CN101851777A - Electrolysis device for removing excessive metal on surface of substrate and method for removing excessive metal by applying same - Google Patents

Abstract

An electrolytic device for removing excess metal from a substrate surface, comprising: an electrolytic bath (electrolysis bath) containing an electrolyte; a transport system disposed at the electrolytic cell for transporting a substrate moving from an upstream end to a downstream end of the transport system, wherein the substrate is immersed in the electrolyte; an anode roller (anode roller) correspondingly arranged at the electrolytic bath and positioned at the upstream end of the conveying system; a cathode roller (cathode roller) disposed above the conveying system and downstream relative to the anode roller, wherein the bottom portion of the cathode roller is immersed in the electrolyte; at least one shielding plate (shielding plate) is positioned at the downstream of the cathode roller and shields the downstream end of the conveying system. When the device is applied to remove excessive metal, the anode roller is contacted with one surface of the substrate, and the cathode roller is separated from the surface of the substrate. When the surface of the substrate contacted with the anode roller is towards the downstream end of the conveying system, an electric field can be generated between the surface of the substrate and the cathode roller before the surface of the substrate moves to the shielding plate so as to carry out electrolysis.

Description

Translated fromChinese

移除基板表面过量金属的电解装置及应用该装置以移除过量金属的方法Electrolytic device for removing excess metal from substrate surface and method for removing excess metal using the device

技术领域technical field

本发明是有关于一种移除基板表面过量金属的电解装置及应用该装置以移除过量金属的方法，且特别是有关于一种可连续且非接触式地移除基板表面过量金属的电解装置及移除方法。The present invention relates to an electrolysis device for removing excess metal on the surface of a substrate and a method for removing excess metal using the device, and in particular to an electrolysis device that can continuously and non-contact remove excess metal on the surface of a substrate Installation and removal methods.

背景技术Background technique

随着全球个人计算机、消费性电子产品及通讯产品不断要求轻薄短小更要具备高效能的趋势下，电子芯片不但被要求电子特性要好、功能要多、整体体积也要愈小。随着芯片级尺寸封装(CSP)技术的成熟，目前系统封装(System in Package，SiP)已然成为封装技术的主流。系统封装可将不同功能的芯片、被动组件或是其它模块进行构装，以使电子产品具备更多的功能。系统封装也包括了不同技术如平面型的多芯片模块封装、或是为节省面积将不同功能芯片堆栈(Stack)起来的3D堆栈封装等等，都属于系统封装(SiP)技术的发展范畴。另外，在缩小整体体积的产品趋势下，积体化线路间距越来越小，要想在基板上高效率地布置走线也变得越来越困难，因此将被动组件或线路设计内埋至基板内的设计因应而生，此种具有电性功能的载板，称为整合性基板(Integrated Substrate)或功能性基板(Functional Substrate)。With the trend of global personal computers, consumer electronics and communication products constantly requiring light, thin and high performance, electronic chips are required not only to have better electronic characteristics, but also to have more functions and smaller overall size. With the maturity of Chip Scale Package (CSP) technology, System in Package (SiP) has become the mainstream of packaging technology. System-in-package can construct chips, passive components or other modules with different functions to make electronic products have more functions. System packaging also includes different technologies such as planar multi-chip module packaging, or 3D stack packaging in which chips with different functions are stacked (Stack) to save space, etc., all of which belong to the development category of system in package (SiP) technology. In addition, under the trend of reducing the overall volume of products, the pitch of integrated circuits is getting smaller and smaller, and it is becoming more and more difficult to efficiently arrange wiring on the substrate. Therefore, passive components or circuit designs are embedded in The design inside the substrate was born accordingly, and this kind of carrier board with electrical functions is called an integrated substrate (Integrated Substrate) or a functional substrate (Functional Substrate).

不论是使用传统基板(如印刷电路板)、或是内埋有被动组件和/或线路设计的内埋式线路基板的电子产品，在制作产品过程的一连串步骤中，去除多余的导电材料以使导电材料减薄或平坦化属常见和必要步骤之一。目前广泛应用的几种去除多余导电材料的方式，例如机械式磨削(mechanical grinding)、化学液浸蚀、化学机械研磨(chemical mechanical polishing，CMP)、或接触式电解等方式。然而这些现有操作方式各有其缺点。Regardless of whether it is an electronic product that uses a traditional substrate (such as a printed circuit board) or an embedded circuit substrate embedded with passive components and/or circuit designs, in a series of steps in the production process, excess conductive materials are removed to enable Conductive material thinning or planarization is one of the common and necessary steps. There are several methods widely used to remove redundant conductive materials, such as mechanical grinding, chemical solution etching, chemical mechanical polishing (CMP), or contact electrolysis. However, each of these existing modes of operation has its own disadvantages.

以下以一种应用两种平坦化方式的传统工艺作说明，其步骤包括：先应用机械式磨削方式进行多余导电材料的减薄，再应用化学液浸蚀方式蚀刻剩余金属部分，以达平坦化。The following is an illustration of a traditional process using two flattening methods. The steps include: first use mechanical grinding to thin the excess conductive material, and then use chemical liquid etching to etch the remaining metal parts to achieve flatness. change.

请参照图1～3B。图1绘示传统利用机械式磨削过厚金属层的示意图。图2A～2D绘示图1中金属层经多次研磨减薄步骤的示意图。如图1和2A～2D所示，基板110(如印刷电路板PCB)上的介电层图案120被厚厚的金属层130覆盖，利用一磨轮(grinding wheel)140对金属层130表面高速旋转，以进行多次微小深度的研磨。其中沿着图1中线2A～2D分别代表磨轮140在金属层130表面的不同次研磨位置，研磨后的金属层表面分别对应地显示于图2A～2D的130a～130d。经过机械式磨削后，原本如图1、2A、2B所示的凹凸表面，虽然在图2C中已呈现平整，但为使后续平坦化工艺(如化学蚀刻)更容易进行，继续研磨金属层表面130c使其厚度再减薄，而呈现如图2D所示的金属层表面130d。之后，将经过机械式磨削的图2D组件浸置于含有化学蚀刻液150的槽器，如图3A所示，利用化学液浸蚀方式蚀刻多余金属层，最后如图3B所示，经过化学蚀刻后的金属层达到平坦化，即金属层表面130d与介电层图案120表面齐平。Please refer to Figures 1-3B. FIG. 1 is a schematic diagram of conventional mechanical grinding of an overthick metal layer. 2A-2D are schematic diagrams of the metal layer in FIG. 1 undergoing multiple grinding and thinning steps. As shown in Figures 1 and 2A-2D, thedielectric layer pattern 120 on the substrate 110 (such as a printed circuit board PCB) is covered by athick metal layer 130, and a grinding wheel (grinding wheel) 140 is used to rotate the surface of themetal layer 130 at a high speed , in order to carry out multiple micro-deep grinding. Thelines 2A-2D in FIG. 1 represent different grinding positions of thegrinding wheel 140 on the surface of themetal layer 130, respectively, and the polished metal layer surface is correspondingly shown as 130a-130d in FIGS. 2A-2D . After mechanical grinding, although the uneven surface shown in Figure 1, 2A, and 2B is flat in Figure 2C, in order to make the subsequent planarization process (such as chemical etching) easier, continue to grind the metal layer The thickness of the surface 130c is further reduced to present ametal layer surface 130d as shown in FIG. 2D. Afterwards, the mechanically ground assembly in FIG. 2D is dipped in a tank containingchemical etching solution 150, as shown in FIG. 3A, and the excess metal layer is etched by chemical solution etching. Finally, as shown in FIG. 3B, after chemical etching The etched metal layer is planarized, that is, thesurface 130 d of the metal layer is flush with the surface of thedielectric layer pattern 120 .

