CN101797725A - Diamond grinding material sequential distributing system and process - Google Patents
Diamond grinding material sequential distributing system and processDownload PDFInfo
- Publication number
- CN101797725A CN101797725ACN201010040071ACN201010040071ACN101797725ACN 101797725 ACN101797725 ACN 101797725ACN 201010040071 ACN201010040071 ACN 201010040071ACN 201010040071 ACN201010040071 ACN 201010040071ACN 101797725 ACN101797725 ACN 101797725A
- Authority
- CN
- China
- Prior art keywords
- diamond
- grinding material
- abrasive
- plate
- diamond grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Technical field
The present invention relates to the diamond abrasive grinding tool and make the field, refer in particular to a kind of be used to the produce diamond grinding material sequential arraying system of saw blade tip and thin-walled drill bit and the technology of arranging.
Background technology
Nonmetal fragile materials such as granite, marble, concrete, pitch are the exemplary that adopts diamond saw blade cutting or diamond core drill bit punching.Diamond saw blade has the cutting lay of diamond abrasive on the saw bit matrix periphery.The sawing cutter head is usually by diamond particles with control adamantine metal matrix and form.At present, the production technology that diamond saw blade generally adopts: metallic bond (as iron powder, copper powder, glass putty, nickel powder, cobalt powder etc.) is added certain density diamond, adopt the mode of mechanical batch mixing, diamond and metallic bond are mixed, carry out base and sintering in the mould of packing into.There is following problem in this technology: (1) mechanical batch mixing can't guarantee that diamond abrasive evenly distributes in metallic bond, cause some regional diamond abrasive excessive concentration, and some zones are low excessively, some no diamond abrasives in zone; (2) because of the diamond abrasive skewness, saw blade cutting usefulness descends, and the zone cutting resistance that diamond abrasive concentration is high is big, and smear metal is easily stopped up, and cutting efficiency is low.In the rare district of diamond, effectively sawing of diamond, because it is excessive to bear live load, impulsive force is big, diamond is easy to broken and comes off.There is not adamantine zone, the bond quick abrasion, the cutting resistance is big; (3) because of the cutting resistance is big, the cutting temperature height, bond and diamond are easily burnt.In a word, unordered the arrange problems such as often causing saw blade cutting efficiency low, cutting life-span weak point, cut quality difference of diamond abrasive in cutter head.After adopting granulating process, (the diamond core drill bit production technology roughly the same) though the distribution of diamond abrasive makes moderate progress, still can not tackle the problem at its root.
In recent years, in the diamond tool industry, release the new technology of cutter head diamond grinding material sequential arraying, improved cutting-rate, prolonged life tools.Simultaneously, can save diamond, reduce diamond concentration, save cost.
The ARIX automatic placement system of new Korea Spro of Korea S (Shinhan) diamond industrial group exploitation, can be in cutter head the uniform sequential diamond abrasive of arranging.Its technology is in compacting carcass thin stock, goes out the hole of ordered arrangement in thin stock, then diamond abrasive is filled in the hole.This automation technolo degree height, but owing to be to arrange piecewise, production efficiency is low, and in addition, the equipment price costliness is difficult for promoting.
The Chinese emery wheel Song Jianmin doctor of company in China Taiwan at first arranges diamond order and is applied to saw blade tip, and the patented technology of its proposition (U.S.Patent6039641) is to implement the ordered arrangement of diamond abrasive with template.The first step of this method: carcass powder is mixed, add the suitable organic binder bond and the mixture of solvent, make " dough ", do straticulation by the method for roll extrusion then.Second step, make the template that has through hole by the particle diameter of diamond abrasive material and arrangement mode, the aperture is greater than single diamond particle diameter, less than two diamond abrasive particle diameters and, guarantee that single diamond enters in the pattern hole, template thickness is the 1/3-2/3 of diamond average grain diameter.In the 3rd step, diamond is distributed in the template through hole.The 4th step, remove template, the diamond in the hole drops on the surface of thin layer, forms the ordered arrangement array, and unnecessary diamond is removed together in company with template.In the 5th step, diamond is pressed in the carcass thin layer with plain plate.This technology is the ordered arrangement diamond abrasive accurately, but the manually-operated of per pass operation wastes time and energy, and efficient is low.
