CN101859738B

Movatterモバイル変換

Info

Publication number: CN101859738B
Application number: CN2009101283670A
Authority: CN
Inventors: 周建安; 陈文雄; 林家豪; 朱俊杰
Original assignee: Acbel Polytech Inc
Current assignee: Acbel Polytech Inc
Priority date: 2009-04-07
Filing date: 2009-04-07
Publication date: 2011-12-07
Anticipated expiration: 2029-04-07
Also published as: CN101859738A

Abstract

The invention discloses a large-area liquid-cooled heat dissipation device, which comprises a heat diffusion plate, a liquid injection distributor, a plurality of heat absorption pipes and a liquid discharge collector, wherein a heat absorption surface of the heat diffusion plate is contacted with a plurality of heating sources, the heat absorption pipes are distributed on a heat dissipation surface of the heat diffusion plate and are communicated with the liquid injection distributor and the liquid discharge collector, a cooling liquid channel is arranged in each heat absorption pipe, the sectional areas of the cooling liquid channels of the heat absorption pipes are different, and the heat absorption pipe with the larger sectional area of the cooling liquid channel corresponds to the heating source with higher temperature; because the heat absorption pipe with the cooling liquid channel with the larger sectional area is arranged corresponding to the heating source with higher temperature, the heat absorption effect of the heating source with higher temperature can be improved.

Description

Translated fromChinese

大面积液冷式散热装置Large-area liquid-cooled heat sink

技术领域technical field

本发明涉及一种大面积液冷式散热装置，特别是涉及一种具针对不同位置的散热需求而提供不同散热效果的大面积液冷式散热装置。The invention relates to a large-area liquid-cooled heat dissipation device, in particular to a large-area liquid-cooled heat dissipation device that provides different heat dissipation effects according to heat dissipation requirements at different positions.

背景技术Background technique

目前一般计算机，例如个人计算机、伺服器等，其所要处理的运算工作日益繁杂，故芯片及半导体开关等多个电子元件工作时所产生的废热温度极高，为使该些电子元件降温，通常于电子元件上加装一风扇或液冷散热装置，以对电子元件进行散热。At present, general computers, such as personal computers, servers, etc., have to deal with increasingly complex computing tasks, so the waste heat generated by multiple electronic components such as chips and semiconductor switches is extremely high. In order to cool these electronic components, usually Install a fan or a liquid-cooled heat sink on the electronic components to dissipate heat from the electronic components.

为有效地令多个发热电子元件散热，请参阅图11所示，一种现有应用于伺服器的大面积液冷式散热装置包括一热扩散板60及一具有单一管径的吸热管70，其中该热扩散板60具有一供与伺服器的电子元件80直接接触的吸热面61及一散热面62，而该吸热管70蜿蜒地设于该热扩散板60的散热面62上，以平均分布于该热扩散板60的散热面62上而构成热接触，又该吸热管70具有一入口端71及一出口端72，该入口端71供将冷却液注入该吸热管70中，借由冷却液流经吸热管70时，一并对热扩散板60自电子元件80吸取的废热进行热交换，以将堆积于热扩散板60上的废热带走，进而达到对电子元件80散热降温的效果。In order to effectively dissipate heat from multiple heat-generating electronic components, please refer to FIG. 11 . A conventional large-area liquid-cooled cooling device for servers includes athermal diffusion plate 60 and a heat-absorbing tube with a single diameter. 70, wherein theheat diffusion plate 60 has aheat absorption surface 61 and aheat dissipation surface 62 for direct contact with theelectronic components 80 of the server, and theheat absorption pipe 70 is meanderingly arranged on theheat dissipation surface 62 of theheat diffusion plate 60 On theheat dissipation surface 62 of thethermal diffusion plate 60 to form a thermal contact, and theheat absorption pipe 70 has aninlet port 71 and anoutlet port 72, theinlet port 71 is used to inject cooling liquid into the heat absorber In thetube 70, when the cooling liquid flows through the heat-absorbingtube 70, the waste heat absorbed by thethermal diffusion plate 60 from theelectronic component 80 is also exchanged to remove the waste heat accumulated on thethermal diffusion plate 60, thereby achieving The effect of heat dissipation and cooling on theelectronic component 80 .

