CN101887942A - Metal baseplate provided with LED and manufacturing method thereof - Google Patents

Abstract

The invention relates to a metal baseplate provided with an LED and a manufacturing method thereof, relating to the technical field of circuit board base materials, and in particular being applied to the technical field of production of a large-power LED metal baseplate. The manufacturing method comprises the following steps: successively plating a diamond-like carbon (DLC) coating on a metal plate; sputtering a metal layer capable of being carbonized on the outer surface of the diamond-like carbon coating; sputtering a thin copper layer outside the metal layer capable of being carbonized; and electroplating a thickened copper layer outside the thin copper layer and then carrying out circuit carving outside the thickened copper layer. The formed aluminium baseplate has excellent insulativity, and the adhesive strength of the diamond-like carbon coating and the baseplate is up to 20kg/cm<2>. The aluminum baseplate has the heat conductivity larger than 10W/mk which is more than twice of that of the traditional insulating layer containing glue, is particularly suitable for the application of the large power LED and can effectively reduce the optical attenuation speed.

Description

A kind of metal substrate and manufacture method thereof that LED is installed

Technical field

The present invention relates to the board substrate technical field, especially for the production technical field of the metal substrate of great power LED.

Background technology

Usually the material of heat conduction is many can conduct electricity, and metal is by movement of electrons heat conduction, thus the more little metal (as silver, copper, aluminium) of resistance, its pyroconductivity also big more (as the about 415W/mk of silver, the about 395W/mk of copper, the about 275W/mk of aluminium).Opposite, its pyroconductivity of the material of insulation (as glass or timber) is also very low.

Many industrial products especially are that electronic product (as LED) needs with drives.These circuit mostly are copper cash.For the massive duplication circuit, often make printed circuit board (PCB) (PCB) with exposure and etching method.Usually printed circuit board (PCB) is with the support plate of glass fiber-reinforced composite material (FRC) as insulation, makes printed circuit board (PCB) again, the computer main frame panel that Here it is uses always after pasting skim copper pool with gluing it on.

Yet the hot-fluid of LED is but often blocked by composite material.The temperature of LED raises, and its brightness of back is just rapid to decay, all the more so with the LED of high-power LED or solid matter especially.Therefore the substrate of LED, the LED support plate of the backlight of TV and street lamp for example often adopts metal (as aluminium or copper) substrate and without composite material.But the electrical power of LED and closeness all have the gesture of increase in recent years.Not enough as the radiating rate of insulating barrier with glue, adding gluing is organic substance, is easy to thermal metamorphism.The thermal expansion of organic gel is also big than metal, can cause problem on deformation.In addition, glue is understood and steam, carbonic acid or sulphur solid/liquid/gas reactions, so the metal-base circuit plate (MCPCB) of glue insulation often is unable to undergo colding and heat succeed each other of light and shade LED, so that understands mummification, is out of shape or peels off.LED had many problems when printed circuit board (PCB) insulated with glue, comprised that brightness is difficult to color distortion lasting or backlight etc.

Because the instability of glue also can be added some ceramic powders (as aluminium oxide or aluminium nitride) in it.Though the pyroconductivity of this compound inslation thing can be promoted to about 4W/mk by about 0.4W/mk of glue, but glue accounts for the over half of insulating barrier volume after all, not only the transmission of hot-fluid is still slow, heat drying, be out of shape or the problem peeled off also unresolved, the metal-base circuit plate that therefore contains glue can not be used for carrying high-power or extremely intensive led light source.

For the pyroconductivity that significantly improves insulating barrier and avoid other problem, the glue in the metal-base circuit plate must be got rid of fully.Direct coating ceramic film (as AlN or SiO2) on the metallic plate, but the pyroconductivity of ceramic membrane is high not enough, and the LED cooling effect high-power and extremely intensive to some is clear.In addition, very poor at the adhesive force of ceramic surface coating copper layer.Trickle copper circuit is easy to the sur-face peeling from ceramic membrane.

