer substrate, the electrode of first direction, insulation course, conducting bridge; Or (2) are followed successively by the electrode of display outermost layer substrate, conducting bridge, insulation course, first direction.On above-mentioned touch sensible parts, also be coated with protective seam, cover plate or polaroid usually, contact with the direct of touch sensible parts with the isolated body that touches, and the touch sensible parts are had protective effect.

In the existing bridge formation structure, insulation course generally is to adopt photosensitive resin by the block resin pad that spin coating, exposure, developing process form, and has the thickness of 1～5 μ m, and the position of bridge formation structure has formed the protrusion with respect to other zones.Because the touch sensible parts are arranged on the extexine of embedded touch control display device, thereby are subjected to touching the effect of pushing of body through regular meeting, and be under pressure and certain shearing force, wherein the bridge formation structure of Tu Chuing is easier is subjected to this effect.The insulation course (block resin pad) that resin material forms have very low elastic modulus (＜1GPa) and shear modulus (＜0.5GPa), be under pressure or during shearing force, bigger deformation appears easily, and stride across the conducting bridge of insulation course or ganoine thin film that continuous electrode generally adopts tin indium oxide or metal material forms, under the situation of insulation course appearance than large deformation, can't same deformation appear with insulation course, thereby be easy to rupture, finally cause the fault that opens circuit, the touch sensible component failure, thereby the serviceable life of embedded touch control display device is shorter.The destructiveness that is subjected to finger nail with touch-screen is pushed and is calculated, and suppose that the pressing force of finger nail is 10N, and effective active area is 1mm²Thereby when pushing, can produce the pressure of 10MPa, according to thickness of insulating layer is that 2 μ m, elastic modulus are that 1GPa calculates, to produce the deformation of 1% (being 20nm), and be that 118Gpa calculates with the elastic modulus of tin indium oxide, the deformation that same pressure can only produce 0.2nm at the climbing position, the difference of this deformation must make the anchorage force of insulation course be transferred to the climbing position of tin indium oxide, because the climbing position of tin indium oxide is extremely thin, thereby concentrated great internal stress, make the climbing position of tin indium oxide occur breaking.In addition, because the material of the electrode of conducting bridge and first direction is an inorganic material, and the block resin pad that photosensitive resin forms is an organic material, therefore between conducting bridge and the block resin pad, the adhesion between the electrode of block resin pad and first direction is smaller, make the job stability and the serviceable life of Trackpad be affected, as separating, cause the electrode inefficacy of opening circuit in integral body stressed appearance at the interface easily diastrophic the time.This shows, adopt block resin pad that photosensitive resin forms bridge formation structure, be applied to be difficult to obtain good reliability under the situation of extexine that the touch sensible parts are arranged on embedded touch control display device as insulation course.

Summary of the invention

Technical matters to be solved by this invention provides a kind of embedded touch control display device, in this embedded touch control display device, the electrode of the both direction of touch sensible parts (being called column electrode and row electrode usually) is arranged on the extexine (being the outside of display outermost layer substrate) of display, and the electrode of both direction all is formed on the same conductive film layer, have sound construction on the cross-point of the electrode of both direction, be difficult for impaired bridge formation structure, make embedded touch control display device reliability height, long service life.The technical scheme that adopts is as follows:

A kind of embedded touch control display device comprises display and touch sensible parts, and the touch sensible parts are attached to the outside of display outermost layer substrate; The touch sensible parts comprise the electrode of both direction, and the electrode of both direction is interlaced and all be formed on the same conductive film layer; The electrode of first direction is provided with on conductive film layer continuously; The electrode of second direction electrode with first direction on conductive film layer serves as to be divided into some electrode blocks at interval; On cross-point, connect by adjacent two electrode blocks in the electrode of conducting bridge with second direction, form the electrode of second continuous direction, and separated by insulation course between the electrode of conducting bridge and first direction, it is characterized in that: described conducting bridge is formed in the bonding jumper on the display outermost layer substrate; Insulation course is formed in the metal inorganic compound insulation course on the top layer in bonding jumper stage casing; On cross-point, the two ends of bonding jumper are connected with adjacent two electrode blocks in the electrode of second direction respectively, and the electrode of first direction strides across on metal inorganic compound insulation course and the surface attached to the metal inorganic compound insulation course.