但上述大面积液冷式散热装置具有以下缺点：However, the above-mentioned large-area liquid-cooled heat dissipation device has the following disadvantages:

1.为令该单一吸热管70可平均分布于该热扩散板60上，以对该热扩散板60的散热面62上各处吸热，势必要设计令该单一吸热管70具有多处弯折，才能使该单一吸热管70借由蜿蜒地来回延伸，而平均地分布设置于该热扩散板60上，然而过多的弯折，将造成冷却液于吸热管70中传递的阻碍，导致该大面积液冷式散热装置必须使用较强力的泵方可令冷却液顺畅地于该吸热管70中流动。1. In order to make the single heat-absorbingpipe 70 evenly distributed on thethermal diffusion plate 60 to absorb heat everywhere on theheat dissipation surface 62 of thethermal diffusion plate 60, it is necessary to design the single heat-absorbingpipe 70 to have multiple The singleheat absorbing pipe 70 can be evenly distributed on theheat spreading plate 60 by extending back and forth meanderingly, but too much bending will cause the cooling liquid in theheat absorbing pipe 70 The impediment of transfer causes the large-area liquid-cooled heat sink to use a more powerful pump to make the cooling liquid flow smoothly in the heat-absorbingpipe 70 .

2.为令该单一吸热管70可平均分布于该大面积液冷式散热装置的热扩散板60上，该单一吸热管70的长度必须够长，方可将该单一吸热管70以多处弯折的设计，蜿蜒地分布设置于该热扩散板60上，但蜿蜒设置必然造成吸热管70的长度较长，如此将造成流经入口端71及出口端72的冷却液之间具有过大的温差，导致该吸热管70上靠近该单一吸热管70出口端72处的热交换能力与靠近该单一吸热管70出口端72处的热交换能力有明显的差异，因此，伺服器主机板在设计时，也必须针对该大面积液冷式散热装置散热能力不均的缺点，而调整伺服器主机板上电子元件80的线路布局，例如发热温度较高的电子元件80必须设计在对应靠近吸热管70入口端71处，因而提高了线路布局的复杂度。2. In order to make the single heat-absorbingpipe 70 evenly distributed on thethermal diffusion plate 60 of the large-area liquid-cooled heat sink, the length of the single heat-absorbingpipe 70 must be long enough to allow the single heat-absorbingpipe 70 to With the design of multiple bends, it is meanderingly distributed and arranged on theheat diffusion plate 60, but the meandering arrangement will inevitably result in a longer length of theheat absorption pipe 70, which will result in the cooling of theinlet port 71 and theoutlet port 72. There is an excessive temperature difference between the liquids, resulting in a significant difference between the heat exchange capacity at theoutlet end 72 of the singleheat absorption pipe 70 on theheat absorption pipe 70 and the heat exchange ability at theoutlet end 72 of the singleheat absorption pipe 70. Therefore, when designing the server main board, it is necessary to adjust the circuit layout of theelectronic components 80 on the server main board, for example, the circuit layout of theelectronic components 80 on the server main board, in view of the uneven heat dissipation capability of the large-area liquid-cooled heat sink. Theelectronic components 80 must be designed correspondingly close to theinlet end 71 of theheat absorption pipe 70, thus increasing the complexity of the circuit layout.

发明内容Contents of the invention

本发明的目的在于提供一种大面积液冷式散热装置，其可针对不同位置的散热需求而提供不同散热效果，以解决现有大面积液冷式散热装置的散热效果不均的问题。The purpose of the present invention is to provide a large-area liquid-cooled heat dissipation device, which can provide different heat dissipation effects according to the heat dissipation requirements of different locations, so as to solve the problem of uneven heat dissipation effects of existing large-area liquid-cooled heat sinks.