The fastest film of heat conduction is for seemingly boring carbon (Diamond Like Carbon, abbreviation DLC).The pyroconductivity of DLC can be up to 600W/mk, and is high more a lot of than silver or copper.Seemingly bore carbon divide a variety of, some carbon containing (as the DLC of electric arc or sputter), and some can hydrogeneous (H), nitrogen (N), fluorine (F), oxygen (O) or silicon (Si) (as with Radio Frequency CVD or DLC that RFCVD was plated).The conductance that pure carbon seemingly bores carbon is too high, can not effectively insulate.Seemingly bore the graphite key that also often contains conduction in the carbon, this carbon that seemingly bores can not be used for the insulated copper lead.In general, the carbonaceous conductive rate of seemingly boring that coats with physical vapor deposition (PVD) is too high, and is therefore how inapplicable.Seemingly bore the H that can contain volume (accounting for the 1/4-1/2 of whole atom numbers) in the carbon, N, F, O or Si atom with what chemical vapor deposition (CVD) coated.These non-carbon atoms can reduce the graphite key of carbon earlier, make electric current be difficult to transmit.But gas atom also can cut off the diamond key too much, and hot-fluid also is blocked, and the shared ratio of gas atom should drop on 1/4 to 1/2 scope in the carbon so seemingly bore.

Summary of the invention

The object of the invention is to design a kind of metal substrate light decay, that be fit to great power LED that reduces.

The present invention includes metallic plate and copper conductor, it is characterized in that between described metallic plate and copper conductor, setting gradually from the inside to the outside the metal level that seemingly bores carbon insulating barrier and energy carbonization; Described H, N in the carbon insulating barrier, O, F or the Si atom of seemingly boring accounts for the 1/4-1/2 that seemingly bores the carbon gross mass, and the metal of described energy carbonization is magnesium, silicon, chromium, vanadium or titanium.

The formed aluminium base of the present invention had both had good insulation, and the adhesive strength of seemingly boring carbon-coating and substrate is up to 20kg/cm2, and the pyroconductivity of aluminium base of the present invention contains than tradition more than the big twice of pyroconductivity of glue insulating barrier greater than 10W/mk.So the present invention has thermal conductivity preferably, is particularly suitable for the application of great power LED, can effectively reduce light decay speed, creates conditions for people make full use of the LED energy-conserving product.

In order to form certain insulating properties, the described thickness that seemingly bores the carbon insulating barrier is 200nm～1000nm.

Metallic plate of the present invention can be aluminium sheet, magnesium plate, copper coin, magnadure plate or magnesium copper force fit plate.

For the insulating capacity of reinforcement metal plate, can add layer of ceramic film on the metallic plate.The simplest method is as anode, oxidation in electrolyte with metallic plate.For example forming sunization aluminium on the aluminium sheet or on the magnesium plate, forming magnesium oxide.Also become metallic plate is placed on a spot of oxygen of importing in the vacuum cavity, with microwave (Microwave) or radio frequency (Radiowave) oxygen being dissociated forms electricity slurry (Plasma) again.The electricity slurry can form the oxide-film of (as 200nm) as thin as a wafer to the uniform oxidation in metal surface.If change with the processing of nitrogen electricity slurry and then can form nitride film.Oxide or nitride all are the potteries (Ceramics) of insulation.

Bore the adhesive force of carbon in order to add to surpass at ceramic membrane, can first coating one deck silicon or titanium on the ceramic membrane.Coating can physics method (as sputter) or chemical method (as chemical vapour deposition (CVD) or CVD).

Because it is non-conductive seemingly to bore carbon, is difficult for the deposited copper lead with galvanoplastic, therefore after coating was seemingly bored carbon, coating layer of metal again (as sputter one deck chromium) can add the plating layer of copper thereafter again.Because the speed of vacuum coating is too slow, just seemingly bores behind the surface metalation of carbon can tradition to electroplate and thicken copper conductor layer.

More than also providing and made, the present invention reduces method light decay, that be fit to the metal substrate of great power LED:

May further comprise the steps:

1) under the vacuum condition, plating is with like cobalt carbon diaphragm outside metallic plate, and described H in the carbon, N, O, F or the Si atom of seemingly boring accounts for the 1/4-1/2 that seemingly bores the carbon gross mass;

2) at metal level that can carbonization like the outer surface sputter of cobalt carbon diaphragm, described metal that can carbonization is magnesium, silicon, chromium, vanadium or titanium;

3) sputter thin copper layer outside the metal level of energy carbonization;

4) outside thin copper layer, electroplate thickening copper layer;

5) carrying out circuitization outside adding thick copper layer scribes.

Also can be before described step 1) make oxide layer outside prior to metallic plate.

The method for making of described oxide layer is: adopt oxygen plasma or anodization to form.

Also can after making oxide layer, seal the hole of oxide layer with the skim high molecular polymer.