Bonding jumper constitutes the bar shaped conducting structure, be respectively arranged with the exposed metal/bare metal end in two end, and its stage casing is be coated with the metal inorganic compound insulation course metal-cored, and two exposed metal/bare metal ends couple together by metal-cored, to constitute two conductings between the exposed metal/bare metal end.The bar shaped conducting structure that bonding jumper constitutes can be the bar shaped of various geometric configuratioies, can symmetry also can be asymmetric; Two ends of bonding jumper can partly form exposed metal/bare metal, also can form exposed metal/bare metal in whole end.

The two ends of the electrode block in the electrode of second direction cover respectively or part covers on the exposed metal/bare metal end of adjacent metal bar, form to be electrically connected; By the connection effect of bonding jumper, form the electrode of second continuous direction.Electrode block in the electrode of second direction can partly cover the exposed metal/bare metal end of respective metal bar, also can cover the exposed metal/bare metal end of respective metal bar fully.

Two ends of preferable alloy bar all are that whole end forms exposed metal/bare metal, and the two ends of the electrode block in the electrode of second direction have all covered the exposed metal/bare metal end of adjacent metal bar separately fully, can guarantee that like this electrode block has contacting of maximum area with the exposed metal/bare metal end, thereby reduce the resistance of contact site between electrode block and the exposed metal/bare metal end.

Above-mentioned metal inorganic compound insulation course not only comprises the covering to metal-cored upper surface to metal-cored covering, and comprises the covering to metal-cored side, with the continuous electrode that prevents first direction and metal-cored between be short-circuited.

In the specific design, preferred above-mentioned metal-cored thickness is 0.2～5 μ m, and the thickness of metal inorganic compound insulation course is 0.2～5 μ m, and the bonding jumper end portion thickness is 0.2～10 μ m.More preferably metal-cored thickness is 0.2～0.25 μ m, and the thickness of metal inorganic compound insulation course is 1～2 μ m, and the bonding jumper end portion thickness is 1.2～2.25 μ m.

The marginal existence certain slope of preferred above-mentioned bonding jumper, make part that conductive film layer covers the bonding jumper edge from display outermost layer substrate to the mild transition of bonding jumper upper surface, the position that covers the bonding jumper edge with the electrode block in the electrode of the electrode that prevents first direction, second direction occurs greatly rupturing because of bending degree.

Preferred above-mentioned metal inorganic compound insulation course is transformed by the surface by the metal material that bonding jumper adopted, that is to say that the material of metal inorganic compound insulation course is that the metal material that bonding jumper adopts passes through the insulation mineral compound that chemical method (as oxidation, nitrogenize, phosphatization, silication, carbonization etc.) forms.The material of above-mentioned bonding jumper can be selected to pass through chemical method (as oxidation, nitrogenize, phosphatization, silication, carbonization etc.) and transform the metal material that forms the insulation mineral compound, and the material of corresponding metal mineral compound insulation course then is the mineral compounds such as oxide, nitride, phosphide, silicide or carbonide of this metal material.

Consider the versatility of process, preferred above-mentioned metal inorganic compound is a metal oxide, and promptly the material of metal inorganic compound insulation course is a metal oxide.

Consider economy, electric conductivity, the mechanical property of metal material, with and insulativity, the mechanical property of mineral compound, the material of preferable alloy bar is aluminium (Al), iron (Fe), magnesium (Mg), zinc (Zn), perhaps based on the alloy of these metals, accordingly, (be aluminium oxide (Al with its oxide₂O₃), tri-iron tetroxide (Fe₃O₄), magnesium oxide (MgO), zinc paste (ZnO)) as the metal inorganic compound insulation course.

Because aluminium has good processability, electric conductivity, and its oxide has very good insulation performance and mechanical property, thereby more preferably the material of bonding jumper is an aluminium, corresponding, the material of metal inorganic compound insulation course is an aluminium oxide.

Also optional majority layer metal construction can obtain good interface bonding properties more as bonding jumper, and overcome the bad shortcoming of alloyed oxide insulativity.Is the double-level-metal structure of aluminium simple substance as preferred bottom (layer that promptly combines with display outermost layer substrate) for aluminium neodymium alloy (neodymium accounts for 2%), top layer, can guarantee that oxide is the pure alumina with good insulation properties, and can obtain the expand with heat and contract with cold rate consistent with the display outermost layer substrate combination of glass material, thereby obtain better interfacial combined function with glass by the aluminium neodymium alloy.