The patented technology (EP1208345A) that Switzerland ETH lathe and doctor G.Burkhard of working research institute propose is to utilize the gluing process abrasive material of arranging, point glue equipment is made up of storage glue bottle, glue conveying box, little metering head, when applying a potential pulse, little metering head is discharged a glue and is dripped, but ordered arrangement glue point, then diamond is spread in glue and drips, form adamantine ordered arrangement.This explained hereafter efficient is low, and a glue drips the abrasive material number that easy adhesion does not wait, the low precision of arranging.
In a word, because the grinding material sequential arraying technical research time is not long, obviously there is deficiency in existing diamond grinding material sequential arraying technology, mainly shows aspects such as production efficiency is low, apparatus expensive.
Summary of the invention
The invention provides a kind of efficient, low-cost diamond grinding material sequential arraying system of realizing diamond grinding material sequential arraying in saw blade tip or the thin-walled drill bit.
Purpose of the present invention is realized by following technical scheme: a kind of diamond grinding material sequential arraying system, comprise vacuum exhaust pipe (1) and vacuum chamber cylinder sleeve (2), vacuum chamber cylinder sleeve (2) lower end is fixed with the abrasive material plate (4) of arranging, the hole (10) that described abrasive material is arranged and arranged some adsorbable fixed diamond abrasive materials (7) in order in the plate (4), abrasive material arrange that plate (4) below is provided with can be with the fixing magnetic worktable (9) of the thin stock of colding pressing (8) absorption.
As a kind of improvement of the present invention, described abrasive material plate (4) upper fixed of arranging has vibrator (3).
As a kind of improvement of the present invention, the abrasive material diameter that plate (4) goes up hole (10) of arranging is 1/3 of diamond abrasive (a 7) diameter.
As a kind of improvement of the present invention, described vacuum chamber cylinder sleeve (2) lower end and abrasive material are arranged, and plate (4) passes through screw (5) and pressing plate (6) is fixing.
In addition, the present invention also provide a kind of can be efficiently with the technology of diamond grinding material sequential arraying.
A kind of diamond grinding material sequential arraying technology comprises the steps:
1. the carcass metal dust is cold-pressed into the thin stock of colding pressing (8) that thickness is 0.2～1.5mm;
2. a plurality of thin stocks of colding pressing (8) neatly are arranged in the upper surface of magnetic worktable (9), the thin stock of colding pressing (8) is fixing by magnet absorption;
3. evenly rinse one deck pressure sensitive adhesive at the thin stock of colding pressing (8) upper surface;
4. vacuumize, diamond abrasive (7) absorption is fixed in the hole (10) of the plate of arranging (4), and 2/3 of diamond abrasive (7) is exposed at the outside in hole;
5. cancel vacuum, vibrator (3) vibration, diamond abrasive (7) whereabouts ordered arrangement is on the surface of the thin stock of colding pressing (8);
6. a plurality of thin stocks of colding pressing (8) that are placed with diamond abrasive (7) are overlapping, the metal die cold moudling of packing into, the hot repressing sintering forms the diamond saw blade or the thin diamond wall drill bit of grinding material sequential arraying.
Compare with existing diamond abrasive alignment technology, the present invention has following characteristics:
1. high efficiency, system works once can be arranged more than 40, and per minute can be worked 2 times, arranges more than 80, is the highest diamond abrasive arranging system of present production efficiency.
2. automaticity height, the key operations that abrasive material is arranged is finished by equipment linkage entirely.
3. this system architecture is simple, and cost is low, is easy to promote.
Description of drawings
Fig. 1 is the structural representation of diamond grinding material sequential arraying system;
Among the figure: 1, vacuum exhaust pipe, 2, the vacuum chamber cylinder sleeve, 3, vibrator, 4, the orifice plate of arranging, 5, screw, 6, pressing plate, 7, diamond abrasive, 8, the thin stock of colding pressing, 9, magnetic worktable, 10, the hole.
