CN101749593A - Backlight module - Google Patents

Abstract

The invention relates to a backlight module comprising a reflecting sheet, a light guide sheet, a light emitting assembly and a plurality of first bonding materials. The reflecting sheet is provided with a reflecting surface, and the light guide sheet is configured on the reflecting surface. The light-emitting assembly is configured on the reflecting surface and positioned beside the light guide sheet. The first bonding materials are configured between the reflecting surface and the light guide sheet and bond the reflecting surface, the light guide sheet and the light-emitting assembly. By the adoption of the bonding materials, a plurality of assemblies of the backlight module can be installed on the reflecting sheet in a bonding way. Therefore, the invention can cancel the installation of a rubber frame, saves the cost on manufacturing the rubber frame, and shortens the size of the backlight module at the same time.

Description

Module backlight

[technical field]

The invention relates to a kind of light source module (light source module), and particularly relevant for a kind of module backlight (back light module).

[background technology]

Flourish along with opto-electronics, (liquid crystal display LCD) be widely used in the various electric equipment products, and the picture of LCD need just can be manifested by the area source that module backlight provided LCD.Therefore, module backlight be LCD indispensable significant components.

Figure 1A is the schematic top plan view of a kind of module backlight of prior art, and Figure 1B is the generalized section of Figure 1A center line I-I.See also Figure 1A and Figure 1B,traditional module backlight 100 comprises a glue frame (plasticmold) 110, aLGP 120, areflecting plate 130, a cathode fluorescent tube (Cold CathodeFluorescentLamp, CCFL) 140 and multi-disc blooming piece 150.LGP 120, cathodefluorescent tube 140 all are installed in theglue frame 110 with theseblooming pieces 150, and reflectingplate 130 is thelower planes 112 that are bonding onglue frame 110 by double faced adhesive tape (Figure 1A and Figure 1B are all not shown).

Thethickness T 1 of LGP 120 is usually more than 0.5 centimetre, and the quality of LGP 120 is harder, and is notflexible.Glue frame 110 has a plurality of flanges (flange) 114, and LGP 120 is disposed on these flanges 114.Because the quality of LGP 120 is harder, so LGP 120 can stably be seated on theseflanges 114, and is difficult for dropping fromlower plane 112.

In LGP 120 is installed inglue frame 110, and when being seated on theseflanges 114, the harder LGP 120 of quality is because of being subjected to the support offlange 114, and can carry these blooming pieces 150.So, these bloomingpieces 150 energy storehouses are onLGP 120, andblooming piece 150 is installed on theflange 114 ofglue frame 110 with LGP 120.

In present opto-electronics, the assemble method ofmodule 100 backlight normally adopts the mode of artificial assembling to carry out.Specifically, in the process of assemblingmodule 100 backlight, installing LGP 120, cathodefluorescent tube 140 and the method for theseblooming pieces 150 inglue frame 110, and to bind reflectingplate 130 all be to be carried out in the mode of free-hand assembling by the on-line operation personnel in the method forlower plane 112, rather than adopt the machinery assembling of automatic production.

[summary of the invention]

Technical problem to be solved by this invention is to provide a kind of module backlight, and it can provide area source, and the method that can utilize machinery to fit is carried out the assembling of automation.

The present invention solves the problems of the technologies described above by the following technical solutions:

A kind of module backlight comprises:

One reflector plate has a reflecting surface;

One light guide sheet is disposed on the described reflecting surface;

One luminescence component is disposed on the described reflecting surface, and is positioned at by the described light guide sheet; And

A plurality of first bonding materials are disposed between described reflecting surface and the described light guide sheet, and bind described reflecting surface, described light guide sheet and described luminescence component.

The thickness of wherein said light guide sheet is between 0.02 centimetre to 0.5 centimetre.

The described reflecting surface of the local covering of wherein said first bonding material.

Wherein at least one first bonding material is a double faced adhesive tape or an adhesive agent.

Wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

Comprise that also one is disposed at the flatness layer on the described luminescence component.

Wherein said luminescence component has the lower surface of a upper surface and a relative upper surface, and described flatness layer covers described upper surface, and wherein at least one first bonding material is bonding on described lower surface.

Wherein said flatness layer is a double faced adhesive tape or an adhesive agent.

Wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

Also comprise a pair of transmission bar, wherein said reflector plate is connected between the described transmission bar, and has a line of cut between described transmission bar and the described reflector plate.