然而，在进行机械式磨削以去除多余导电材料时可能会产生研磨残渣、产生应力不平均而集中某处使组件变形、或磨伤甚至产生裂痕等问题。而利用化学液浸蚀方式其平坦化的均匀度(uniformity)有限，且难以控制蚀刻终点及无法选择性地进行区域蚀刻。However, when mechanical grinding is performed to remove redundant conductive materials, problems such as grinding residues, uneven stress, and concentrated deformation of components, or abrasion or even cracks may occur. However, the uniformity of planarization is limited by the chemical liquid etching method, and it is difficult to control the etching end point and cannot selectively perform regional etching.

至于化学机械研磨(CMP)则是结合了机械式磨削和化学液浸蚀两种特点，其作法主要是将待加工件压在旋转的弹性衬垫(研磨垫)上，利用相对运动加工的抛光技术，将具有腐蚀性的加工液供给到待加工件上，当工件进行腐蚀加工(化学性)时，同时供给超微磨粒(直径100纳米以下)抛光(机械性)材料，对待加工件的凸部进行选择性的研磨操作，故称化学机械研磨。因此，化学机械研磨出现的缺点综合了前述两种方式的问题，包括产生微粒(Particle)、研磨残渣、研浆(slurry)残渣、磨伤(scratch)、裂痕(crack)、凹痕(recess)、浸蚀(erosion)、空洞(void)和工艺不安定性等缺点，都会影响组件良率。As for chemical mechanical polishing (CMP), it combines the characteristics of mechanical grinding and chemical liquid etching. Its method is mainly to press the workpiece to be processed on the rotating elastic pad (grinding pad), and use relative motion to process Polishing technology, supplying corrosive processing fluid to the workpiece to be processed, when the workpiece undergoes corrosion processing (chemical), at the same time supply ultra-fine abrasive grains (diameter less than 100 nanometers) polishing (mechanical) material, the workpiece to be processed The convex part is selectively polished, so it is called chemical mechanical polishing. Therefore, the shortcomings of chemical mechanical polishing combine the problems of the aforementioned two methods, including the generation of particles, grinding residues, slurry residues, scratches, cracks, and recesses. , Erosion (erosion), void (void) and process instability and other defects will affect the component yield.

发明内容Contents of the invention

本发明有关于一种移除基板表面过量金属的电解装置及应用该装置以移除过量金属的方法，利用连续但非接触式的电解装置进行电解反应，使过量金属可连续地被移除，且基板不会产生变形，金属也不会被过度蚀刻。The present invention relates to an electrolysis device for removing excess metal on the surface of a substrate and a method for using the device to remove excess metal. A continuous but non-contact electrolysis device is used to carry out electrolysis reaction, so that excess metal can be continuously removed. And the substrate will not be deformed, and the metal will not be over-etched.

根据本发明，提出一种移除基板表面过量金属的电解装置，包括：一电解槽(electrolysis bath)，包含一电解液；一输送系统(transportation system)，设置于电解槽处，用以传送一基板自输送系统的一上游端往一下游端移动，其中基板浸没于该电解液中；一阳极滚轮(anode roller)，对应设置于电解槽处，且阳极滚轮位于输送系统的上游端；一阴极滚轮(cathode roller)，位于输送系统上方并设置于相对阳极滚轮的下游处，且阴极滚轮的底部部分浸渍于电解液中；至少一遮蔽板(shielding plate)，位于阴极滚轮的下游且遮蔽输送系统的下游端。进行电解时，阳极滚轮与基板的一表面接触，阴极滚轮则与基板表面呈一距离。其中，与阳极滚轮接触后的基板表面在往输送系统的下游端时，于移动至遮蔽板之前可与阴极滚轮之间产生一电场，以进行电解。According to the present invention, an electrolysis device for removing excess metal on the surface of a substrate is proposed, comprising: an electrolysis bath, including an electrolyte; a transportation system, arranged at the electrolysis bath, for delivering an electrolysis bath The substrate moves from an upstream end of the conveying system to a downstream end, wherein the substrate is immersed in the electrolyte; an anode roller (anode roller) is correspondingly arranged at the electrolytic cell, and the anode roller is located at the upstream end of the conveying system; a cathode a cathode roller positioned above the conveyor system and positioned downstream relative to the anode roller, and the bottom portion of the cathode roller is immersed in the electrolyte; at least one shielding plate positioned downstream of the cathode roller and shielding the conveyor system downstream end. During electrolysis, the anode roller is in contact with a surface of the substrate, and the cathode roller is at a distance from the surface of the substrate. Wherein, when the surface of the substrate contacted with the anode roller moves to the downstream end of the conveying system, an electric field can be generated between the cathode roller and the cathode roller before moving to the shielding plate for electrolysis.

根据本发明，再提出一种移除基板表面过量金属的电化学设备，至少包括两组连续式电解装置。每组连续式电解装置包括：包含一电解液的一电解槽；设置于电解槽处的一输送系统，用以传送一基板自输送系统的上游端往下游端移动，其中基板浸置于电解液中；一阳极滚轮，设置于输送系统上方并部分浸置于电解槽内，且阳极滚轮位于输送系统的上游端；一阴极滚轮，位于输送系统上方并设置于相对阳极滚轮的下游处，且阴极滚轮的底部部分浸渍于电解液中；和至少一遮蔽板，位于阴极滚轮的下游且遮蔽输送统的下游端。进行电解时，阳极滚轮与基板表面接触，阴极滚轮则与基板表面呈一距离。其中，两组连续式电解装置独立设置，基板于一组电解装置内一次电解后再移至另一组电解装置进行二次电解。According to the present invention, an electrochemical device for removing excess metal on the surface of a substrate is proposed, which includes at least two sets of continuous electrolysis devices. Each group of continuous electrolysis devices includes: an electrolytic tank containing an electrolytic solution; a conveying system arranged at the electrolytic tank to transport a substrate to move from the upstream end of the conveying system to the downstream end, wherein the substrate is immersed in the electrolytic solution Middle; an anode roller, set above the conveying system and partially immersed in the electrolytic cell, and the anode roller is located at the upstream end of the conveying system; a cathode roller, located above the conveying system and arranged at the downstream relative to the anode roller, and the cathode the bottom portion of the roller is immersed in the electrolyte; and at least one shielding plate located downstream of the cathode roller and shielding the downstream end of the conveyor system. During electrolysis, the anode roller is in contact with the surface of the substrate, and the cathode roller is at a distance from the surface of the substrate. Among them, two sets of continuous electrolysis devices are set independently, and the substrate is electrolyzed in one set of electrolysis devices and then moved to another set of electrolysis devices for secondary electrolysis.