The specific embodiment
Embodiment 1
A kind of novel diamond grinding material sequential arraying system, this system comprises vacuum exhaust pipe (1), vacuum chamber cylinder sleeve (2), the cylinder sleeve lower surface is by screw (5), pressing plate (6) fixed-abrasive ordered arrangement orifice plate (4), arrange and arranging 1900 holes (10) in order in the plate, adsorbable fixed diamond abrasive material (7), the plate upper fixed of arranging have vibrator (3) to be used to vibrate blanking, and a plurality of cutter heads that magnetic worktable (9) can scribble surface glue thin stock (8) absorption of colding pressing is fixing.Wherein, the abrasive material diameter that plate (4) goes up hole (10) of arranging is 1/3 of diamond abrasive (a 7) diameter.
Diamond grinding material sequential arraying technology comprises the steps:
1. the carcass metal dust is cold-pressed into the thin stock that thickness is 0.2mm;
2. a plurality of thin stocks of colding pressing neatly are arranged in the upper surface of magnetic worktable, the thin stock of colding pressing is fixing by magnet absorption;
3. evenly rinse one deck pressure sensitive adhesive at the thin stock upper surface of colding pressing;
4. vacuumize, diamond abrasive absorption is fixed in the plate hole of arranging, and 2/3 of diamond abrasive is exposed at the outside in hole;
5. cancel vacuum, abrasive material whereabouts ordered arrangement is on the surface of thin stock;
6. a plurality of bases of colding pressing that are placed with diamond abrasive are overlapping, the metal die cold moudling of packing into, the hot repressing sintering forms the diamond saw blade or the thin diamond wall drill bit of grinding material sequential arraying.
A kind of novel diamond grinding material sequential arraying system, this system comprises vacuum exhaust pipe (1), vacuum chamber cylinder sleeve (2), the cylinder sleeve lower surface is by screw (5), pressing plate (6) fixed-abrasive ordered arrangement orifice plate (4), arrange and arranging 2500 holes (10) in order in the plate, adsorbable fixed diamond abrasive material (7), the plate upper fixed of arranging have vibrator (3) to be used to vibrate blanking, and a plurality of cutter heads that magnetic worktable (9) can scribble surface glue thin stock (8) absorption of colding pressing is fixing.Wherein, the abrasive material diameter that plate (4) goes up hole (10) of arranging is 1/3 of diamond abrasive (a 7) diameter.
Diamond grinding material sequential arraying technology comprises the steps:
1. the carcass metal dust is cold-pressed into the thin stock that thickness is 1.5mm;
2. a plurality of thin stocks of colding pressing neatly are arranged in the upper surface of magnetic worktable, the thin stock of colding pressing is fixing by magnet absorption;
3. evenly rinse one deck pressure sensitive adhesive at the thin stock upper surface of colding pressing;
4. vacuumize, diamond abrasive absorption is fixed in the plate hole of arranging, and 2/3 of diamond abrasive is exposed at the outside in hole;
5. cancel vacuum, the vibrator vibration, abrasive material whereabouts ordered arrangement is on the surface of thin stock;
6. a plurality of bases of colding pressing that are placed with diamond abrasive are overlapping, the metal die cold moudling of packing into, the hot repressing sintering forms the diamond saw blade and the thin diamond wall drill bit of grinding material sequential arraying.
Claims (7)
1. diamond grinding material sequential arraying system, comprise vacuum exhaust pipe (1) and vacuum chamber cylinder sleeve (2), vacuum chamber cylinder sleeve (2) lower end is fixed with the abrasive material plate (4) of arranging, it is characterized in that: the hole (10) that described abrasive material is arranged and arranged some adsorbable fixed diamond abrasive materials (7) in order in the plate (4), abrasive material arrange that plate (4) below is provided with can be with the fixing magnetic worktable (9) of the thin stock of colding pressing (8) absorption.