Wherein said transmission bar has a plurality of locating holes, and described locating hole is arranged along described line of cut respectively.

Wherein said reflector plate is a white plastic sheet or a sheet metal.

Wherein said reflector plate comprises that a substrate and is disposed at the reflecting layer on the described substrate, and described reflecting layer is between described light guide sheet and described substrate.

Also comprise a reflecting material, the bottom surface and one that described light guide sheet has an exiting surface, relative this exiting surface is connected in the side between this exiting surface and this bottom surface, wherein said first bonding material is bonding between described reflecting surface and the described bottom surface, and described reflecting material covers described side.

Wherein said side comprises an incidence surface, and institute's commentary luminescence component is disposed at by this incidence surface, and described reflecting material does not cover described incidence surface.

Wherein said reflecting material is silica gel material, reflective adhesive tape or makrolon material.

Wherein said luminescence component comprises a wiring board and at least one light emitting diode that is assembled in this wiring board.

Also comprise at least one blooming piece and at least one second bonding material, wherein said second bonding material is bonding between described blooming piece and the described light guide sheet, and described light guide sheet is between described blooming piece and described reflector plate.

Wherein said second bonding material is a double faced adhesive tape or an adhesive agent.

Wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

Also comprise at least one the 3rd bonding material and a plurality of described blooming piece, and described the 3rd bonding material is bonding between the described blooming piece.

Wherein said the 3rd bonding material is a double faced adhesive tape or an adhesive agent.

Wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

Also comprise a light shield layer, wherein said light guide sheet is disposed between described light shield layer and the described reflector plate.

The invention has the advantages that: because of adopting bonding material (for example first bonding material), therefore a plurality of assemblies (for example light guide sheet and luminescence component etc.) of module backlight can be installed on the reflector plate by the mode of binding.So, the present invention can cancel the installing of glue frame, to save the cost of making the glue frame, dwindles the volume of module backlight simultaneously.

[description of drawings]

Figure 1A is the schematic top plan view of a kind of module backlight of prior art.

Figure 1B is the generalized section of Figure 1A center line I-I.

Fig. 2 A is the schematic top plan view of the module backlight of one embodiment of the invention.

Fig. 2 B is the generalized section of Fig. 2 A center line J-J.

Fig. 2 C is the schematic top plan view of reflector plate among Fig. 2 A.

Fig. 3 is the generalized section of the module backlight of another embodiment of the present invention.

Fig. 4 A is the schematic top plan view of the module backlight of another embodiment of the present invention.

Fig. 4 B is the generalized section of Fig. 4 A center line K-K.

[specific embodiment]

Fig. 2 A is the schematic top plan view of the module backlight of one embodiment of the invention, and Fig. 2 B is the generalized section of Fig. 2 A center line J-J.See also Fig. 2 A and Fig. 2 B,module 200 backlight not only can be installed in the LCD, and providing LCD needed area source, andmodule backlight 200 also can be installed in the luminous billboard, and as the light source of this billboard.Therefore,module 200 backlight not only can be applicable to technical field of liquid crystal displays, also can be applicable to the technical field of luminous ligthing paraphernalias such as billboard.

Module 200 backlight comprises areflector plate 210, alight guide sheet 220, aluminescence component 230 and a plurality of first bonding material 242,244.Reflector plate 210 has a reflecting surface 212, andlight guide sheet 220,luminescence component 230 and these first bonding materials 242,244 all are disposed on the reflecting surface 212.

These first bonding materials 242,244 are disposed between reflecting surface 212 and thelight guide sheet 220, and bind reflecting surface 212,light guide sheet 220 and luminescence component 230.Specifically,first bonding material 242 is bonding between reflecting surface 212 and theluminescence component 230, and thesefirst bonding materials 244 are bonding between reflecting surface 212 and thelight guide sheet 220, solight guide sheet 220 andluminescence component 230 are to utilize first bonding material 242,244 and be bonding on reflecting surface 212.

In the present embodiment, these first bonding material, 242,244 local covering reflectings surface 212, and in other embodiments, these first bonding materials 242,244 can comprehensive covering reflecting surface 212.In addition, first bonding material 242,244 can be double faced adhesive tape or adhesive agent, and wherein adhesive agent can be the liquid glue that flows easily, or sticky and not runny paste glue material.In addition, above-mentioned adhesive agent can be ultraviolet cured adhesive or heat-curable glue.