Preferably also be provided with protective seam, cover plate or polaroid, contact with the direct of touch sensible parts with the isolated body that touches, and the touch sensible parts are had protective effect in the outside of touch sensible parts.

The touch sensible parts also comprise the periphery lead-in wire usually, and a plurality of leads that the periphery lead-in wire is comprised are connected to each row, column electrode on the external-connected port that is arranged on display outermost layer substrate edge respectively.The periphery lead-in wire can separately or mix and adopt following four kinds of structures: (1) is followed successively by metal level, metal oxide insulation course on display outermost layer substrate; (2) on display outermost layer substrate, be followed successively by metal level, metal oxide insulation course, conductive film layer; (3) on display outermost layer substrate, has only conductive film layer; (4) on display outermost layer substrate, be followed successively by metal level, conductive film layer.External-connected port can separately or mix and adopt two kinds of structures: (1) is followed successively by metal level, conductive film layer on display outermost layer substrate; (2) on display outermost layer substrate, has only conductive film layer.

Aforementioned display device can be the flat-panel monitor of types such as LCD, organic light emitting display, field-emitter display, plasma scope, also can be non-tablet types of display such as cathode-ray tube (CRT), aforementioned display device all has at least one substrate (substrate is generally glass plate), and wherein the outside surface of outermost layer substrate can be used as the supporting surface of above-mentioned touch sensible parts.

A kind of method for making of brief description embedded touch control display device of the present invention, its making step is as follows:

(1) with the outside surface of display outermost layer substrate as substrate, adopt metal material deposition layer of metal film at the outside surface of display outermost layer substrate, and metal film carried out etching, keep the position that metal film need form conducting bridge, form bonding jumper; Also can adopt the mask deposition method,, adopt metal material, need form at the outside surface of display outermost layer substrate on the position of conducting bridge and directly deposit bonding jumper, remove deposition mask then by setting the shape of deposition mask;

In addition, when needs are provided with screen layer between display and touch sensible parts, during with the interference between isolated display and the touch sensible parts, can on the outside surface of display outermost layer substrate, make screen layer and insulation course earlier successively, again with the outside surface of insulation course as substrate, need form at the outside surface of insulation course on the position of conducting bridge and make bonding jumper;

(2) make bonding jumper end mask, cover two ends to each bonding jumper, the upper surface and the side of only exposing the bonding jumper stage casing, by methods such as oxidation, nitrogenize, phosphatization, silication, carbonizations chemical conversion is carried out in the bonding jumper stage casing then, formed metal inorganic compound insulation course (being oxide, nitride, phosphide, silicide or the carbonide of respective metal material) on the top layer in bonding jumper stage casing;

(3) remove bonding jumper end mask, the metal surface of exposing two ends of bonding jumper, form two exposed metal/bare metal ends, produce bridge formation structure (being the conducting bridge structure) this moment, two exposed metal/bare metal ends are formed conducting bridge by the bonding jumper stage casing by the metal-cored connection that the metal inorganic compound insulation course is covered, and the bonding jumper stage casing covers the insulation course of the separation between the electrode that metal inorganic compound insulation course on metal-cored is configured for conducting bridge and first direction;

(4) depositing electrically conductive rete (it is transparent that conductive film layer is generally, and material commonly used is a tin indium oxide) on the outside surface of display outermost layer substrate; And patterned conductive rete, form the touch sensible parts, that is to say, etching disconnected district on conductive film layer, disconnected district is divided into the electrode of several first directions that are provided with continuously with conductive film layer and is the electrode block of several second direction at interval with the electrode of first direction; The two ends of the electrode block of second direction connect the adjacent end portion of two bonding jumpers that are adjacent respectively, and the two ends of bonding jumper connect the electrode block of two second directions that are adjacent respectively, form the electrode of second continuous direction; The electrode of first direction strides across on metal oxide insulation course and the surface attached to the metal oxide insulation course, makes the electrode of first direction and the electrode mutually insulated of second direction.