2. diamond grinding material sequential arraying system according to claim 1 is characterized in that: described abrasive material plate (4) upper fixed of arranging has vibrator (3).
3. diamond grinding material sequential arraying system according to claim 1 and 2 is characterized in that: abrasive material is arranged and is being arranged 1800-2500 hole (10) on the plate (4).
4. diamond grinding material sequential arraying system according to claim 1 and 2 is characterized in that: the abrasive material diameter that plate (4) goes up hole (10) of arranging is 1/3 of diamond abrasive (a 7) diameter.
5. diamond grinding material sequential arraying system according to claim 1 is characterized in that: described vacuum chamber cylinder sleeve (2) lower end and abrasive material are arranged, and plate (4) passes through screw (5) and pressing plate (6) is fixing.
6. a diamond grinding material sequential arraying technology is characterized in that: comprise the steps:
1. the carcass metal dust is cold-pressed into the thin stock of colding pressing (8) that thickness is 0.2～1.5mm;
2. a plurality of thin stocks of colding pressing (8) neatly are arranged in the upper surface of magnetic worktable (9), the thin stock of colding pressing (8) is fixing by magnet absorption;
3. evenly rinse one deck pressure sensitive adhesive at the thin stock of colding pressing (8) upper surface;
4. vacuumize, diamond abrasive (7) absorption is fixed in the hole (10) of the plate of arranging (4), and 2/3 of diamond abrasive (7) is exposed at the outside of hole (10);
5. cancel vacuum, diamond abrasive (7) whereabouts ordered arrangement is on the surface of the thin stock of colding pressing (8);
6. a plurality of thin stocks of colding pressing (8) that are placed with diamond abrasive (7) are overlapping, the metal die cold moudling of packing into, the hot repressing sintering forms the diamond saw blade or the thin-walled drill bit of grinding material sequential arraying.
7. diamond grinding material sequential arraying technology according to claim 5 is characterized in that: described step is 5. middle with vibrator (3) vibration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010040071ACN101797725A (en) | 2010-01-19 | 2010-01-19 | Diamond grinding material sequential distributing system and process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010040071ACN101797725A (en) | 2010-01-19 | 2010-01-19 | Diamond grinding material sequential distributing system and process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101797725Atrue CN101797725A (en) | 2010-08-11 |
Family
ID=42593644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010040071APendingCN101797725A (en) | 2010-01-19 | 2010-01-19 | Diamond grinding material sequential distributing system and process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101797725A (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101786263A (en)* | 2010-03-11 | 2010-07-28 | 江苏锋泰钻石工具制造有限公司 | Novel orderly arrangement system for diamond abrasives and arrangement process |
| CN102992604A (en)* | 2012-12-16 | 2013-03-27 | 镇江丰成特种工具有限公司 | Special drilling bit for glass and manufacturing method thereof |
| CN103056450A (en)* | 2011-10-22 | 2013-04-24 | 湖南飞越新材料科技有限责任公司 | Manufacture method evenly distributing and orderly arranging diamond saw blades |
| CN103264361A (en)* | 2013-05-17 | 2013-08-28 | 华侨大学 | Manufacturing method for abrasive grain tool |
| CN103600314A (en)* | 2013-11-26 | 2014-02-26 | 北京安泰钢研超硬材料制品有限责任公司 | Device and method for coating powder on surfaces of superhard particles |