根据本发明，提出一种移除基板表面过量金属的方法，包括步骤：According to the present invention, a method for removing excess metal on the surface of a substrate is proposed, comprising the steps of:

提供一电解装置，包括：An electrolysis device is provided, comprising:

一电解槽，包含一电解液；an electrolytic cell containing an electrolyte;

一输送系统，设置于电解槽处并具有一上游端和一下游端；a delivery system disposed at the electrolytic cell and having an upstream end and a downstream end;

一阳极滚轮，设置于输送系统上方并部分浸置于电解槽内，且阳极滚轮位于输送系统的上游端；An anode roller arranged above the conveying system and partially submerged in the electrolytic cell, and the anode roller is located at the upstream end of the conveying system;

一阴极滚轮，位于输送系统上方并设置于相对阳极滚轮的下游处，且阴极滚轮的底部部分浸渍于电解液中；和a cathode roller positioned above the conveyor system and positioned downstream relative to the anode roller, with the bottom portion of the cathode roller submerged in electrolyte; and

至少一遮蔽板，位于阴极滚轮的下游且遮蔽输送系统的下游端；at least one shielding plate located downstream of the cathode roller and shielding the downstream end of the conveyor system;

置放一基板于输送系统处，且基板浸没于电解液中；placing a substrate at the delivery system, and submerging the substrate in the electrolyte;

使该基板自输送系统的上游端往下游端移动；和moving the substrate from an upstream end to a downstream end of the conveyor system; and

令阳极滚轮与基板的表面接触使其呈阳极电性，而位于阳极滚轮后方的阴极滚轮与基板的表面呈一距离，阴极滚轮与呈阳极电性的基板表面之间形成一电场，以将基板表面上的过量金属电解去除。The anode roller is in contact with the surface of the substrate to make it anodic, and the cathode roller behind the anode roller is at a distance from the surface of the substrate, and an electric field is formed between the cathode roller and the surface of the substrate that is anodic, so that the substrate Excess metal on the surface is removed electrolytically.

为让本发明的上述内容能更明显易懂，下文特举一较佳实施例，并配合附图，作详细说明如下：In order to make the above-mentioned content of the present invention more obvious and understandable, a preferred embodiment is specially cited below, together with the accompanying drawings, and described in detail as follows:

附图说明Description of drawings

图1绘示传统利用机械式磨削过厚金属层的示意图。FIG. 1 is a schematic diagram of conventional mechanical grinding of an overthick metal layer.

图2A～2D绘示图1中金属层经多次研磨减薄步骤的示意图。2A-2D are schematic diagrams of the metal layer in FIG. 1 undergoing multiple grinding and thinning steps.

图3A绘示利用化学液浸蚀方式蚀刻多余金属层的示意图。FIG. 3A is a schematic diagram of etching redundant metal layers by chemical liquid etching.

图3B绘示图3A的化学蚀刻后金属层达到平坦化的示意图FIG. 3B is a schematic diagram illustrating the planarization of the metal layer after chemical etching in FIG. 3A

图4绘示依照本发明第一实施例的电解装置的示意图。FIG. 4 is a schematic diagram of an electrolysis device according to a first embodiment of the present invention.

图5为图4的阳极滚轮、阴极滚轮和基板的局部放大示意图。FIG. 5 is a partially enlarged schematic view of the anode roller, the cathode roller and the substrate in FIG. 4 .

图6绘示依照本发明第二实施例的电化学设备的示意图，其中电化学设备包括两组电解装置。6 is a schematic diagram of an electrochemical device according to a second embodiment of the present invention, wherein the electrochemical device includes two sets of electrolysis devices.

主要组件符号说明：Description of main component symbols:

110：基板110: Substrate

120：介电层图案120: dielectric layer pattern

130：金属层130: metal layer

130a～130d：金属层表面130a～130d: the surface of the metal layer

140：磨轮140: grinding wheel

150：化学蚀刻液150: chemical etchant

20：连续式电解装置20: Continuous electrolysis device

21：电解槽21: Electrolyzer

210：电解液210: Electrolyte

22：输送系统22: Conveyor system

221：支撑板221: support plate

224：输送滚轮224: conveyor roller

23：阳极滚轮23: Anode Roller

24：阴极滚轮24: cathode roller

241：阴极滚轮的轴承241: Bearings for cathode rollers

25、251a～251e、252a～252e：遮蔽板25, 251a～251e, 252a～252e: shielding board

26：清洗系统26: Cleaning system

261：第一喷嘴261: First Nozzle

263：刮刀263: scraper

265a、265b：第二喷嘴265a, 265b: second nozzle

27：承接盘27: Undertake plate

30：基板30: Substrate

31：芯板31: core board

32：厚树脂层32: thick resin layer

321：沟槽321: Groove

34：基板表面的过量导电金属34: Excess conductive metal on substrate surface

R：基板移动方向R: substrate moving direction

D2：阳极滚轮和阴极滚轮之间的水平距离D2: Horizontal distance between anode roller and cathode roller

A：有效电场范围的区域A: The area of the effective electric field range

n1、n2：电解反应停止区域n1, n2: electrolytic reaction stop area

具体实施方式Detailed ways

本发明提出一种移除基板表面过量金属的电解装置，以及应用该装置以移除过量金属的方法，主要利用连续但非接触式的电解反应，不但使过量金属可连续地被移除，基板不会因应力集中而产生变形，且电解过程中亦不会过度蚀刻金属，可控制蚀刻终点，因此应用本发明方法的基板在去除金属后仍保持良好的外观与电性，不会影响组件良率。再者，本发明所提出的连续式电解装置，可广泛地应用在各种尺寸和不同态样的基板，包括大、小、厚、薄等各种基板，而电解装置中的电解速率亦可依照欲去除的金属厚度作适当设定和调整，以达到最大电解效率，十分弹性。The present invention proposes an electrolysis device for removing excess metal on the surface of a substrate, and a method for removing excess metal using the device, which mainly utilizes continuous but non-contact electrolytic reaction, so that not only the excess metal can be continuously removed, but also the substrate It will not be deformed due to stress concentration, and the metal will not be over-etched during the electrolysis process, and the etching end point can be controlled. Therefore, the substrate using the method of the present invention still maintains good appearance and electrical properties after metal removal, and will not affect the quality of components. Rate. Furthermore, the continuous electrolysis device proposed by the present invention can be widely applied to substrates of various sizes and different shapes, including various substrates such as large, small, thick, and thin, and the electrolysis rate in the electrolysis device can also be adjusted. Properly set and adjust according to the thickness of the metal to be removed to achieve the maximum electrolysis efficiency, very flexible.

以下根据本发明提出实施例，以详细说明本发明的移除基板表面过量金属的电解装置及应用该装置以移除过量金属的方法。然而实施例中所提出的装置与方法仅为举例说明之用，并非作为限缩本发明保护范围之用。再者，实施例的图标仅绘示本发明技术的相关组件，省略不必要的组件，以清楚显示本发明的技术特点。另外，本发明可适用于各种态样的基板和移除不同种类的金属，例如移除一内埋式线路基板表面的过量金属铜。The following embodiments are provided according to the present invention to describe in detail the electrolytic device for removing excess metal on the surface of a substrate and the method for removing excess metal using the device. However, the devices and methods proposed in the embodiments are for illustration purposes only, and are not intended to limit the protection scope of the present invention. Furthermore, the icons of the embodiments only show the relevant components of the technology of the present invention, and unnecessary components are omitted, so as to clearly show the technical features of the present invention. In addition, the present invention is applicable to various types of substrates and removes different types of metals, for example, removing excess metal copper on the surface of an embedded circuit substrate.