为了实现上述目的，本发明提供了一种液冷式散热装置，包括：In order to achieve the above object, the present invention provides a liquid-cooled heat sink, comprising:

一热扩散板，具有一吸热面及一散热面，其中该吸热面供与多个发热源接触；A thermal diffusion plate has a heat-absorbing surface and a heat-dissipating surface, wherein the heat-absorbing surface is in contact with a plurality of heat sources;

一注液分布器，具有至少一入水口及多个送水口；A liquid injection distributor having at least one water inlet and multiple water delivery ports;

多个吸热管，分布设于该热扩散板的散热面上，且各吸热管具有一入口端及一出口端，其中该多个吸热管的入口端分别与该注液分布器的多个送水口连接，而与该注液分布器连通，又各吸热管内具有一冷却液通道，且该多个吸热管的冷却液通道的截面积均不相同，具有较大冷却液通道截面积的吸热管对应温度较高的发热源，其中，该多个吸热管呈环状回路，且具有不同的长度，较长吸热管的冷却液通道的截面积较大；一排液收集器，具有至少一出水口及多个进水口，其中该多个进水口分别与该多个吸热管的出口端连接，并通过该多个吸热管与该注液分布器连通。A plurality of heat-absorbing pipes are distributed on the heat dissipation surface of the heat diffusion plate, and each heat-absorbing pipe has an inlet end and an outlet end, wherein the inlet ends of the plurality of heat-absorbing pipes are respectively connected to the liquid injection distributor A plurality of water delivery ports are connected and communicated with the liquid injection distributor, and there is a cooling liquid channel in each heat absorbing tube, and the cross-sectional areas of the cooling liquid channels of the multiple heat absorbing tubes are all different, and there is a larger cooling liquid channel The heat-absorbing pipes with cross-sectional area correspond to the heat source with higher temperature, wherein, the multiple heat-absorbing pipes are in a circular loop and have different lengths, and the cooling liquid channel of the longer heat-absorbing pipe has a larger cross-sectional area; a row of The liquid collector has at least one water outlet and a plurality of water inlets, wherein the plurality of water inlets are respectively connected to the outlet ends of the plurality of heat-absorbing pipes, and communicate with the liquid injection distributor through the plurality of heat-absorbing pipes.

本发明还提出一种大面积液冷式散热装置，其包括：The present invention also proposes a large-area liquid-cooled heat sink, which includes:

一热扩散板，具有一吸热面及一散热面；该热扩散板包括一下盖板及一上盖板，其中：该下盖板的底面为该热扩散板的吸热面，而该下盖板的顶面上形成有一下注液分布器嵌槽、多个下吸热管嵌槽及一下排液收集器嵌槽；该上盖板以其底面盖设于该下盖板的顶面上，且该上盖板的顶面为该热扩散板的散热面，而该上盖板的底面形成有一上注液分布器嵌槽、多个上吸热管嵌槽及一上排液收集器嵌槽，其中该上注液分布器嵌槽、上吸热管嵌槽及上排液收集器嵌槽对应该下盖板的下注液分布器嵌槽、下吸热管嵌槽及下排液收集器嵌槽；A heat diffusion plate has a heat absorption surface and a heat dissipation surface; the heat diffusion plate includes a lower cover plate and an upper cover plate, wherein: the bottom surface of the lower cover plate is the heat absorption surface of the heat diffusion plate, and the lower cover plate The top surface of the cover plate is formed with a lower injection distributor slot, a plurality of lower heat absorption pipe slots and a lower drain collector slot; the upper cover plate is set on the top surface of the lower cover plate with its bottom surface and the top surface of the upper cover plate is the heat dissipation surface of the thermal diffusion plate, and the bottom surface of the upper cover plate is formed with an upper liquid injection distributor slot, a plurality of upper heat absorption pipe slots and an upper drain collection The slot of the upper injection distributor, the slot of the upper heat-absorbing pipe and the slot of the upper drain collector correspond to the slot of the lower injection distributor, the slot of the lower heat-absorbing tube and the slot of the lower cover plate. drain collector slot;