| CN104708716A (en)* | 2015-03-24 | 2015-06-17 | 福州天石源超硬材料工具有限公司 | Brazed string bead used for wire saw and manufacturing method thereof |
| CN105415215A (en)* | 2015-11-06 | 2016-03-23 | 富耐克超硬材料股份有限公司 | Orderly arrangement method for superhard abrasives |
| CN105773452A (en)* | 2016-05-04 | 2016-07-20 | 长沙理工大学 | Device and method for preparing fiber grinding wheel with orderly arranged spiral fibers |
| CN106064354A (en)* | 2016-05-30 | 2016-11-02 | 江苏锋泰工具有限公司 | Diamond abrasive arranging system |
| CN106312843A (en)* | 2016-10-31 | 2017-01-11 | 湖南城市学院 | Diamond grinding wheel and production method thereof |
| CN107460480A (en)* | 2017-08-24 | 2017-12-12 | 广东工业大学 | A kind of preparation facilities and method containing diamond coatings |
| CN108637258A (en)* | 2018-06-07 | 2018-10-12 | 江西离子型稀土工程技术研究有限公司 | A kind of diamond order arrangement saw blade manufacturing method |
| CN109158589A (en)* | 2018-08-02 | 2019-01-08 | 泉州众志金刚石工具有限公司 | The production method and its diamond tool of fine-granularity diamond tool ordered arrangement |
| CN109371395A (en)* | 2018-12-24 | 2019-02-22 | 鑫精合激光科技发展（北京）有限公司 | A kind of saw blade cutter head abrasive grains uniformly arranged mold and additive manufacturing method |
| CN109483421A (en)* | 2018-12-10 | 2019-03-19 | 郑州磨料磨具磨削研究所有限公司 | A kind of super hard abrasive realizes the device and method of ordered arrangement in electroplating abrasion wheel |
| CN109843509A (en)* | 2016-10-25 | 2019-06-04 | 3M创新有限公司 | Structured abrasive article and preparation method thereof |
| CN110918984A (en)* | 2019-12-27 | 2020-03-27 | 长沙百川超硬材料工具有限公司 | Processing device and method for directional and ordered arrangement of diamonds in wire saw bead |
| CN113001420A (en)* | 2021-01-26 | 2021-06-22 | 泉州众志新材料科技有限公司 | Diamond particle distribution method |
| CN115592581A (en)* | 2022-12-13 | 2023-01-13 | 太原理工大学（Cn） | Laser brazing manufacturing device for grinding wheel with orderly arranged abrasive particles |
| CN116749093A (en)* | 2023-08-11 | 2023-09-15 | 太原理工大学 | Preparation process of magnetic abrasive tools and slender tube polishing device based on magnetic abrasive tools |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2367286A (en)* | 1943-06-22 | 1945-01-16 | George F Keeleric | Abrasive article |
| EP0452618A1 (en)* | 1990-04-17 | 1991-10-23 | Delta Engineering | Process and apparatus for preparing an abrasive body for grinding tools |
| JP2004524173A (en)* | 2001-02-21 | 2004-08-12 | スリーエム イノベイティブ プロパティズ カンパニー | Abrasive article having optimally oriented abrasive particles and method of making same |
| CN101100049A (en)* | 2007-05-23 | 2008-01-09 | 江苏天一超细金属粉末有限公司 | Method and device for material granule uniform distributing/orderly arranging/preferred orientation |
| WO2008143464A1 (en)* | 2007-05-22 | 2008-11-27 | Ehwa Diamond Industrial Co., Ltd. | Abrasive material supplying apparatus for manufacturing segments of cutting/polishing tool and manufacturing method of segments using the same |
| CN101376234A (en)* | 2007-08-28 | 2009-03-04 | 侯家祥 | Ordered arrangement method for abrading agent granule on abrading tool and abrading tool |
- 2010
- 2010-01-19CNCN201010040071Apatent/CN101797725A/enactivePending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2367286A (en)* | 1943-06-22 | 1945-01-16 | George F Keeleric | Abrasive article |
| EP0452618A1 (en)* | 1990-04-17 | 1991-10-23 | Delta Engineering | Process and apparatus for preparing an abrasive body for grinding tools |
| JP2004524173A (en)* | 2001-02-21 | 2004-08-12 | スリーエム イノベイティブ プロパティズ カンパニー | Abrasive article having optimally oriented abrasive particles and method of making same |