第一实施例first embodiment

请参照图4，其绘示依照本发明第一实施例的电解装置的示意图。本发明用以移除基板表面过量金属的方法主要是提供至少如图4所示的一连续式电解装置20，令待处理的基板在特殊设计的电解装置20中连续地输送和进行电解反应后，可达到移除表面过量金属的目的。再者，于第一实施例中使用单一组电解装置进行电解反应。Please refer to FIG. 4 , which shows a schematic diagram of an electrolysis device according to a first embodiment of the present invention. The method of the present invention for removing excess metal on the substrate surface mainly provides a continuous electrolysis device 20 as shown in FIG. , can achieve the purpose of removing excess metal on the surface. Furthermore, in the first embodiment, a single set of electrolysis devices is used to carry out the electrolysis reaction.

根据本发明的第一实施例，水平设置的连续式电解装置20主要包括一充有电解液210的电解槽(electrolysis bath)21、一输送系统(transportation system)22、一阳极滚轮(anode roller)23、一阴极滚轮24和至少一遮蔽板(shielding plate)25。According to the first embodiment of the present invention, the horizontally arranged continuous electrolysis device 20 mainly includes anelectrolysis bath 21 filled withelectrolyte solution 210, atransportation system 22, and an anode roller (anode roller). 23. Acathode roller 24 and at least oneshielding plate 25.

如图4所示，输送系统22设置于电解槽处，例如浸设于电解液210中，用以传送一基板30自该输送系统22的一上游端(如图中的左端)往一下游端(如图中的右端)移动，移动方向如图中箭号R所示。输送系统22的构件和有许多种类，在此实施例中以常见的连续输送方式作说明，例如包括：用以承载一待处理基板30的一支撑板(supporting plate)221；对应支撑板221两侧设置的一组导轨(guiding rail)(未显示)；和多组间隔排列的输送滚轮(guiding rollers)224。输送滚轮224对应设置于支撑板221下方，使支撑板221可沿着导轨连续地移动而水平传送基板30。其中，放置于支撑板221上的基板30浸没于电解液中。然而输送系统22的详细构件与设计并不限于此实施例的说明，只要能使基板30在电解装置20中能连续地输送并配合进行以下所说明的反应，即可应用于本发明。As shown in FIG. 4 , the conveyingsystem 22 is arranged at the electrolytic cell, for example, immersed in theelectrolytic solution 210, for conveying a substrate 30 from an upstream end (the left end in the figure) of the conveyingsystem 22 to a downstream end. (the right end in the figure) to move, and the direction of movement is shown by the arrow R in the figure. There are many types of components in the conveyingsystem 22. In this embodiment, a common continuous conveying method is used for illustration, for example, including: a supporting plate (supporting plate) 221 for carrying a substrate 30 to be processed; two corresponding supporting plates 221 A set of guide rails (guiding rails) (not shown) arranged on the side; and multiple sets of conveying rollers (guiding rollers) 224 arranged at intervals. The conveyingrollers 224 are correspondingly disposed under thesupport plate 221 , so that thesupport plate 221 can move continuously along the guide rail to horizontally transport the substrate 30 . Wherein, the substrate 30 placed on thesupport plate 221 is immersed in the electrolyte solution. However, the detailed components and design of thetransport system 22 are not limited to the description of this embodiment, as long as the substrate 30 can be continuously transported in the electrolysis device 20 and cooperate with the reaction described below, it can be applied to the present invention.

阳极滚轮23设置于电解槽21处且位于输送系统22的上游端。较佳地，阳极滚轮23设置在相对于阴极滚轮24的上游处。阳极滚轮23的设置方式例如是位于输送系统22上方并部分浸置于电解液210中，或如实施例图所示全部浸置于电解液210中，本发明并没有特别限制。Theanode roller 23 is arranged at theelectrolysis cell 21 and at the upstream end of the conveyingsystem 22 . Preferably, theanode roller 23 is arranged upstream relative to thecathode roller 24 . The arrangement of theanode roller 23 is, for example, located above the conveyingsystem 22 and partially immersed in theelectrolyte 210 , or completely immersed in theelectrolyte 210 as shown in the figure of the embodiment, which is not particularly limited in the present invention.

阴极滚轮24，位于输送系统22上方且较佳地设置于相对于阳极滚轮23的下游处，且阴极滚轮24至少一部分(例如底部部分)浸渍于电解液210中。在本发明的较佳实施例中，阴极滚轮24的轴承(shaft)241位于电解液210的液面上方，且阴极滚轮24的半径大于阳极滚轮23的半径。Thecathode roller 24 is located above the conveyingsystem 22 and is preferably disposed downstream relative to theanode roller 23 , and at least a part (eg bottom portion) of thecathode roller 24 is immersed in theelectrolyte 210 . In a preferred embodiment of the present invention, theshaft 241 of thecathode roller 24 is located above the liquid level of theelectrolyte 210 , and the radius of thecathode roller 24 is greater than the radius of theanode roller 23 .

另外，由于进行电解时，阳极滚轮23与基板30接触，但阴极滚轮与基板30表面保持一距离(即不与基板30接触，后续会有详细说明)，因此在电解装置20中，阳极滚轮23到支撑板221的垂直距离小于阴极滚轮24到支撑板221的垂直距离。至于阳极滚轮23和阴极滚轮24之间的实际水平距离D2视不同的应用条件而定，例如可依照施于电解装置20的电压和总电流大小将水平距离D2调整至一最佳值，以达到其预定的应用效果。In addition, because during electrolysis, theanode roller 23 is in contact with the substrate 30, but the cathode roller keeps a distance from the surface of the substrate 30 (that is, not in contact with the substrate 30, which will be described in detail later), so in the electrolysis device 20, theanode roller 23 The vertical distance to thesupport plate 221 is smaller than the vertical distance from thecathode roller 24 to thesupport plate 221 . As for the actual horizontal distance D2 between theanode roller 23 and thecathode roller 24, it depends on different application conditions. its intended application effect.

请同时参照图4和图5。图5为图4的阳极滚轮、阴极滚轮和基板的局部放大示意图。进行电解时，使浸泡于电解液210中的基板30在输送系统22的传送下，自上游端往下游端连续地移动，且阳极滚轮23与基板30的待处理表面(即具有待去除金属)接触，使基板表面的金属呈阳极电性。而至少一部分浸渍于电解液210中的阴极滚轮24则与基板30的待处理表面相距一距离D1(两者不接触)。当具阳极电性的基板30表面移动至靠近阴极滚轮24的下方处，则可与阴极滚轮24之间形成一电场(如虚线箭号所示)，以将基板30表面上的多余金属34溶解去除，并还原沉积在阴极滚轮24的表面上(又称反电解，de-plating)，而达到移除基板表面过量金属的目的。Please refer to Figure 4 and Figure 5 at the same time. FIG. 5 is a partially enlarged schematic view of the anode roller, the cathode roller and the substrate in FIG. 4 . During electrolysis, the substrate 30 soaked in theelectrolytic solution 210 is continuously moved from the upstream end to the downstream end under the transmission of the conveyingsystem 22, and theanode roller 23 and the surface to be treated of the substrate 30 (that is, have metal to be removed) Contact, so that the metal on the surface of the substrate is anodic. At least a part of thecathode roller 24 immersed in theelectrolytic solution 210 is at a distance D1 from the surface to be treated of the substrate 30 (both are not in contact). When the surface of the substrate 30 with anodicity moves to the place below thecathode roller 24, an electric field (as shown by the dotted arrow) can be formed between thecathode roller 24 and theexcess metal 34 on the surface of the substrate 30 is dissolved. Remove, and restore and deposit on the surface of the cathode roller 24 (also known as reverse electrolysis, de-plating), so as to achieve the purpose of removing excess metal on the surface of the substrate.