When needs on the touch sensible parts when protective mulch, cover plate or polaroid, finish above-mentioned steps after, on the touch sensible parts, deposit protective seam again, perhaps attach cover plate or polaroid.

Among the present invention, the layer structure at cross-point place is followed successively by the electrode of display outermost layer substrate, conducting bridge (being bonding jumper), metal inorganic compound insulation course, first direction; On cross-point,, the electrode of both direction separated and guarantee its conducting on direction separately by above-mentioned bridge formation structure.Because the metal inorganic compound insulation course is to form by chemical method (as oxidation, nitrogenize, phosphatization, silication, carbonization etc.) on the top layer of bonding jumper, therefore has good bonding force between metal inorganic compound insulation course and the bonding jumper usually; And conductive film layer adopts tin indium oxide (ITO) to form usually, tin indium oxide and metal inorganic compound insulation course are all metal oxide, usually also has good bonding force, like this, on cross-point, it is better to be located between the electrode of conducting bridge (being bonding jumper), metal inorganic compound insulation course and first direction on the display outermost layer substrate mechanics matching successively, in conjunction with closely.And, because bonding jumper itself has higher mechanical property and (is mainly elastic modulus and shear modulus, elastic modulus as aluminium can reach 68Gpa, shear modulus can reach 25GPa), the metal inorganic compound insulation course then has higher mechanical property (elastic modulus as aluminium oxide can reach 300Gpa, shear modulus is 125Gpa), thereby can guarantee that under the situation of being pushed whole bridge formation structure has only minimum deformation.This shows, in the time of directly the pushing of touch bodies such as the touch sensible parts are pointed, pointer, the situation that is not easy interfacial separation to occur and causes electrode to open circuit and lost efficacy, the fault that also is not easy to occur the fracture of cross-point place conducting bridge or continuous electrode and causes opening circuit, guaranteed the reliability of touch sensible parts, made embedded touch control display device have long serviceable life.

Description of drawings

Fig. 1 is the structural representation (part) of the embodiment of theinvention 1;

Fig. 2 is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (1);

Fig. 3 is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (2);

Fig. 4 a is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (3);

Fig. 4 b is the A-A cut-open view (part) of Fig. 4 a;

Fig. 5 a is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (4);

Fig. 5 b is the B-B cut-open view (part) of Fig. 5 a;

Fig. 6 a is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (5);

Fig. 6 b is the C-C cut-open view (part) of Fig. 2-5a;

Fig. 7 a is the synoptic diagram (part) of the embodiment of theinvention 1 touch sensible member manufacturing method step (6);

Fig. 7 b is the D-D cut-open view of Fig. 7 a;

Fig. 8 a is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (7);

Fig. 8 b is the E-E cut-open view of Fig. 8 a;

Fig. 9 a is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (8);

Fig. 9 b is the F-F cut-open view (part) of Fig. 9 a;

Figure 10 is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (9);

Figure 11 a is the synoptic diagram of the embodiment of theinvention 1 touch sensible member manufacturing method step (10), the structural representation of the touch sensible parts that promptly make;

Figure 11 b is the G-G cut-open view (part) of Figure 11 a;

Figure 12 is the structural representation of the embodiment of theinvention 2.

Embodiment

Embodiment 1

As shown in Figure 1, this embedded touch control display device comprisesdisplay 1 and touchsensible parts 2; In the present embodiment,display 1 is a LCD, (display 1 is the outside near observer's a side to display 1 when watching outside mutually from interior, outlying observation person's a side is for inboard) comprise successively down polaroid 11, infrabasal plate 12, pixel electrode 13, down both alignment layers 14, liquid crystal layer 15, go up both alignment layers 16, public electrode 17,upper substrate 18 and upper polarizer 19, whereinupper substrate 18 is the outermost layer substrate ofdisplay 1; Touchsensible parts 2 are located betweenupper substrate 18 and the upper polarizer 19, and touchsensible parts 2 are attached to the outside ofupper substrate 18, and upper polarizer 19 sticks on the outside of touchsensible parts 2 by adhesive-layer 110.