一注液分布器，由所述上、下注液分布器嵌槽构成，具有至少一入水口及多个送水口；多个吸热管，所述吸热管由所述上、下吸热管嵌槽构成，各吸热管具有一入口端及一出口端，其中入口端分别与该注液分布器的多个送水口连接，而与该注液分布器连通；各吸热管内具有一冷却液通道，且各吸热管的冷却液通道分属至少两种不同的截面积，各上、下吸热管嵌槽的深度决定吸热管的冷却液通道的截面积大小，其中，该多个吸热管呈环状回路，且具有不同的长度，较长吸热管的冷却液通道的截面积较大；一排液收集器，由所述上、下排液收集器嵌槽构成，该排液收集器具有至少一出水口及多个进水口，其中该多个进水口分别与该多个吸热管的出口端连接，并通过该多个吸热管与该注液分布器连通。A liquid injection distributor, which is composed of the upper and lower injection distributors, has at least one water inlet and a plurality of water delivery ports; a plurality of heat absorption pipes, the heat absorption pipes are formed by the upper and lower heat Each heat-absorbing tube has an inlet port and an outlet port, wherein the inlet ports are respectively connected to multiple water delivery ports of the liquid injection distributor, and communicated with the liquid injection distributor; each heat-absorbing tube has a Cooling liquid channels, and the cooling liquid channels of each heat-absorbing pipe belong to at least two different cross-sectional areas, and the depth of each upper and lower heat-absorbing pipe embedding groove determines the cross-sectional area of the cooling liquid channel of the heat-absorbing pipe, wherein, the A plurality of heat-absorbing pipes are annular loops with different lengths, and the cross-sectional area of the cooling liquid channel of the longer heat-absorbing pipes is larger; a drain collector is formed by the upper and lower drain collector grooves , the drain collector has at least one water outlet and a plurality of water inlets, wherein the plurality of water inlets are respectively connected to the outlet ends of the plurality of heat-absorbing pipes, and connected to the liquid injection distributor through the plurality of heat-absorbing pipes connected.

利用上述技术手段，由于本液冷式散热装置使用较多的吸热管，故各吸热管可设计以最少的弯管次数，分布设于该热扩散板上，借此减少冷却液于吸热管中传递时的阻碍；此外，再将具有较大截面积冷却液通道的吸热管与温度较高的发热源对应设置，可提高对温度较高发热源的吸热效果，故可由本散热装置配合线路布局，在设计上较有弹性，并可减少线路布局的负担。Utilizing the above-mentioned technical means, since the liquid-cooled heat dissipation device uses more heat-absorbing tubes, each heat-absorbing tube can be designed to be distributed on the thermal diffusion plate with the least number of pipe bends, thereby reducing the amount of cooling liquid on the heat-absorbing plate. In addition, the heat absorption pipe with a larger cross-sectional area of the cooling liquid channel is arranged correspondingly to the heat source with a higher temperature, which can improve the heat absorption effect on the heat source with a higher temperature, so the heat dissipation can be achieved by this The device is matched with the circuit layout, which is more flexible in design and can reduce the burden of circuit layout.

附图说明Description of drawings

图1为本发明第一实施例的外观图；Fig. 1 is the exterior view of the first embodiment of the present invention;

图2为本发明第一实施例的部分分解图；Figure 2 is a partial exploded view of the first embodiment of the present invention;

图3为本发明第一实施例的分解图；Figure 3 is an exploded view of the first embodiment of the present invention;

图4为本发明第一实施例的俯视图；Fig. 4 is the top view of the first embodiment of the present invention;

图5为本发明第二实施例的分解图；Figure 5 is an exploded view of the second embodiment of the present invention;

图6为本发明第三实施例的外观图；Fig. 6 is the exterior view of the third embodiment of the present invention;

图7为本发明第三实施例中最长吸热管的剖面图；Fig. 7 is a sectional view of the longest heat absorbing pipe in the third embodiment of the present invention;

图8为本发明第三实施例中次长吸热管的剖面图；Fig. 8 is a sectional view of the second long heat absorbing pipe in the third embodiment of the present invention;

图9为本发明第三实施例中次短吸热管的剖面图；Fig. 9 is a cross-sectional view of the second short heat absorbing pipe in the third embodiment of the present invention;

图10为本发明第三实施例中最短吸热管的剖面图；Fig. 10 is a sectional view of the shortest heat absorbing pipe in the third embodiment of the present invention;

图11为现有大面积液冷式散热装置的外观图。FIG. 11 is an appearance view of a conventional large-area liquid-cooled heat sink.