在图5中，以一内埋式线路基板作为实施例说明时的基板态样。制作内埋式线路基板时，例如是在芯板31上的厚树脂层32处定义出沟槽321，并覆盖导电金属34于厚树脂层32上方以填满沟槽，在沟槽321内的金属则构成基板的线路图形。因此，在制作过程中应用本发明的实施例即可迅速且不损伤线路与基板的情况下，顺利地移除基板表面过量的导电金属34，使沟槽内的金属和树脂层32表面可位于同一平面，如图5中右方所示的基板结构(已去除基板表面过量金属)，而形成表面平整且厚度薄的一内埋式线路基板。当然，本发明可应用在各种态样的基板，包括如图所示的内埋式线路基板30、或其它态样的基板，并不特别限制何种结构的基板才可应用本发明以去除基板表面过量金属。In FIG. 5 , an embedded circuit substrate is taken as the substrate form when the embodiment is described. When making an embedded circuit substrate, for example, agroove 321 is defined at the thick resin layer 32 on the core board 31, and theconductive metal 34 is covered on the thick resin layer 32 to fill the groove. The metal constitutes the circuit pattern of the substrate. Therefore, by applying the embodiment of the present invention in the manufacturing process, the excessiveconductive metal 34 on the surface of the substrate can be quickly and smoothly removed without damaging the circuit and the substrate, so that the surface of the metal and resin layer 32 in the groove can be located on the surface of the substrate. On the same plane, the substrate structure shown on the right side of FIG. 5 (excess metal on the substrate surface has been removed), forms an embedded circuit substrate with a flat surface and a thin thickness. Of course, the present invention can be applied to various types of substrates, including the embedded circuit substrate 30 as shown in the figure, or other types of substrates, and there is no particular limitation on what kind of structure substrates can be applied to the present invention to remove Excess metal on substrate surface.

另外，进行电解时，阴极滚轮24与基板30表面相距的距离D1与反电解速率成反比，即距离D1越小，反电解速率越快。当然，通入的电流密度I越大，反电解速率越快。另外，基板30在输送系统中的移动速度V可根据实际应用所需的反电解速率(想去除的金属厚度)而计算出一较佳值。因此，距离D1、电流密度I和移动速度V等多项参数在此并不限定于一定值，而是视应用所需作适当设定。In addition, during electrolysis, the distance D1 between thecathode roller 24 and the surface of the substrate 30 is inversely proportional to the reverse electrolysis rate, that is, the smaller the distance D1, the faster the reverse electrolysis rate. Of course, the greater the current density I, the faster the reverse electrolysis rate. In addition, the moving speed V of the substrate 30 in the conveying system can be calculated according to the reverse electrolysis rate (thickness of metal to be removed) required in practical applications. Therefore, the parameters such as the distance D1, the current density I, and the moving speed V are not limited to certain values, but can be appropriately set according to the application requirements.

再者，由于基板30表面上的多余金属溶解后会往阴极滚轮24方向移动而还原沉积在阴极处，因此设置阴极滚轮24时，使其轴承241较佳地高于电解液210的液面，不与电解液210液面接触，以避免还原后的金属结晶在轴承241处结块而阻塞轴承，影响阴极滚轮24的转动。Furthermore, since the excess metal on the surface of the substrate 30 will move toward thecathode roller 24 after being dissolved and be reduced and deposited on the cathode, when thecathode roller 24 is set, thebearing 241 is preferably higher than the liquid level of theelectrolyte 210, Do not contact with the liquid surface of theelectrolyte 210 to prevent the reduced metal crystals from agglomerating at thebearing 241 to block the bearing and affect the rotation of thecathode roller 24 .

另外，本发明的电解装置20更包括至少一遮蔽板25，以遮蔽该输送系统22的下游端。请见图5，此遮蔽板25为一绝缘材质，其设置位置可遮盖已通过阴极滚轮24下方且往输送系统22下游端移动的基板30。如图5所示，与阳极滚轮23接触后呈阳极电性的基板30表面金属34在往输送系统22的下游端移动时，于移动至遮蔽板25之前的该段区域A可与阴极滚轮24之间产生一电场，以将基板30表面过多的金属部分电解移除。当基板30通过区域A进入遮蔽板25下方，则呈阳极电性的基板30表面受到遮蔽板的绝缘作用，仅有轻微电解效应，随着基板30表面离阴极滚轮24越来越远而逐渐无法进行电解，如图5中箭号所指的n1和n2区域处，电解反应可自动停止。因此，遮蔽板25可避免基板30表面的金属部分被过度电解蚀刻。In addition, the electrolysis device 20 of the present invention further includes at least oneshielding plate 25 to shield the downstream end of the conveyingsystem 22 . Please refer to FIG. 5 , the shieldingplate 25 is made of an insulating material, and its position can cover the substrate 30 that has passed under thecathode roller 24 and is moving to the downstream end of the conveyingsystem 22 . As shown in Figure 5, when themetal 34 on the surface of the substrate 30 that is anodically charged after being in contact with theanode roller 23 moves to the downstream end of the conveyingsystem 22, the section A before moving to the shieldingplate 25 can be connected to thecathode roller 24. An electric field is generated between them to electrolytically remove excess metal on the surface of the substrate 30 . When the substrate 30 enters under the shieldingplate 25 through the area A, the surface of the anode electric substrate 30 is insulated by the shielding plate, and only a slight electrolytic effect is obtained. For electrolysis, the electrolysis reaction can be automatically stopped at the n1 and n2 regions indicated by the arrows in Figure 5. Therefore, the shieldingplate 25 can prevent the metal portion on the surface of the substrate 30 from being excessively electrolytically etched.

在实施例中，如图4所示，连续式电解装置20装设有多块遮蔽板(shielding plates)25、251a～251e、252a～252e，分别位于支撑板221的上下侧且间隔地设置于输送滚轮224之间。其中，该些遮蔽板其中之一(即遮蔽板251c)亦可较佳地设置于阳极滚轮23与阴极滚轮24之间，此时阳极电性的基板30表面和阴极滚轮24之间所产生的有效电场范围即为图5所示的区域A。再者，图4中相对于基板30上方的遮蔽板25、251d、251e具有如上述避免基板30表面金属过度蚀刻的遮蔽作用，而相对于基板30下方的遮蔽板252a～252e则可与基板上方遮蔽板25、251a～251e采用相同或不同的材质，本发明并不特别限制。In an embodiment, as shown in FIG. 4 , the continuous electrolysis device 20 is equipped with a plurality of shielding plates (shielding plates) 25, 251a-251e, 252a-252e, which are respectively located on the upper and lower sides of thesupport plate 221 and arranged at intervals. Between the conveyingrollers 224. Wherein, one of these shielding plates (i.e. the shieldingplate 251c) can also be preferably arranged between theanode roller 23 and thecathode roller 24, and at this time, the The effective electric field range is the area A shown in FIG. 5 . Furthermore, the shieldingplates 25, 251d, and 251e above the substrate 30 in FIG. The shieldingplates 25, 251a-251e are made of the same or different materials, which is not particularly limited in the present invention.