The material of these first bonding materials 242,244 can be same to each other or different to each other, or is not quite similar.For example, first bonding material 242,244 all can be the adhesive agent of double faced adhesive tape or same material; Perhaps,first bonding material 242 is a double faced adhesive tape, and thesefirst bonding materials 244 are the adhesive agent of same material or different materials, and for example thesefirst bonding materials 244 all are ultraviolet cured adhesives; Perhaps, wherein one first bondingmaterial 244 is a ultraviolet cured adhesive, and anotherfirst bonding material 244 is a heat-curable glue.

Light guide sheet 220 has an exiting surface 222, a bottom surface 224 and a side 226.Bottom surface 224 is with respect to exiting surface 222, andside 226 is connected between exiting surface 222 and the bottom surface 224, and comprises an incidence surface 226a, and wherein first bonding material 242,244 is bonding between reflecting surface 212 and the bottom surface 224.It is other thatluminescence component 230 is positioned atlight guide sheet 220, and be disposed at by the incidence surface 226a, andluminescence component 230 can be luminous towards the incidence surface 226a oflight guide sheet 220.

Many light that sent whenluminescence component 230 are in incidence surface 226a enters tolight guide sheet 220 time, and these light inlight guide sheet 220 are reflected and the influence of scattering, and most light can be from exiting surface 222 emissions.That is to say that the ray guidance thatlight guide sheet 220 can be sentluminescence component 230 basically is to exiting surface 222 emissions.

Light guide sheet 220 can be by polymethyl methacrylate (Polymethylmethacrylate, PMMA, claim acryl again), polyethylene terephthalate resin (Polyethylene Terephthalate, PET) or polyimides (Polyimide PI) waits macromolecular material made.The thickness T 2 oflight guide sheet 220 can be more than 0.5 centimetre, and promptlylight guide sheet 220 can be known LGP (for example LGP shown in Figure 1B 120).In addition, the thickness T 2 oflight guide sheet 220 also can be between 0.02 centimetre to 0.5 centimetre, and thelight guide sheet 220 soft and flexible blooming piece that can be quality.

Module 200 backlight can more comprisemulti-disc blooming piece 250, one or more second bonding material 260, and one or more the 3rd bonding material 270.Theseblooming pieces 250 can be respectively brightening piece (brightness enhancement film) and diffusion sheet (diffuser), and the two sequence of positions with respect tolight guide sheet 220 of brightening piece and diffusion sheet does not limit, for example be that brightening piece is disposed betweenlight guide sheet 220 and the diffusion sheet, or diffusion sheet is disposed betweenlight guide sheet 220 and the brightening piece.

These second bonding materials 260 are bonding on wherein between aslice blooming piece 250 andlight guide sheet 220, and these the 3rd bonding materials 270 are bonding between theseblooming pieces 250, and whereinlight guide sheet 220 is between theseblooming pieces 250 and reflector plate 210.The two material of second bonding material 260 and the 3rd bonding material 270 can be identical with the material of first bonding material 242,244.That is to say that the two is double faced adhesive tape or adhesive agent for second bonding material 260 and the 3rd bonding material 270, and this adhesive agent can be ultraviolet cured adhesive or heat-curable glue.

What must illustrate is that in other embodiments,module 200 backlight does not comprise these blooming pieces 250.Specifically, theseblooming pieces 250 can be integrated into one with light guide sheet 220.That is to say thatlight guide sheet 220 not only has the function of directing light, can also make light simultaneously, allowmodule 200 backlight be provided brightness equally distributed area source evenly from exiting surface 222 emissions.Therefore,module 200 backlight more can not need to be used for binding second bonding material 260 and the 3rd bonding material 270 ofblooming piece 250.

Secondly, allblooming pieces 250 can be integrated into one, for example brightening piece and diffusion sheet the two can be integrated into aslice blooming piece 250, somodule 200 backlight can only comprise a slice blooming piece 250.That is to say that the quantity of theblooming piece 250 thatmodule backlight 200 is included can have only a slice, thereforemodule 200 backlight can not need to be used for the 3rd bonding material 270 that theseblooming pieces 250 are sticked together.

Luminescence component 230 has the lower surface 230b of the relative upper surface 230a with of a upper surface 230a, andfirst bonding material 242 is bonding on lower surface230b.Luminescence component 230 comprises a wiring board 232 and at least one light emitting diode 234 that is assembled in wiring board 232, and light emitting diode 234 protrudes from the surface of wiring board 232.Wiring board 232 can be FPC (flexible circuit board), and can have aterminal 232a, and whereinterminal 232a can connect external power source, and it is luminous to allow light emitting diode 234 be able to.