Present embodiment is that metaloxide insulation course 27 is that example describes with the metal inorganic compound insulation course, with reference to figure 11a and Figure 11 b, touchsensible parts 2 comprise the electrode of both direction, and the electrode of both direction is interlaced and all be formed on the sameconductive film layer 29; Theelectrode 211 of first direction is provided with onconductive film layer 29 continuously; The electrode ofsecond direction electrode 211 with first direction on conductive film layer serves as to be divided into someelectrode blocks 212 at interval; On cross-point, connect by adjacent twoelectrode blocks 212 in the electrode of conducting bridge with second direction, form the electrode of second continuous direction, conducting bridge is formed in thebonding jumper 24 on thedisplay 1 outermost layer substrate (being upper substrate 18), and the two ends ofbonding jumper 24 are connected with adjacent twoelectrode blocks 212 in the electrode of second direction respectively; Separate by insulation course between the electrode of conducting bridge and first direction, insulation course is formed in the metal inorganic compound insulation course (being metaloxide insulation course 27 in the present embodiment) on the top layer inbonding jumper 24 stage casings, and theelectrode 211 of first direction strides across on metal inorganic compound insulation course and the surface attached to the metal inorganic compound insulation course.

Bonding jumper 24 constitutes the bar shaped conducting structure, be respectively arranged with exposed metal/bare metal end 241 in two end, and its stage casing is for being coated with metal-cored 242 of metal inorganic compound insulation course (being metal oxide insulation course 27), two exposed metal/bare metal ends 241 couple together by metal-cored 242, to constitute two conductings between the exposed metal/bare metal end 241; The marginal existence certain slope ofbonding jumper 24, make part thatconductive film layer 29 coversbonding jumper 24 edges fromdisplay 1 outermost layer substrate (being upper substrate 18) to the mild transition ofbonding jumper 24 upper surfaces; The bar shaped conducting structure that bondingjumper 24 constitutes can be the bar shaped of various geometric configuratioies, can symmetry also can be asymmetric; Two ends ofbonding jumper 24 can partly form exposed metal/bare metal, also can form exposed metal/bare metal in whole end.The two ends of theelectrode block 212 in the electrode of second direction cover respectively or part covers on the exposed metal/bare metal end 241 ofadjacent metal bar 24, form to be electrically connected; Electrodeblock 212 in the electrode of second direction can partly cover the exposed metal/bare metal end 241 of respective metal bar, also can cover the exposed metal/bare metal end 241 of respective metal bar fully.In the present embodiment,bonding jumper 24 is a symmetrical structure, two ends ofbonding jumper 24 all are that whole end forms exposed metal/bare metal, and the two ends of theelectrode block 212 in the electrode of second direction have all covered the exposed metal/bare metal end 241 ofadjacent metal bar 24 separately fully, can guarantee that like thiselectrode block 212 has contacting of maximum area with exposed metal/bare metal end 241.

The covering of metal inorganic compound insulation course (being metal oxide insulation course 27) to metal-cored 242 not only comprises the covering to metal-cored 242 upper surfaces, and comprises the covering to metal-cored 242 sides.

In the specific design, metal-cored 242 thickness can be 0.2～5 μ m, and the thickness of metal inorganic compound insulation course (being metal oxide insulation course 27) can be 0.2～5 μ m, and the thickness of bonding jumper end (being exposed metal/bare metal end 241) can be 0.2～10 μ m; More preferably metal-cored 242 thickness is 0.2～0.25 μ m, and the thickness of metal inorganic compound insulation course (being metal oxide insulation course 27) is 1～2 μ m, and the thickness of bonding jumper end (being exposed metal/bare metal end 241) is 1.2～2.25 μ m.

A kind of method for making of this embedded touch control display device of brief description, the manufacturing step of its touchsensible parts 2 is as follows:

(1) as shown in Figure 2, on the lateral surface of theupper substrate 18 ofdisplay 1,form metal film 22; The method that formsmetal film 22 can be plating, vacuum moulding machine or sputtering sedimentation; Themetal film 22 that forms can be single layer structure or sandwich construction; In the present embodiment, adopt the magnetron sputtering deposition method, as target, the thickness of themetal film 22 of formation is 4 μ m with the aluminium of purity 99.99%;

(2) as shown in Figure 3, coating onedeck photoresist 23 onmetal film 22; Coating process can adopt spin-coating method;