主要元件标号说明：Explanation of main component labels:

10热扩散板10 thermal diffusion plate

101 下盖板 101a 下注液分布器嵌槽101Bottom cover plate 101a Bottom injection liquid distributor inserting groove

101b 下吸热管嵌槽 101c 下排液收集器嵌槽101b Bottom heat-absorbingpipe embedding groove 101c Bottom drain liquid collector embedding groove

102 上盖板 102a 上注液分布器嵌槽102Upper cover plate 102a Insertion groove of upper liquid injection distributor

102b 上吸热管嵌槽 102c 上排液收集器嵌槽102b Insertion groove for upperheat absorbing pipe 102c Insertion groove for upper drain collector

11 吸热面 12 散热面11 heat-absorbingsurface 12 heat-dissipating surface

20 注液分布器 21 入水口20Liquid Injection Distributor 21 Water Inlet

22 送水口 30 吸热管22Water delivery port 30 Heat absorbing pipe

301 平滑内壁 302 锯齿内壁301 smoothinner wall 302 serrated inner wall

303 一粗糙内壁 304 栅网303 a roughinner wall 304 grid

31 入口端 32 出口端31entrance port 32 exit port

40 排液收集器 41 出水口40Drain collector 41 Water outlet

42 进水口 50 发热源42 Water inlet 50 Heat source

60 热扩散板 61 吸热面60Thermal diffusion plate 61 Heat-absorbing surface

62 散热面 70 吸热管62heat dissipation surface 70 heat absorption pipe

71 入口端 72 出口端71Entry Port 72 Exit Port

80 电子元件80 electronic components

具体实施方式Detailed ways

关于本发明的第一实施例，请参阅图1至图4所示，包括一热扩散板10、一注液分布器20、多个吸热管30及一排液收集器40。Regarding the first embodiment of the present invention, please refer to FIG. 1 to FIG. 4 , which includes athermal diffusion plate 10 , aliquid injection distributor 20 , a plurality ofheat absorption pipes 30 and adrain liquid collector 40 .

上述热扩散板10具有一吸热面11及一散热面12，其中该吸热面11供与多个发热源50构成热接触，例如伺服器主机板上的电子元件；于本实施例中，该热扩散板10为一矩形片状板体。The above-mentionedthermal diffusion plate 10 has a heat-absorbingsurface 11 and a heat-dissipating surface 12, wherein the heat-absorbingsurface 11 is provided for forming thermal contact with a plurality ofheat sources 50, such as electronic components on a server motherboard; in this embodiment, the Thethermal diffusion plate 10 is a rectangular plate body.

请进一步参阅图4所示，上述注液分布器20具有至少一入水口21及多个送水口22；于本实施例中，该注液分布器20焊接设于该热扩散板10的散热面12上，并邻近该矩形片状热扩散板10的其中一侧边，又该注液分布器20为一中空矩形立方体，其具有一顶壁、一底壁及多个侧壁，其中该顶壁和底壁相对设置，而该多个侧壁则与该顶壁及底壁垂直地邻接，又该入水口21设于其中一侧壁上，而该送水口22设于其他的侧壁上。Please refer further to FIG. 4, theliquid injection distributor 20 has at least onewater inlet 21 and a plurality ofwater delivery ports 22; 12, and adjacent to one of the sides of the rectangular sheetheat diffusion plate 10, and theliquid injection distributor 20 is a hollow rectangular cube, which has a top wall, a bottom wall and a plurality of side walls, wherein the top The wall and the bottom wall are oppositely arranged, and the plurality of side walls are vertically adjacent to the top wall and the bottom wall, and thewater inlet 21 is arranged on one of the side walls, and thewater delivery port 22 is arranged on the other side walls .