Module 200 backlight can also comprise a flatness layer 280.Flatness layer 280 is disposed on theluminescence component 230, and covers upper surface 230a.Because light emitting diode 234 protrudes from the surface of wiring board 232, so upper surface 230a is rough surface.The flatness layer 280 comprehensive surperficial 230a that are incumbent on to fill and lead up the recess of upper surface 230a, allowmodule 200 backlight present comparatively even curface in appearance.In addition, the material of flatness layer 280 can be identical with the material of first bonding material 242,244, so flatness layer 280 can be double faced adhesive tape or adhesive agent, and this adhesive agent can be ultraviolet cured adhesive or heat-curable glue.

Module 200 backlight can also comprise alight shield layer 290, and whereinlight guide sheet 220 is disposed betweenlight shield layer 290 and the reflector plate 210.Specifically,light shield layer 290 is configurable on flatness layer 280 and these bloomingpieces 250, and can comprehensive covering flatness layer 280 and the part cover wherein aslice blooming piece 250, whereinlight shield layer 290 has anopening 292 that exposes bloomingpiece 250.

Light shield layer 290 can be black matrix adhesive tape (black matrix tap), it for example is a kind of double faced adhesive tape, and the color on relative two surfaces of this double faced adhesive tape is respectively black and white, wherein the surface exposure of black is in the outer surface ofmodule 200 backlight, the surface of white then is bonding on bloomingpiece 250 and flatness layer 280, reflecting the part light in themodule backlight 200, and then reduce the situation of light leak.

Reflector plate 210 can be single layer structure (single layer structure), shown in Fig. 2 B, and can be a slice white plastic sheet or a slice sheet metal, and whereinreflector plate 210 can reflect 224 light that send from the bottom surface.The white plastic sheet for example is the polymeric substrate that is mixed with resin material or Chinese white, and this polymeric substrate can be made by polymethyl methacrylate (PMMA), polyethylene terephthalate resin (PET) or polyimides macromolecular materials such as (PI).

Fig. 2 C is the schematic top plan view of reflector plate among Fig. 2 A.See also Fig. 2 A and Fig. 2 C, in the assembling process ofmodule 200 backlight,module 200 backlight can also comprise a pair of transmission bar S1, andreflector plate 210 is connected between these transmission bars S1.Each transmits bar S1 and has a plurality of locating hole H1, and can have a line of cut C1 between each transmission bar S1 and thereflector plate 210.

Hold above-mentionedly, these locating holes H1 arranges along these lines of cut C1 respectively, shown in Fig. 2 A and Fig. 2 C.Line of cut C1 for example is indentation or groove.By these lines of cut C1, these transmit bar S1 and can easily remove with hand.So, these transmission bars S1 is able to remove fromreflector plate 210 easily.

Each locating hole H1 that transmits bar S1 can mesh with a gear (not illustrating).When gear rotates, transmit bar S1 and can move, and then drivereflector plate 210 and move, and the number of turns by the control gear rotation,reflector plate 210 more can move to the precalculated position, is beneficial to carry out the assembling ofmodule 200 backlight.

Specifically,light guide sheet 220,luminescence component 230, these bloomingpieces 250, flatness layer 280 andlight shield layer 290 all are to be installed on thereflector plate 210 by the mode of binding, and then finish the assembling ofmodule 200 backlight.Therefore, the method thatmodule 200 backlight can utilize machinery to fit is carried out the assembling of automation, and then can produce in a large number, and the method that wherein above-mentioned machinery is fitted can adopt now that the applying board of adhesive tape processing factory carries out.

Secondly, the number of turns that can see through the control gear rotation owing toreflector plate 210 moves to the precalculated position, thereforemodule 200 backlight can utilize the applying board with winding function to assemble, and these transmit the function that bar S1 not only hastransmission reflector plate 210, have more location and the function of aiming at simultaneously, the applying boardlight guide sheet 220,luminescence component 230, bloomingpiece 250, flatness layer 280 andlight shield layer 290 can be able to be binded on correct position.

Fig. 3 is the generalized section of the module backlight of another embodiment of the present invention.See also Fig. 3, themodule backlight 300 of present embodiment is similar to themodule backlight 200 of previous embodiment, and the difference of the two only is: themodule backlight 300 of present embodiment comprises a reflector plate 310, andreflector plate 210 the two structure of itself and previous embodiment are also inequality.