(3) shown in Fig. 4 a and Fig. 4 b, the photoresist layer that step (2) is formed exposes, develops, keep thephotoresist 23 on the position that coversmetal film 22 and need to form conducting bridge, and removal covers thephotoresist 23 atmetal film 22 all the other positions;

(4) shown in Fig. 5 a and Fig. 5 b, adopt wet etching or dried quartermethod metal film 22 is carried out etching, keep through step (3) and handle the back by thepart metals film 22 thatphotoresist 23 covers, remove themetal film 22 of remainder,form bonding jumper 24 byphotoresist 23 coverings;

(5) shown in Fig. 6 a and Fig. 6 b, remove thephotoresist 23 that covers on thebonding jumper 24, the surface ofbonding jumper 24 is exposed; Removephotoresist 23 and can adopt the following film method that moves back: with moving back film liquid spray photoresist network, the used film liquid that moves back is the KOH/NaOH mixed solution;

(6) shown in Fig. 7 a and Fig. 7 b, on the lateral surface ofupper substrate 18, be coated with onedeck photoresist 25 once more, and photoresist layer exposed, develops, removal covers thephotoresist 25 onbonding jumper 24 stage casings, keep thephotoresist 25 that covers onbonding jumper 24 two ends, form oxidation window 26 (oxidation window 26 places do not cover photoresist 25);

(7) shown in Fig. 8 a and Fig. 8 b,bonding jumper 24 stage casings (being the position ofoxidation window 26 correspondences) carried out oxidation processes, form metaloxide insulation course 27 on the top layer inbonding jumper 24 stage casings; Oxidation treatment method can adopt normal temperature oxidation, thermal oxide or the ultraviolet light assisted oxidation that carries out in oxidizing atmosphere, or the chemical oxidation that carries out in solution, or carries out plasma surface oxidation or plasma injection oxidation in plasma; For example, the process conditions of chemical oxidization method are: 30～40 ℃ of temperature, time 3～6min, oxidizing solution phosphoric acid (H₃PO₄, 50～60mL/L), chromic anhydride (CrO₃, 20～25g/L), ammonium bifluoride ((NH₄) HF₂, 3～3.5g/L), boric acid (H₃BO₃);

(8) shown in Fig. 9 a and Fig. 9 b, remainingphotoresist 25 on the lateral surface of removalupper substrate 18 exposes conductingbridge structure 28; Thebonding jumper 24 that is formed on the lateral surface ofupper substrate 18 constitutes conducting bridges, and metaloxide insulation course 27 is formed on the top layer inbonding jumper 24 stage casings, and the two ends thatbonding jumper 24 exposes are used forconnection electrode piece 212;

(9) as shown in figure 10, on the lateral surface ofupper substrate 18, form conductive film layer 29 (being generally the ITO film);Conductive film layer 29 is attached to the remaining surface (being the part that is not covered by conductingbridge structure 28 on the lateral surface of upper substrate) of the lateral surface of the surface of surface, metaloxide insulation course 27 at the two ends thatbonding jumper 24 exposes and upper substrate;

(10) shown in Figure 11 a and Figure 11 b, patternedconductive rete 29, that is to say, etching disconnecteddistrict 210 onconductive film layer 29, disconnecteddistrict 210 is divided into the electrode 211 (row electrode) of several first directions that are provided with continuously withconductive film layer 29 and is theelectrode block 212 of several second direction at interval with theelectrode 211 of first direction; The two ends of theelectrode block 212 of second direction connect the adjacent end portion of twobonding jumpers 24 that are adjacent respectively, and the two ends ofbonding jumper 24 connect theelectrode block 212 of two second directions that are adjacent respectively, form the electrode (column electrode) of second continuous direction; Theelectrode 211 of first direction strides across on metaloxide insulation course 27 and the surface attached to metaloxide insulation course 27, make theelectrode 211 of first direction and the electrode mutually insulated of second direction, thereby on the lateral surface ofupper substrate 18, form touchsensible parts 2.

The outside at touchsensible parts 2 attaches polaroid 19, makes embedded touch control display device.

The material of present embodimentpreferable alloy bar 24 is an aluminium, and corresponding, the material of metal inorganic compound insulation course (being metal oxide insulation course 27) is an aluminium oxide.