上述吸热管30分布设于该热扩散板10的散热面12上，又各吸热管30具有一入口端31及一出口端32，其中该多个吸热管30的入口端31分别与该注液分布器20的多个送水口22连接，而与该注液分布器20连通，又各吸热管30内具有一冷却液通道，且各吸热管30的冷却液通道分属至少两种不同的截面积，该冷却液通道的截面积种类可等于或不等于吸热管30的数量，例如：吸热管30为两支时，其冷却液通道分别为两种不同的截面积，三支吸热管30时，其冷却液通道可以分属两种或三种不同的截面积，四支吸热管30时则其冷却液通道可分别为二至四种不同的截面积，并可依此类推；其中：具有较大冷却液通道截面积的吸热管30对应温度较高的发热源50；于本实施例中，该多个吸热管30呈环状回路，且焊设于该热扩散板10的散热面12上，且较长的吸热管30具有较宽的管径，而以吸热管30管径的宽窄决定吸热管30的冷却液通道的截面积大小，又该多个吸热管30具有不同的长度，且本实施例中该吸热管30的长度与其内部冷却液通道的截面积大小成正比，即较长吸热管30的冷却液通道的截面积较大，因而具有较大的冷却液流量，故具有较佳的吸热效果，将之与温度较高的发热源50对应设置可充分地对温度较高的发热源50散热，而冷却液通道的截面积较小的吸热管30则因冷却液流量较小，故与温度较低的发热源50对应设置。The above-mentioned heat-absorbingtubes 30 are distributed on theheat dissipation surface 12 of thethermal diffusion plate 10, and each heat-absorbingtube 30 has aninlet port 31 and anoutlet port 32, wherein theinlet ports 31 of the plurality of heat-absorbingtubes 30 are respectively connected to A plurality ofwater delivery ports 22 of theliquid injection distributor 20 are connected to communicate with theliquid injection distributor 20, and eachheat absorption pipe 30 has a cooling liquid passage, and the cooling liquid passage of eachheat absorption pipe 30 belongs to at least Two different cross-sectional areas, the type of cross-sectional area of the cooling liquid passage can be equal to or not equal to the number of heat-absorbingpipes 30, for example: when there are two heat-absorbingpipes 30, the cooling liquid passages have two different cross-sectional areas respectively , when three heat-absorbing pipes are 30, the cooling liquid channels can be divided into two or three different cross-sectional areas, and when four heat-absorbing pipes are 30, the cooling liquid channels can be respectively two to four different cross-sectional areas, And can be deduced like this; Wherein: the heat-absorbingpipe 30 that has larger coolant channel cross-sectional area corresponds to theheat source 50 with higher temperature; It is arranged on theheat dissipation surface 12 of theheat diffusion plate 10, and the longerheat absorbing pipe 30 has a wider pipe diameter, and the width of the pipe diameter of theheat absorbing pipe 30 determines the cross-sectional area of the cooling liquid channel of theheat absorbing pipe 30 size, and the plurality of heat-absorbingtubes 30 have different lengths, and the length of the heat-absorbingtubes 30 in this embodiment is proportional to the cross-sectional area of the internal cooling liquid passage, that is, the cooling liquid passage of the longer heat-absorbingpipe 30 The cross-sectional area is larger, so it has a larger coolant flow rate, so it has a better heat absorption effect, and setting it corresponding to theheat source 50 with a higher temperature can fully dissipate heat from theheat source 50 with a higher temperature. The heat-absorbingpipe 30 with a smaller cross-sectional area of the coolant channel is arranged correspondingly to theheat source 50 with a lower temperature because the flow rate of the coolant is smaller.

上述排液收集器40具有至少一出水口41及多个进水口42，其中该多个进水口42分别与该多个吸热管30的出口端32连接，而通过该多个吸热管30与该注液分布器20连通；于本实施例中，该排液收集器40焊接设于该热扩散板10的散热面12上，并与该注液分布器20设于该矩形片状热扩散板10的同一侧边，又该排液收集器40为一中空矩形立方体，其具有一顶壁、一底壁及多个侧壁，其中该顶壁和底壁相对设置，而该多个侧壁则与该顶壁及底壁垂直地邻接，又该出水口41设于其中一侧壁上，而该进水口42设于其他的侧壁上。The above-mentioneddrain collector 40 has at least onewater outlet 41 and a plurality of water inlets 42, wherein the plurality of water inlets 42 are connected to the outlet ends 32 of the plurality of heat-absorbingpipes 30 respectively, and pass through the plurality of heat-absorbingpipes 30 It communicates with theliquid injection distributor 20; in the present embodiment, thedrain liquid collector 40 is welded on theheat dissipation surface 12 of thethermal diffusion plate 10, and is arranged on the rectangular sheet heat sink with theliquid injection distributor 20. On the same side of thediffusion plate 10, thedrainage collector 40 is a hollow rectangular cube, which has a top wall, a bottom wall and a plurality of side walls, wherein the top wall and the bottom wall are arranged oppositely, and the plurality of side walls The side walls are vertically adjacent to the top wall and the bottom wall, and thewater outlet 41 is disposed on one of the side walls, while the water inlet 42 is disposed on the other side wall.