Thereflector plate 210 of previous embodiment is single layer structure (please refer to Fig. 2 B), and the reflector plate 310 of present embodiment then is a sandwich construction.Specifically, reflector plate 310 comprises that a substrate 312 and is disposed at the reflectinglayer 314 on the substrate 312, wherein reflectinglayer 314 is betweenlight guide sheet 220 and substrate 312, and has a reflectingsurface 314a, and first bonding material 242,244 is bonding on reflectingsurface 314a.

Hold above-mentionedly, substrate 312 can be made by polymethyl methacrylate (PMMA), polyethylene terephthalate resin (PET) or polyimides macromolecular materials such as (PI), and reflectinglayer 314 can be metal level or Chinese white layer.When reflectinglayer 314 was metal level, reflectinglayer 314 can be to see through methods such as sputter, metal spraying or applying sheet metal to form.In addition, the function of reflector plate 310 is identical with the reflector plate ofprevious embodiment 210, so no longer repeat to give unnecessary details at this.

Fig. 4 A is the schematic top plan view of the module backlight of another embodiment of the present invention, and Fig. 4 B is the generalized section of Fig. 4 A center line K-K.See also Fig. 4 A and Fig. 4 B, themodule backlight 400 of present embodiment is similar to themodule backlight 200 of previous embodiment, the main difference of the two only is:module 200 backlight comprises a pair of transmission bar S1 (please refer to Fig. 2 A), andmodule 400 backlight does not only comprise any transmission bar S1, but also comprises a reflectingmaterial 420.

Specifically,module 400 backlight compriseslight guide sheet 210, multi-disc bloomingpiece 250,reflector plate 410 and reflectingmaterial 420, and reflectingmaterial 420 covers theside 226 oflight guide sheet 220, and can more cover theside 252 of these blooming pieces 250.Reflectingmaterial 420 has the function of reflection ray, so reflectingmaterial 420 can reflect the part light in themodule backlight 200, to reduce the situation of light leak.In addition, in the present embodiment, reflectingmaterial 420 can be silica gel material, reflective adhesive tape or Merlon (PC) material.

What deserves to be mentioned is thatmodule 400 includedreflector plates 410 backlight can be reflector plate 210 (please refer to Fig. 2 B) or the reflector plates 310 (please refer to Fig. 3) in the previous embodiment.That is to say thatreflector plate 410 can be white plastic sheet or sheet metal, perhapsreflector plate 410 also can comprise substrate and be disposed at reflecting layer on the substrate.

In sum, utilize bonding material (for example first, second and the 3rd bonding material), a plurality of assemblies of module backlight (for example light guide sheet and luminescence component etc.) can be installed on the reflector plate by the mode of binding.Therefore, module backlight of the present invention does not need to adopt the glue frame, can finish the assembling of assemblies such as light guide sheet, reflector plate and luminescence component.Hence one can see that, and the present invention can cancel the installing of glue frame, to save the cost of making the glue frame, dwindles the volume of module backlight simultaneously.

Secondly, because a plurality of assemblies of module backlight can be installed on the reflector plate by the mode of binding, therefore module backlight of the present invention can utilize mechanical method of fitting to carry out the assembling of automation.Compared to the mode of prior art with artificial assembling module backlight, module backlight of the present invention has assembling can finished fast and mass-produced advantage.

In addition, because the module backlight of prior art need adopt the glue frame to install LGP and multi-disc blooming piece, and LGP must stably be seated on the flange of glue frame, ability bearing optical diaphragm, therefore the module backlight of prior art must adopt thickness more than 0.5 centimetre, and the LGP that quality is harder, and can't adopt thickness between 0.02 centimetre to 0.5 centimetre, and the flexible blooming piece of quality softness is used as LGP.Otherwise, can easily from the landing of glue frame, be difficult to be installed in the glue frame because LGP is too soft.

Yet, module backlight of the present invention can be finished assembling by the mode of binding, and the method that more can utilize machinery to fit is assembled, therefore module backlight of the present invention can not only be installed thickness more than 0.5 centimetre, and the LGP that quality is harder, simultaneously also can install thickness between 0.02 centimetre to 0.5 centimetre, and the light guide sheet of quality soft pliable song.Compared to prior art, module backlight of the present invention can have that volume is little, the feature of thin thickness, to satisfy the trend that electronic installation such as mobile phone and mobile computer now develops towards miniaturization.