| WO2008143464A1 (en)* | 2007-05-22 | 2008-11-27 | Ehwa Diamond Industrial Co., Ltd. | Abrasive material supplying apparatus for manufacturing segments of cutting/polishing tool and manufacturing method of segments using the same |
| CN101100049A (en)* | 2007-05-23 | 2008-01-09 | 江苏天一超细金属粉末有限公司 | Method and device for material granule uniform distributing/orderly arranging/preferred orientation |
| CN101376234A (en)* | 2007-08-28 | 2009-03-04 | 侯家祥 | Ordered arrangement method for abrading agent granule on abrading tool and abrading tool |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101786263A (en)* | 2010-03-11 | 2010-07-28 | 江苏锋泰钻石工具制造有限公司 | Novel orderly arrangement system for diamond abrasives and arrangement process |
| CN103056450A (en)* | 2011-10-22 | 2013-04-24 | 湖南飞越新材料科技有限责任公司 | Manufacture method evenly distributing and orderly arranging diamond saw blades |
| CN102992604A (en)* | 2012-12-16 | 2013-03-27 | 镇江丰成特种工具有限公司 | Special drilling bit for glass and manufacturing method thereof |
| CN103264361A (en)* | 2013-05-17 | 2013-08-28 | 华侨大学 | Manufacturing method for abrasive grain tool |
| CN103600314A (en)* | 2013-11-26 | 2014-02-26 | 北京安泰钢研超硬材料制品有限责任公司 | Device and method for coating powder on surfaces of superhard particles |
| CN104708716A (en)* | 2015-03-24 | 2015-06-17 | 福州天石源超硬材料工具有限公司 | Brazed string bead used for wire saw and manufacturing method thereof |
| CN105415215A (en)* | 2015-11-06 | 2016-03-23 | 富耐克超硬材料股份有限公司 | Orderly arrangement method for superhard abrasives |
| CN105773452A (en)* | 2016-05-04 | 2016-07-20 | 长沙理工大学 | Device and method for preparing fiber grinding wheel with orderly arranged spiral fibers |
| CN106064354A (en)* | 2016-05-30 | 2016-11-02 | 江苏锋泰工具有限公司 | Diamond abrasive arranging system |
| CN106064354B (en)* | 2016-05-30 | 2018-12-21 | 江苏锋泰工具有限公司 | Diamond abrasive arranging system |
| CN109843509A (en)* | 2016-10-25 | 2019-06-04 | 3M创新有限公司 | Structured abrasive article and preparation method thereof |
| US11253972B2 (en) | 2016-10-25 | 2022-02-22 | 3M Innovative Properties Company | Structured abrasive articles and methods of making the same |
| CN106312843A (en)* | 2016-10-31 | 2017-01-11 | 湖南城市学院 | Diamond grinding wheel and production method thereof |
| CN107460480B (en)* | 2017-08-24 | 2022-08-23 | 广东工业大学 | Preparation device and method of diamond-containing coating |
| CN107460480A (en)* | 2017-08-24 | 2017-12-12 | 广东工业大学 | A kind of preparation facilities and method containing diamond coatings |
| CN108637258A (en)* | 2018-06-07 | 2018-10-12 | 江西离子型稀土工程技术研究有限公司 | A kind of diamond order arrangement saw blade manufacturing method |
| CN109158589B (en)* | 2018-08-02 | 2023-12-22 | 泉州众志新材料科技有限公司 | Method for producing fine-grain diamond tools in ordered arrangement and diamond tools thereof |
| CN109158589A (en)* | 2018-08-02 | 2019-01-08 | 泉州众志金刚石工具有限公司 | The production method and its diamond tool of fine-granularity diamond tool ordered arrangement |
| CN109483421B (en)* | 2018-12-10 | 2019-08-27 | 郑州磨料磨具磨削研究所有限公司 | A kind of super hard abrasive realizes the device and method of ordered arrangement in electroplating abrasion wheel |
| CN109483421A (en)* | 2018-12-10 | 2019-03-19 | 郑州磨料磨具磨削研究所有限公司 | A kind of super hard abrasive realizes the device and method of ordered arrangement in electroplating abrasion wheel |
| CN109371395A (en)* | 2018-12-24 | 2019-02-22 | 鑫精合激光科技发展（北京）有限公司 | A kind of saw blade cutter head abrasive grains uniformly arranged mold and additive manufacturing method |