Material atbonding jumper 24 is under the situation of other metal (as iron (Fe), magnesium (Mg), zinc (Zn)), (is tri-iron tetroxide (Fe with its oxide correspondingly₃O₄), magnesium oxide (MgO), zinc paste (ZnO)) as the metal inorganic compound insulation course, the method for making of embedded touch control display device can be the embodiment of aluminium with reference to the material of above-mentioned bonding jumper.

The material ofbonding jumper 24 also can be an alloy, as adopting the alloy of metal simple-substances such as aluminium, iron, magnesium, zinc as principal ingredient.Accordingly, the material of formed metaloxide insulation course 27 is mainly aluminium oxide, tri-iron tetroxide (Fe₃O₄), magnesium oxide, zinc paste.This moment, touchsensible parts 2 method for making was identical during as the material ofbonding jumper 24 with employing aluminium.

Bonding jumper 24 also can be the multi-layer metal structure that is formed by different metal.For example,bonding jumper 24 has the double-level-metal structure, and its bottom is that aluminium neodymium alloy, top layer are aluminium simple substance, and the material of formed metaloxide insulation course 27 is an aluminium oxide.In this case, but the manufacture method adopting by reference aluminium of touchsensible parts 2 is as the situation of the material of bonding jumper, difference is, in the step (1), on the one side ofdisplay 1 outermost layer substrate, form aluminium neodymium alloy layer earlier, on aluminium neodymium alloy layer, form aluminium lamination then, thereby form the metal film of double-level-metal structure.

At the material of metal inorganic compound insulation course is under the situation of the insulation mineral compound that forms by chemical methodes such as nitrogenize, phosphatization, silication, carbonizations of metal material that bonding jumper adopts, can make embedded touch control display device by following step:

(1) with the outside surface of display outermost layer substrate as substrate, adopt metal material deposition layer of metal film at the outside surface of display outermost layer substrate, and metal film carried out etching, keep the position that metal film need form conducting bridge, form bonding jumper; Also can adopt the mask deposition method,, adopt metal material, need form at the outside surface of display outermost layer substrate on the position of conducting bridge and directly deposit bonding jumper, remove deposition mask then by setting the shape of deposition mask;

(2) make bonding jumper end mask, cover two ends to each bonding jumper, the upper surface and the side of only exposing the bonding jumper stage casing, by methods such as nitrogenize, phosphatization, silication, carbonizations chemical conversion is carried out in the bonding jumper stage casing then, formed metal inorganic compound insulation course (being nitride, phosphide, silicide or the carbonide of respective metal material) on the top layer in bonding jumper stage casing;

(3) remove bonding jumper end mask, the metal surface of exposing two ends of bonding jumper, form two exposed metal/bare metal ends, produce bridge formation structure (being the conducting bridge structure) this moment, two exposed metal/bare metal ends are formed conducting bridge by the bonding jumper stage casing by the metal-cored connection that the metal inorganic compound insulation course is covered, and the bonding jumper stage casing covers the insulation course of the separation between the electrode that metal inorganic compound insulation course on metal-cored is configured for conducting bridge and first direction;

(4) depositing electrically conductive rete (it is transparent that conductive film layer is generally, and material commonly used is a tin indium oxide) on the outside surface of display outermost layer substrate; And patterned conductive rete, form the touch sensible parts, that is to say, etching disconnected district on conductive film layer, disconnected district is divided into the electrode of several first directions that are provided with continuously with conductive film layer and is the electrode block of several second direction at interval with the electrode of first direction; The two ends of the electrode block of second direction connect the adjacent end portion of two bonding jumpers that are adjacent respectively, and the two ends of bonding jumper connect the electrode block of two second directions that are adjacent respectively, form the electrode of second continuous direction; The electrode of first direction strides across on metal oxide insulation course and the surface attached to the metal oxide insulation course, makes the electrode of first direction and the electrode mutually insulated of second direction, thereby forms the touch sensible parts;

(5) attach polaroid in the outside of touch sensible parts.

Methods such as above-mentioned nitrogenize, phosphatization, silication, carbonization all can adopt existing technology, are not described in detail at this.