Though the present invention discloses as above with previous embodiment, so it is not in order to limiting the present invention, anyly has the knack of art technology person, and without departing from the spirit and scope of the present invention, institute does to change and the equivalence replacement of retouching, and still is in the scope of patent protection of the present invention.

Claims (24)

1. module backlight is characterized in that: comprising:

One reflector plate has a reflecting surface;

One light guide sheet is disposed on the described reflecting surface;

One luminescence component is disposed on the described reflecting surface, and is positioned at by the described light guide sheet; And

A plurality of first bonding materials are disposed between described reflecting surface and the described light guide sheet, and bind described reflecting surface, described light guide sheet and described luminescence component.

2. module backlight as claimed in claim 1 is characterized in that: the thickness of wherein said light guide sheet is between 0.02 centimetre to 0.5 centimetre.

3. module backlight as claimed in claim 1 is characterized in that: the described reflecting surface of the local covering of wherein said first bonding material.

4. module backlight as claimed in claim 1 is characterized in that: wherein at least one first bonding material is a double faced adhesive tape or an adhesive agent.

5. module backlight as claimed in claim 4 is characterized in that: wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

6. module backlight as claimed in claim 1 is characterized in that: comprise that also one is disposed at the flatness layer on the described luminescence component.

7. module backlight as claimed in claim 6 is characterized in that: wherein said luminescence component has the lower surface of a upper surface and a relative upper surface, and described flatness layer covers described upper surface, and wherein at least one first bonding material is bonding on described lower surface.

8. module backlight as claimed in claim 6 is characterized in that: wherein said flatness layer is a double faced adhesive tape or an adhesive agent.

9. module backlight as claimed in claim 8 is characterized in that: wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

10. module backlight as claimed in claim 1 is characterized in that; Also comprise a pair of transmission bar, wherein said reflector plate is connected between the described transmission bar, and has a line of cut between described transmission bar and the described reflector plate.

11. module backlight as claimed in claim 10 is characterized in that: wherein said transmission bar has a plurality of locating holes, and described locating hole is arranged along described line of cut respectively.

12. module backlight as claimed in claim 1 is characterized in that; Wherein said reflector plate is a white plastic sheet or a sheet metal.

13. module backlight as claimed in claim 1 is characterized in that; Wherein said reflector plate comprises that a substrate and is disposed at the reflecting layer on the described substrate, and described reflecting layer is between described light guide sheet and described substrate.

14. module backlight as claimed in claim 1 is characterized in that; Also comprise a reflecting material, the bottom surface and one that described light guide sheet has an exiting surface, relative this exiting surface is connected in the side between this exiting surface and this bottom surface, wherein said first bonding material is bonding between described reflecting surface and the described bottom surface, and described reflecting material covers described side.

15. module backlight as claimed in claim 14 is characterized in that; Wherein said side comprises an incidence surface, and institute's commentary luminescence component is disposed at by this incidence surface, and described reflecting material does not cover described incidence surface.

16. module backlight as claimed in claim 14 is characterized in that; Wherein said reflecting material is silica gel material, reflective adhesive tape or makrolon material.

17. module backlight as claimed in claim 1 is characterized in that; Wherein said luminescence component comprises a wiring board and at least one light emitting diode that is assembled in this wiring board.

18. module backlight as claimed in claim 1 is characterized in that; Also comprise at least one blooming piece and at least one second bonding material, wherein said second bonding material is bonding between described blooming piece and the described light guide sheet, and described light guide sheet is between described blooming piece and described reflector plate.

19. module backlight as claimed in claim 18 is characterized in that: wherein said second bonding material is a double faced adhesive tape or an adhesive agent.

20. module backlight as claimed in claim 19 is characterized in that: wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

21. module backlight as claimed in claim 18 is characterized in that: also comprise at least one the 3rd bonding material and a plurality of described blooming piece, and described the 3rd bonding material is bonding between the described blooming piece.

22. module backlight as claimed in claim 21 is characterized in that: wherein said the 3rd bonding material is a double faced adhesive tape or an adhesive agent.

23. module backlight as claimed in claim 22 is characterized in that: wherein said adhesive agent is a ultraviolet cured adhesive or a heat-curable glue.

24. module backlight as claimed in claim 1 is characterized in that: also comprise a light shield layer, wherein said light guide sheet is disposed between described light shield layer and the described reflector plate.

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