| CN109371395B (en)* | 2018-12-24 | 2023-10-20 | 鑫精合激光科技发展（北京）有限公司 | Saw blade tool bit abrasive particle uniform arrangement die and additive manufacturing method |
| CN110918984A (en)* | 2019-12-27 | 2020-03-27 | 长沙百川超硬材料工具有限公司 | Processing device and method for directional and ordered arrangement of diamonds in wire saw bead |
| CN113001420A (en)* | 2021-01-26 | 2021-06-22 | 泉州众志新材料科技有限公司 | Diamond particle distribution method |
| CN115592581A (en)* | 2022-12-13 | 2023-01-13 | 太原理工大学（Cn） | Laser brazing manufacturing device for grinding wheel with orderly arranged abrasive particles |
| CN115592581B (en)* | 2022-12-13 | 2023-03-10 | 太原理工大学 | Laser brazing preparation device for grinding wheel with orderly arranged abrasive particles |
| CN116749093A (en)* | 2023-08-11 | 2023-09-15 | 太原理工大学 | Preparation process of magnetic abrasive tools and slender tube polishing device based on magnetic abrasive tools |
| CN116749093B (en)* | 2023-08-11 | 2023-11-07 | 太原理工大学 | Preparation process of magnetic grinding tool and slender tube internal polishing device based on magnetic grinding tool |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101797725A (en) | Diamond grinding material sequential distributing system and process | |
| CN101745877B (en) | Orderly Arrangement System and Method of Diamond Abrasives | |
| CN101786263B (en) | Novel orderly arrangement system for diamond abrasives and arrangement process | |
| CN101376234B (en) | Ordered arrangement method for abrading agent granule on abrading tool and abrading tool | |
| CN102814746B (en) | Grinding material optimizing and distributing sintered diamond tool and manufacture method thereof | |
| CN101870092B (en) | Millstone for processing crystal and manufacturing method thereof | |
| MXPA05012851A (en) | Cutting segment, method of manufacturing cutting segment, and cutting tool. | |
| CN104608061B (en) | Rubber roller grinding wheel and manufacturing method thereof | |
| CN103878375B (en) | A kind of preparation method of sintered carbide tools cutter head of positioning arrangement | |
| ATE356226T1 (en) | PRODUCTION PROCESS OF A COMPOSITE MATERIAL | |
| CN202357054U (en) | Multi-layer combined type ceramic CBN (cubic boron nitride) grinding wheel | |
| CN201632941U (en) | Diamond grinding material orderly sand embedding device | |
| CN104772693B (en) | It is a kind of to be used to process diamond lap pad of ultra hard ceramic and preparation method thereof | |
| CN202861538U (en) | Saw grinding circular saw blade | |
| CN2678862Y (en) | Diamond fret-saw for cutting-off hard and fragile material | |
| CN202010956U (en) | Novel ceramic bond cubic boron nitride grinding disc | |
| CN101066586A (en) | Polishing diamond block with metal binder and its making process | |
| CN201500935U (en) | Segment type diamond grinding disc | |
| CN106064354B (en) | Diamond abrasive arranging system | |
| CN103406840B (en) | A kind of preparation method of metallographic magnetic abrasive disk | |
| CN107269225A (en) | The radial positioning distribution superthin layer composite drill bit of diamond and its manufacture craft | |
| CN107262822A (en) | The diamond full working lining ultrathin saw bit of equidistant shape positioning distribution and its manufacture craft | |
| CN115056155A (en) | Method for manufacturing porous metal bond grinding wheel | |
| CN110315642B (en) | Tool bit for gang saw by cutting granite and quartz stone with saw blade and machining process of tool bit | |
| CN202155809U (en) | Grinding wheel special for grinding of non-metal materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication | Application publication date:20100811 |