Embodiment 2

As shown in figure 12, this embedded touch control display device comprisesdisplay 1 and touchsensible parts 2; In the present embodiment;display 1 is an organic light emitting display; organic light emitting display comprises that (this organic light emitting display has only asubstrate 111 tosubstrate 111; thereforesubstrate 111 is the outermost layer substrate of display 1) and capping 112; the inboard ofsubstrate 111 is provided withtransparent anode 113 successively; a plurality of multilayer organic light-emitting structure 114 (being provided withinsulation wall 115 between the adjacent multilayer organic light-emitting structure 114) andnegative electrode 116; capping 112 is attached on thetransparent anode 113 and with multilayer organic light-emittingstructure 112 andnegative electrode 116 and encapsulates; the outside ofsubstrate 111 is provided withscreen layer 117 successively;insulation course 118; on the lateral surface of touchsensible parts 2 attached toinsulation course 118, touchsensible parts 1 outside is provided withprotective seam 119.

The structure of above-mentioned touchsensible parts 2 is identical withembodiment 1, but its method for making reference example 1.

In addition, in the touch sensible parts, also can column electrode on conductive film layer, be provided with continuously, and the row electrode is to be divided into some electrode blocks at interval with the column electrode on conductive film layer; At the cross-point place, the two ends of electrode block connect the adjacent end portion of two bonding jumpers that are adjacent respectively, and the two ends of bonding jumper connect two electrode blocks that are adjacent respectively, form continuous row electrode.This moment, the manufacture method of capacitance touch screen was identical with the manufacture method of above-mentioned capacitance touch screen, and just the direction of bonding jumper changes the bearing of trend setting along the row electrode into.

Aforementioned display device also can be the flat-panel monitor of types such as field-emitter display, plasma scope, also can be non-tablet types of display such as cathode-ray tube (CRT), aforementioned display device all has outermost layer substrate (the outermost layer substrate is generally glass plate), and the outside surface of outermost layer substrate can be used as the supporting surface of above-mentioned touch sensible parts.

Claims (6)

1. an embedded touch control display device comprises display and touch sensible parts, and the touch sensible parts are attached to the outside of display outermost layer substrate; The touch sensible parts comprise the electrode of both direction, and the electrode of both direction is interlaced and all be formed on the same conductive film layer; The electrode of first direction is provided with on conductive film layer continuously; The electrode of second direction electrode with first direction on conductive film layer serves as to be divided into some electrode blocks at interval; On cross-point, connect by adjacent two electrode blocks in the electrode of conducting bridge with second direction, form the electrode of second continuous direction, and separated by insulation course between the electrode of conducting bridge and first direction, it is characterized in that: described conducting bridge is formed in the bonding jumper on the display outermost layer substrate; Insulation course is formed in the metal inorganic compound insulation course on the top layer in bonding jumper stage casing; On cross-point, the two ends of bonding jumper are connected with adjacent two electrode blocks in the electrode of second direction respectively, and the electrode of first direction strides across on metal inorganic compound insulation course and the surface attached to the metal inorganic compound insulation course.

2. embedded touch control display device according to claim 1 is characterized in that: two ends of described bonding jumper all are that whole end forms exposed metal/bare metal, and the two ends of the electrode block in the electrode of second direction have all covered the end of adjacent metal bar separately fully.

3. embedded touch control display device according to claim 1, it is characterized in that: two ends of described bonding jumper are respectively arranged with two exposed metal/bare metal ends, the stage casing of bonding jumper is be coated with the metal inorganic compound insulation course metal-cored, and two exposed metal/bare metal ends are by metal-cored connection; Metal-cored thickness is 0.2～5 μ m, and the thickness of metal inorganic compound insulation course is 0.2～5 μ m, and the bonding jumper end portion thickness is 0.2～10 μ m.

4. embedded touch control display device according to claim 3 is characterized in that: described metal-cored thickness is 0.2～0.25 μ m, and the thickness of metal inorganic compound insulation course is 1～2 μ m, and the bonding jumper end portion thickness is 1.2～2.25 μ m.

5. embedded touch control display device according to claim 1 is characterized in that: the material of described bonding jumper is aluminium, iron, magnesium or zinc, and corresponding, the material of metal inorganic compound insulation course is aluminium oxide, tri-iron tetroxide, magnesium oxide or zinc paste.

6. according to each described embedded touch control display device of claim 1-5, it is characterized in that: the outside of described touch sensible parts also is provided with protective seam, cover plate or polaroid.

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