在实施例中，电解装置配置有一整流器(rectifier)(分别与阳极滚轮23、阴极滚轮24电性连接)，并可较佳地经由一微处理器(未显示)监视和控制其电解反应，以提供适当的电流密度进行电解，均匀地去除过量金属，而无过度去除金属之虞。其中，电流密度可依据基板的接触面积、电解液浓度和欲去除的金属厚度...等等多项参数计算出一数值，以达到最大电解效率。In an embodiment, the electrolysis device is equipped with a rectifier (respectively electrically connected to theanode roller 23 and the cathode roller 24), and preferably monitors and controls its electrolytic reaction via a microprocessor (not shown), so as to Provide proper current density for electrolysis to remove excess metal uniformly without risk of over-removal. Among them, the current density can be calculated according to the contact area of the substrate, the concentration of the electrolyte, the thickness of the metal to be removed, etc., to achieve the maximum electrolysis efficiency.

另外，本发明第一实施例的电解装置20较佳地设置一清洗系统26(cleaningsystem)于邻近阴极滚轮24处，以清洗和去除附着在阴极滚轮24表面的沉积金属。在此实施例中，清洗系统26至少包括一第一喷嘴261、一刮刀263和一第二喷嘴265a和265b。第一喷嘴261设置于阴极滚轮24转出电解槽21的一侧，可对阴极滚轮24的表面喷洒一清洗液。刮刀(squeeze knife)263设置于第一喷嘴261旁，且刮刀263前端可压触阴极滚轮24的表面。第二喷嘴则设置于该阴极滚轮24转入该电解槽21的一侧，可对阴极滚轮24的表面喷洒一微蚀液。如图4所示(阴极滚轮24为逆时针方向旋转)，当阴极滚轮24自电解液转出，刮刀263可先刮除滚轮24表面该处的金属沉积物，接着阴极滚轮24继续转动，其表面该处再经第二喷嘴265a和265b喷出的微蚀液处理而将残余物蚀刻干净之后，再进入电解槽21浸渍于电解液210中。其中，第一喷嘴261喷出的清洗液例如是去离子水，第二喷嘴265a和265b喷出的微蚀液例如是包括稀释硫酸(dilute sulfuric acid)与过氧化氢(hydrogenperoxide)的一混和液。因此，当基板30表面多余的金属连续地被移除时，清洗系统26也不断地去除阴极滚轮24表面上沉积的金属，而不需如传统电解操作一段时间后就必需特别停机进行装置的清理和维护，省时省力也降低操作成本。In addition, the electrolysis device 20 of the first embodiment of the present invention is preferably provided with a cleaning system 26 (cleaning system) adjacent to thecathode roller 24 to clean and remove the deposited metal attached to the surface of thecathode roller 24 . In this embodiment, thecleaning system 26 at least includes afirst nozzle 261, ascraper 263 and asecond nozzle 265a and 265b. Thefirst nozzle 261 is arranged on the side where thecathode roller 24 rotates out of theelectrolytic cell 21 , and can spray a cleaning solution on the surface of thecathode roller 24 . A scraper (squeeze knife) 263 is disposed beside thefirst nozzle 261 , and the front end of thescraper 263 can press against the surface of thecathode roller 24 . The second nozzle is arranged on the side where thecathode roller 24 turns into theelectrolytic cell 21 , and can spray a microetching solution on the surface of thecathode roller 24 . As shown in Figure 4 (thecathode roller 24 rotates counterclockwise), when thecathode roller 24 turns out from the electrolyte, thescraper 263 can first scrape off the metal deposits on the surface of theroller 24, and then thecathode roller 24 continues to rotate, its After the surface is treated with microetching solution sprayed from thesecond nozzles 265 a and 265 b to etch the residue, it enters theelectrolytic tank 21 and is immersed in theelectrolytic solution 210 . Wherein, the cleaning solution ejected from thefirst nozzle 261 is, for example, deionized water, and the microetching liquid ejected from thesecond nozzles 265a and 265b is, for example, a mixed solution comprising dilute sulfuric acid and hydrogen peroxide. . Therefore, when the excess metal on the surface of the substrate 30 is continuously removed, thecleaning system 26 also continuously removes the metal deposited on the surface of thecathode roller 24, without having to shut down the device for cleaning after a period of time like the traditional electrolysis operation and maintenance, saving time and labor and reducing operating costs.

再者，电解装置20更较佳地包括一回收系统例如一承接盘27，邻近于清洗系统26设置，以收集自该阴极滚轮24表面刮除下来的金属沉积物(如铜渣，copper debris)，并将回收的沉积物进行后处理或是再利用，以免产生污染物和浪费资源。Furthermore, the electrolysis device 20 preferably includes a recovery system such as a receivingtray 27, which is arranged adjacent to thecleaning system 26 to collect metal deposits (such as copper slag, copper debris) scraped off from the surface of thecathode roller 24 , and post-processing or reusing the recovered sediment to avoid the generation of pollutants and waste of resources.

第二实施例second embodiment

根据本发明，亦可使用多组如第一实施例所示的电解装置以达到移除基板表面过量金属的目的。图6绘示依照本发明第二实施例的电化学设备的示意图，其中电化学设备包括两组电解装置。其中，每组电解装置的细部构件请参照第一实施例，在此不再重复赘述。According to the present invention, multiple sets of electrolysis devices as shown in the first embodiment can also be used to achieve the purpose of removing excess metal on the surface of the substrate. 6 is a schematic diagram of an electrochemical device according to a second embodiment of the present invention, wherein the electrochemical device includes two sets of electrolysis devices. Wherein, for the detailed components of each group of electrolysis devices, please refer to the first embodiment, which will not be repeated here.

第二实施例主要是提供至少两组连续式电解装置20，使待处理的基板在第一组电解装置中连续地输送和进行电解反应后，再进入第二组电解装置中作连续电解，以达到移除表面过量金属的目的。其中，两组连续式电解装置独立运作，如各自配置整流器(rectifier)，以独立控制各组电解装置的情形。再者，依照实际应用情况所需，两组电解装置可调整成具有相同或是不同的电解速率，以去除基板表面的过量金属。例如使两组连续式电解装置具有不同的电解液浓度或相关电解参数，使两组电解装置具有不同的电解速率。然而，只要能达到完全去除过量金属的目的，本发明并不特别限制电化学设备中多组电解装置的电解速率及其相关设定。The second embodiment mainly provides at least two groups of continuous electrolysis devices 20, so that the substrates to be processed are continuously transported and electrolyzed in the first group of electrolysis devices, and then enter the second group of electrolysis devices for continuous electrolysis, so that To achieve the purpose of removing excess metal on the surface. Wherein, two groups of continuous electrolysis devices operate independently, for example, each is equipped with a rectifier (rectifier), so as to independently control the situation of each group of electrolysis devices. Furthermore, according to actual application requirements, the two sets of electrolysis devices can be adjusted to have the same or different electrolysis rates, so as to remove excess metal on the surface of the substrate. For example, the two groups of continuous electrolysis devices have different electrolyte concentrations or related electrolysis parameters, and the two groups of electrolysis devices have different electrolysis rates. However, as long as the purpose of completely removing excess metal can be achieved, the present invention does not particularly limit the electrolysis rate and related settings of the multiple sets of electrolysis devices in the electrochemical device.