关于本发明的第二实施例，请参阅图5所示，其与第一实施例大致相同，不同之处在于：该热扩散板10包括一下盖板101及一上盖板102，其中：Regarding the second embodiment of the present invention, please refer to FIG. 5, which is substantially the same as the first embodiment, except that thethermal diffusion plate 10 includes alower cover plate 101 and anupper cover plate 102, wherein:

该下盖板101的的底面为该热扩散板10的吸热面11，而该下盖板101的顶面上于对应该第一实施例中的注液分布器20、吸热管30及排液收集器40的设置位置处，形成有一下注液分布器嵌槽101a、多个下吸热管嵌槽101b及一下排液收集器嵌槽101c；The bottom surface of thelower cover plate 101 is theheat absorbing surface 11 of thethermal diffusion plate 10, and the top surface of thelower cover plate 101 is corresponding to theliquid injection distributor 20, theheat absorbing pipe 30 and the first embodiment. At the installation position of thedrain collector 40, there are formed a lowerinjection distributor slot 101a, a plurality of lower heat absorbingtube slots 101b and a lowerdrain collector slot 101c;

该上盖板102的顶面为该热扩散板10的散热面12，而该上盖板102的底面则形成有一上注液分布器嵌槽102a、多个上吸热管嵌槽102b及一上排液收集器嵌槽102c，其中该上注液分布器嵌槽102a、上吸热管嵌槽102b及上排液收集器嵌槽102c对应该下盖板101的下注液分布器嵌槽101a、下吸热管嵌槽101b及下排液收集器嵌槽101c，借由将上盖板102以其底面盖设于该下盖板101的顶面上，而由上、下注液分布器嵌槽102a、101a、上、下吸热管嵌槽102b、101b及上、下排液收集器嵌槽102c、101c构成第一实施例中的注液分布器20、吸热管30及排液收集器40，借由调整上、下吸热管嵌槽102b、101b的深度，即可改变吸热管中冷却液通道的截面积，故也可随需求让冷却液通道截面积较大的下吸热管嵌槽101b对应温度较高的发热源50处。The top surface of theupper cover plate 102 is theheat dissipation surface 12 of theheat diffusion plate 10, and the bottom surface of theupper cover plate 102 is formed with an upperinjection distributor slot 102a, a plurality of upper heatabsorption tube slots 102b and a The upperdrain collector slot 102c, wherein the upperinjection distributor slot 102a, the upper heat-absorbingpipe slot 102b and the upperdrain collector slot 102c correspond to the lower injection distributor slot of thelower cover plate 101 101a, the lower heat-absorbingpipe insertion groove 101b and the lower draincollector insertion groove 101c, by covering theupper cover plate 102 with its bottom surface on the top surface of thelower cover plate 101, the upper and lower injection liquids are distributed Thedevice embedding grooves 102a, 101a, the upper and lower heat absorbingpipe embedding grooves 102b, 101b and the upper and lower drain liquidcollector embedding grooves 102c, 101c constitute theliquid injection distributor 20, theheat absorbing pipe 30 and the drain collector in the first embodiment. Theliquid collector 40 can change the cross-sectional area of the cooling liquid passage in the heat-absorbing pipe by adjusting the depth of the upper and lower heat-absorbingpipe embedding grooves 102b, 101b, so the cross-sectional area of the cooling liquid passage can also be made larger as required. The lower heat absorbingpipe embedding groove 101b corresponds to theheat source 50 with a higher temperature.

关于本发明的第三实施例，请进一步参阅图6所示，其与第一实施例大致相同，不同之处在于：本第三实施例并非以吸热管30管径的宽窄决定吸热管30的冷却液通道的截面积大小，而是以不同的管内壁设计达成，于本实施例中，使用四条吸热管30，其中：Regarding the third embodiment of the present invention, please refer to Fig. 6 for further reference. It is substantially the same as the first embodiment, except that the third embodiment is not determined by the width of the heat-absorbingpipe 30 diameter. The cross-sectional area of the coolant channel of 30 is achieved by different tube inner wall designs. In this embodiment, four heat-absorbingtubes 30 are used, wherein:

请参阅图7所示，最长吸热管30内具有一平滑内壁301；Please refer to FIG. 7, the longestheat absorbing pipe 30 has a smoothinner wall 301;