Metal substrate of the present invention can be selected from aluminium sheet, magnesium plate, copper coin, magnadure plate or magnesium copper force fit plate.

The inventive method is easy to produce, operation, and good stability of products can realize purpose of design, improves the radiating efficiency of LED, reduces light decay, is fit to the installation of great power LED.

Description of drawings

Fig. 1 is a kind of structural representation of the present invention.

Embodiment

To produce the aluminium base that LED is installed is example:

1,1050,5052 or 6061 aluminium sheets is cut into the size of 550 * 700 * T2.0 (0.385m2).

2, in electrolyte, surface of aluminum plate is oxidized into the aluminium oxide that thickness is 20～30 μ m with the oxygen utmost point, with water vapour the micropore hole that stays in the aluminium oxide is sealed again.Or,, fill up the hole of alumina layer as PET with high molecular polymer.About 100 nanometers of the thickness of polymer.

3, under the vacuum condition, aluminium base was handled 10 minutes in seemingly boring in the carbon of the H that contains the 1/4-1/2 atom ratio, N, O, F or Si, the thickness like cobalt carbon diaphragm of formation is 1 μ m.

4, at metal like sputter energy carbonization on the cobalt carbon diaphragm, as magnesium, silicon, chromium, vanadium or titanium, its thickness 200nm～1000nm.

5, sputter layer of copper layer outside the metal level of energy carbonization, about 200 nanometers of its thickness.

6, outside the copper layer, electroplate the circuit layer of thickening formation copper film to about 40 microns.

7, adopt the gauze brush etching method to form circuit layer.

8, make welding resisting layer and unleaded metal level.

Form product as shown in Figure 1,aluminium sheet 1 outside, coat themetal level 4, coppercash circuit layer 5, welding resisting layer and the unleaded metal level 7 that seemingly bore carbon-coating 3, can react with carbon ofoxide layer 2, the H that contains the 1/4-1/2 atom ratio, N, O, F or Si successively.

Claims (9)

1. the metal substrate that LED is installed comprises metallic plate and copper conductor, it is characterized in that being provided with between described metallic plate and copper conductor seemingly boring the carbon insulating barrier, seemingly bores the metal level that the energy carbonization is set between carbon insulating barrier and the copper conductor; Described H, N in the carbon insulating barrier, O, F or the Si atom of seemingly boring accounts for the 1/4-1/2 that seemingly bores the carbon gross mass, and the metal of described energy carbonization is magnesium, silicon, chromium, vanadium or titanium.

2. according to the metal substrate of the described installation of claim 1 LED, it is characterized in that the described thickness that seemingly bores the carbon insulating barrier is 200nm～1000nm.

3. according to the metal substrate of claim 1 or 2 described installation LED, it is characterized in that at metallic plate and seemingly bore between the carbon insulating barrier oxide layer is set.

4. manufacture method that the metal substrate of LED is installed according to claim 1 is characterized in that may further comprise the steps:

1) under the vacuum condition, plating is with like cobalt carbon diaphragm outside metallic plate, and described H in the carbon, N, O, F or the Si atom of seemingly boring accounts for the 1/4-1/2 that seemingly bores the carbon gross mass;

2) at metal level that can carbonization like the outer surface sputter of cobalt carbon diaphragm, described metal that can carbonization is magnesium, silicon, chromium, vanadium or titanium;

3) sputter thin copper layer outside the metal level of energy carbonization;

4) outside thin copper layer, electroplate thickening copper layer;

5) carrying out circuitization outside adding thick copper layer scribes.

5. according to the described manufacture method that the metal substrate of LED is installed of claim 4, it is characterized in that described thickness like cobalt carbon diaphragm is 200nm～1000nm.

6. according to the manufacture method of the metal substrate of the described installation of claim 4 LED, make oxide layer outside it is characterized in that before described step 1) prior to metallic plate.

7. according to the described manufacture method that the metal substrate of LED is installed of claim 6, it is characterized in that the method for making of described oxide layer is: adopt oxygen plasma or anodization to form.

8. according to claim 6 or the 7 described manufacture methods that the metal substrate of LED is installed, it is characterized in that after making oxide layer, sealing the hole of oxide layer with the skim high molecular polymer.

9. according to the described manufacture method that the metal substrate of LED is installed of claim 4, it is characterized in that described metal substrate is aluminium sheet, magnesium plate, copper coin, magnadure plate or magnesium copper force fit plate.

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