另外，本发明上述第一、二实施例所使用的电解液，可包括金属离子(metal ion)、硫酸(sulfuric acid)、磷酸盐(phosphate)、酸碱值缓冲剂(pH buffer)和有机抑制剂(organic leveler)。当基板表面具有过量金属铜待去除时，电解液的金属离子为铜离子(copper ion)。其中，磷酸盐可保护产品导电图案，避免过度反电解金属而造成导电图案的蚀刻；有机抑制剂则是利用有机物质来改善金属表面的电场分布，使阴极滚轮和阳性金属表面之间的反电解作用更为均匀。但应用本发明时，电解液的实际组成并不限于上述物质，而应视应用情况所需而作成分的适当选择与调配。再者，电解液也可依电解反应状况进行补充或调整成分比例。In addition, the electrolytic solution used in the first and second embodiments of the present invention may include metal ions, sulfuric acid, phosphate, pH buffer and organic inhibitors. agent (organic leveler). When there is excess metal copper on the surface of the substrate to be removed, the metal ions in the electrolyte are copper ions. Among them, phosphate can protect the conductive pattern of the product and avoid the etching of the conductive pattern caused by excessive anti-electrolysis of the metal; organic inhibitors use organic substances to improve the electric field distribution on the metal surface, so that the anti-electrolysis between the cathode roller and the positive metal surface The effect is more uniform. However, when applying the present invention, the actual composition of the electrolyte is not limited to the above-mentioned substances, and the components should be properly selected and formulated according to the needs of the application. Furthermore, the electrolyte solution can also be replenished or the composition ratio adjusted according to the electrolytic reaction status.

相较传统去除基板表面过量金属的方式和上述实施例所提出的电解装置和方法，本发明具有多项优点，例如：Compared with the traditional method of removing excess metal on the surface of the substrate and the electrolysis device and method proposed in the above embodiments, the present invention has many advantages, such as:

(1)阴极滚轮和基板表面维持一距离(非接触式电解)，没有传统使用机械式磨削时直接施以一应力于基板而造成应力不均和基板变形等问题，因此应用本发明方法的基板在去除金属后仍保持良好的外观与电性，不会影响组件良率；(1) The distance between the cathode roller and the surface of the substrate is maintained (non-contact electrolysis), and there is no problem of uneven stress and deformation of the substrate caused by directly applying a stress to the substrate when traditionally using mechanical grinding. Therefore, the application of the method of the present invention After the metal is removed, the substrate still maintains good appearance and electrical properties, which will not affect the component yield;

(2)本发明的非接触式电解反应发生于基板上方，传输系统设置于基板下方，透过实施例所提出的传输系统，可允许一厚度较薄的基板稳定地在本发明的电解装置中传送和进行多余金属去除反应，没有损害或造成基板弯曲变形、甚至破片之虞。(2) The non-contact electrolytic reaction of the present invention occurs above the substrate, and the transmission system is arranged below the substrate. Through the transmission system proposed in the embodiment, a thinner substrate can be stably placed in the electrolysis device of the present invention Transfer and carry out excess metal removal reactions without risk of damaging or warping the substrate, or even breaking it.

(3)阴极滚轮和基板表面维持一距离(非接触式电解)，可稳定地供给一电流密度即可；(3) Keep a distance between the cathode roller and the surface of the substrate (non-contact electrolysis), and a current density can be stably supplied;

(4)本发明提出的水平式连续操作的电解装置，可弹性地应用在各种尺寸的基板，而电解装置中的输送系统各参数(如基板传输速度)亦可依照欲去除的金属厚度作适当调整，十分弹性。(4) The horizontal continuous operation electrolysis device proposed by the present invention can be flexibly applied to substrates of various sizes, and the parameters of the conveying system in the electrolysis device (such as the substrate transmission speed) can also be adjusted according to the thickness of the metal to be removed. Properly adjusted, very flexible.

(5)配置有整流器的电解装置可经由一微处理器监视和控制其电解反应，以提供适当的电流密度进行电解，均匀地去除过量金属，而无过度去除金属之虞；其中电流密度可依据基板的接触面积、电解液浓度等多项参数计算出一数值，以达到最大电解效率。(5) The electrolysis device equipped with a rectifier can monitor and control its electrolysis reaction through a microprocessor, so as to provide an appropriate current density for electrolysis, and remove excess metal uniformly without the risk of excessive metal removal; wherein the current density can be based on A number of parameters such as the contact area of the substrate and the concentration of the electrolyte are calculated to achieve the maximum electrolysis efficiency.

(6)电解装置的遮蔽板可避免基板表面的金属部分被过度电解蚀刻，且当基板表面离阴极滚轮越来越远将逐渐无法进行电解，电解反应自动停止，可控制蚀刻终点。(6) The shielding plate of the electrolysis device can prevent the metal part on the surface of the substrate from being excessively electrolytically etched, and when the surface of the substrate is farther and farther away from the cathode roller, electrolysis will gradually become impossible, and the electrolysis reaction will automatically stop, which can control the end point of etching.

(7)电解装置中较佳地配置清洗系统，可使阴极滚轮表面常保干净而无金属沉积物堆积残留，因此可连续进行去除反应，无须特别停机进行清理，省时省力，也没有传统产生金属残渣而磨伤基板或使基板产生裂痕等问题；(7) The cleaning system is preferably configured in the electrolysis device, which can keep the surface of the cathode roller clean and free of metal deposits. Therefore, the removal reaction can be carried out continuously without special shutdown for cleaning, saving time and effort, and there is no traditional metal production. Residues may damage the substrate or cause cracks in the substrate;

(8)电解装置中较佳地配置回收系统，达到资源回收再利用的目的。(8) The recovery system is preferably configured in the electrolysis device to achieve the purpose of resource recovery and reuse.

(9)清洗系统和回收系统较佳地配置于电解槽上方，可顺利回收金属残渣，不但符合环保不造成污染，电解液亦可一再使用。(9) The cleaning system and recovery system are preferably arranged above the electrolytic tank, which can smoothly recover metal residues. Not only is it in line with environmental protection and does not cause pollution, the electrolyte can also be used again and again.

(10)电解装置中较佳地使阴极滚轮的轴承高于电解液，可避免还原后的金属结晶在轴承处结块而阻塞轴承，影响阴极滚轮的转动。(10) In the electrolysis device, it is preferable to make the bearing of the cathode roller higher than the electrolyte, so as to prevent the reduced metal crystals from agglomerating at the bearing to block the bearing and affect the rotation of the cathode roller.