请参阅图8所示，次长吸热管30内具有一锯齿内壁302；Please refer to FIG. 8, the second longheat absorbing pipe 30 has a serratedinner wall 302;

请参阅图9所示，次短吸热管30内具有一粗糙内壁303；Please refer to FIG. 9, the second shortheat absorbing pipe 30 has a roughinner wall 303;

请参阅图10所示，最短吸热管30内设有多个栅网304；Please refer to Fig. 10, the shortestheat absorbing pipe 30 is provided with a plurality ofgrids 304;

如此，也可让吸热管30的冷却液通道截面积大小不同。In this way, the cross-sectional area of the cooling liquid channel of theheat absorbing pipe 30 can also be made different.

本液冷式散热装置具有以下优点：The liquid cooling heat sink has the following advantages:

1.由于本液冷式散热装置使用多个吸热管30，由该多个吸热管30共同地分布设于该热扩散板10上，因此可将每个吸热管30的弯管次数减至最少，如此一来，即可减少冷却液于吸热管30中传递所造成的压损，故毋须使用较强力的泵即可令冷却液顺畅地于该吸热管30中流动。1. Since the liquid-cooled radiator uses a plurality of heat-absorbingtubes 30, which are jointly distributed on thethermal diffusion plate 10, the number of bends of each heat-absorbingtube 30 can be reduced. In this way, the pressure loss caused by the transfer of the cooling liquid in the heat-absorbingpipe 30 can be reduced, so that the cooling liquid can flow smoothly in the heat-absorbingpipe 30 without using a powerful pump.

2.由于冷却液通道截面积较大的吸热管30可让较多的冷却液流过，故根据热量计算公式

(热量对时间微分；C_P：随温度变化的流体比热；

流量；ρ：流体密度；

温度变化量)，冷却液通道截面积较大的吸热管30因其内冷却液流量较大，故其整体吸热能力较强，适合用以对温度较高的发热源50进行散热。2. Since the heat-absorbingpipe 30 with a larger cross-sectional area of the cooling liquid channel can allow more cooling liquid to flow through, according to the heat calculation formula

( Differential of heat with respect to time; C_P : specific heat of fluid as a function of temperature;

flow rate; ρ: fluid density;

temperature change), the heat-absorbingpipe 30 with a larger cross-sectional area of the cooling liquid channel has a relatively strong overall heat-absorbing capacity because of the large flow rate of the cooling liquid in it, and is suitable for dissipating heat from the high-temperature heat source 50 .

3.虽较长的吸热管30的入口端31及出口端32处的冷却液温差较大，导致较长的吸热管30的出口端32处吸热效果较差，然由于较长吸热管30的冷却液通道的截面积较大，因此可使较多的冷却液流过，故根据前述热量计算公式，较长吸热管30因其内冷却液流量较大而能于出口端32处维持足够的吸热效果。因此，可将各吸热管30从入口端31至出口端32的吸热效果差异减至最小，故本液冷式散热装置可提供稳定且平均的散热效果。3. Although the temperature difference between theinlet end 31 and the outlet end 32 of the longerheat absorbing pipe 30 is relatively large, resulting in poor heat absorption effect at the outlet end 32 of the longerheat absorbing pipe 30, but due to the longerheat absorbing pipe 30 The cross-sectional area of the cooling liquid channel of theheat pipe 30 is relatively large, so more cooling liquid can flow through, so according to the aforementioned heat calculation formula, the longerheat absorbing pipe 30 can flow at the outlet end because of its larger internal cooling liquid flow rate. Sufficient heat absorption effect is maintained at 32 places. Therefore, the difference in the heat absorption effect of eachheat absorption pipe 30 from theinlet end 31 to theoutlet end 32 can be minimized, so the liquid-cooled heat dissipation device can provide a stable and uniform heat dissipation effect.

以上所述仅为本发明示意性的具体实施方式，并非用以限定本发明的范围。任何本领域的技术人员，在不脱离本发明的构思和原则的前提下所作出的等同变化与修改，均应属于本发明保护的范围。The above descriptions are only illustrative specific implementations of the present invention, and are not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principle of the present invention shall fall within the protection scope of the present invention.