综上所述，虽然本发明已以较佳实施例揭露如上，然其并非用以限定本发明。本发明所属技术领域中具有通常知识者，在不脱离本发明的精神和范围内，当可作各种的更动与润饰。因此，本发明的保护范围当视后附的权利要求书所界定者为准。To sum up, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Those skilled in the art of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims (13)

1. electrolyzer that removes excessive metals on substrate surface comprises:

One electrolyzer (electrolysis bath) comprises an electrolytic solution;

One delivery system (transportation system) is arranged at this electrolyzer place, moves toward a downstream end from a upstream extremity of this delivery system in order to transmit a substrate, and wherein this substrate is immersed in this electrolytic solution;

One anode roller (anode roller), correspondence is arranged at this electrolyzer place, and this anode roller is positioned at this upstream extremity of this delivery system, and when wherein carrying out electrolysis, this anode roller contacts with a surface of this substrate;

One negative electrode roller (cathode roller), be positioned at this delivery system top and be arranged at the downstream part of this anode roller relatively, and the base section of this negative electrode roller impregnated in this electrolytic solution, and when wherein carrying out electrolysis, this negative electrode roller then is a distance with this surface of this substrate; With

At least one masking shield (shielding plate) is positioned at the downstream of this negative electrode roller and covers this downstream end of this delivery system;

Wherein, with this substrate surface after this anode roller contacts toward this downstream end of this delivery system the time, before moving to this masking shield can and this negative electrode roller between produce an electric field, to carry out electrolysis.

2. electrolyzer as claimed in claim 1, wherein this delivery system comprises:

One back up pad (supporting plate) is in order to carry this substrate;

One group of guide rail (guiding rail) is provided with both sides that should back up pad; And

Several conveying rollers (guiding rollers), correspondence are arranged at this back up pad below, and this back up pad is moved with this substrate of horizontal transmission continuously along this group guide rail.

3. electrolyzer as claimed in claim 2, wherein this anode roller arrives the vertical range of this back up pad less than this negative electrode roller to the vertical range of this back up pad.

4. electrolyzer as claimed in claim 1, wherein the radius of this negative electrode roller is greater than the radius of this anode roller.

5. electrolyzer as claimed in claim 1, wherein this electrolyzing device more comprises a cleaning system, is adjacent to this negative electrode roller setting, to clean the surface of this negative electrode roller.

6. electrolyzer as claimed in claim 5, wherein this cleaning system comprises:

One first nozzle is arranged at the side that this negative electrode roller produces this electrolyzer, with surface sprinkling one scavenging solution to this negative electrode roller;

One scraper (squeeze knife) is arranged at by this first nozzle, and end is pressed the surface of touching this negative electrode roller before this scraper, to strike off the metal deposit of this negative electrode roller surface; With

One second nozzle is arranged at the side that this negative electrode roller changes this electrolyzer over to, so that this negative electrode roller surface is sprayed a micro-etching solution.

7. an electrochemical apparatus that removes excessive metals on substrate surface comprises two groups of continous way electrolyzers at least, and every group of continous way electrolyzer comprises:

One electrolyzer (electrolysis bath) comprises an electrolytic solution;

One delivery system (transportation system) is arranged at this electrolyzer place, moves toward a downstream end from a upstream extremity of this delivery system in order to transmit a substrate, and wherein this substrate soaks and places this electrolytic solution;

One anode roller (anode roller) is arranged at this delivery system top and part and soaks and place in this electrolyzer, and this anode roller is positioned at this upstream extremity of this delivery system, when wherein carrying out electrolysis, and surperficial a contact of this anode roller and this substrate;

One negative electrode roller (cathode roller), be positioned at this delivery system top and be arranged at the downstream part of this anode roller relatively, and the base section of this negative electrode roller impregnated in this electrolytic solution, and when wherein carrying out electrolysis, this negative electrode roller then is a distance with this surface of this substrate; With

At least one masking shield (shielding plate) is positioned at the downstream of this negative electrode roller and covers this downstream end of this delivery system;

Wherein, these two groups of continous way electrolyzers independently are provided with, and this substrate moves to another group electrolyzer again and carries out re-electrolysis behind the once electrolytic in one group of electrolyzer.

8. method that removes excessive metals on substrate surface comprises step:

One electrolyzer is provided, comprises:

One electrolyzer (electrolysis bath) comprises an electrolytic solution;

One delivery system (transportation system) is arranged at this electrolyzer place and has a upstream extremity and a downstream end;

One anode roller (anode roller) is arranged at this delivery system top and part and soaks and place in this electrolyzer, and this anode roller is positioned at this upstream extremity of this delivery system;

One negative electrode roller (cathode roller) is positioned at this delivery system top and is arranged at the downstream part of this anode roller relatively, and the base section of this negative electrode roller impregnated in this electrolytic solution; With

At least one masking shield (shielding plate) is positioned at the downstream of this negative electrode roller and covers this downstream end of this delivery system;

Put a substrate in this delivery system place, and this substrate is immersed in this electrolytic solution;

This substrate is moved toward this downstream end from this upstream extremity of this delivery system; With

Make this anode roller contact making it be anode electrical with the surface of this substrate, and be positioned at this negative electrode roller at this anode roller rear and the surface of this substrate is a distance, this negative electrode roller and be between this electrical substrate surface of anode and form an electric field is to remove the excess metal electrolysis on this substrate surface.

9. method as claimed in claim 8, wherein be this electrical substrate surface of anode after this anode roller contacts the time toward this downstream end of this delivery system, before moving to this masking shield can and this negative electrode roller between produce this electric field, to carry out electrolysis.

10. method as claimed in claim 8, wherein this delivery system comprises: a back up pad of carrying this substrate; One group of guide rail that both sides that should back up pad are provided with; With several conveying rollers that are arranged at this back up pad below; When this back up pad moves with this substrate of horizontal transmission continuously along this group guide rail, this substrate is moved toward this downstream end from this upstream extremity of this delivery system.

11. method as claimed in claim 8, wherein this electrolyzing device more comprises a cleaning system, is adjacent to this negative electrode roller setting, and this method more comprises: when this negative electrode roller after this electrolytic solution produces, this cleaning system cleans this negative electrode roller surface, changes in this electrolyzer again.

12. method as claimed in claim 11, wherein this cleaning system comprises: one first nozzle is arranged at this negative electrode roller and produces a side of this electrolyzer and spray a scavenging solution; One scraper (squeeze knife) is arranged at by this first nozzle, and end is pressed the surface of touching this negative electrode roller before this scraper; With one second nozzle, be arranged at this negative electrode roller and change a side of this electrolyzer over to and spray a micro-etching solution;

When this negative electrode roller produces from this electrolytic solution, this first nozzle sprays this scavenging solution to this negative electrode roller surface, and this scraper strikes off the metal deposit of this negative electrode roller surface, then this negative electrode roller is rotated further, its surface should the place again after this micro-etching solution cleaning of this second nozzle ejection, enter again in this electrolytic solution.

13. method as claimed in claim 8, wherein this electrolyzing device more disposes a rectifier, electrically connects with this anode roller and this negative electrode roller, and this method more comprises: the electrolytic reaction when utilizing this rectifier monitoring and adjusting the removal excess metal.

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