CN101340794B - heat sink - Google Patents

Abstract

Translated fromChinese

一种散热装置，用于对附加卡上的电子元件散热，该附加卡具有一顶表面及与该顶表面相对的底表面，该散热装置包括贴设于附加卡顶表面电子元件上的第一散热体、与第一散热体间隔设置的第二散热体及连接该二散热体的一热管，该热管包括一蒸发段及一冷凝段，其中该第二散热体包括位于附加卡外侧的第一散热部及由该第一散热部延伸至附加卡底表面的第二散热部，热管的蒸发段穿设于第一散热体中，热管的冷凝段穿设于第二散热体的第二散热部中，其中第二散热体的第一散热部位于附加卡顶表面所在平面的上方，第二散热部一部分延伸至附加卡的底表面，另一部分连接第一散热部且超出附加卡底表面且位于附加卡外侧。

A heat dissipation device is used for dissipating heat from electronic components on an additional card. The additional card has a top surface and a bottom surface opposite to the top surface. The heat dissipation device includes a first electronic component attached to the top surface of the additional card The heat sink, the second heat sink spaced apart from the first heat sink, and a heat pipe connecting the two heat sinks, the heat pipe includes an evaporation section and a condensation section, wherein the second heat dissipation body includes a first heat sink located outside the additional card The heat dissipation part and the second heat dissipation part extending from the first heat dissipation part to the bottom surface of the additional card, the evaporation section of the heat pipe is passed through the first heat dissipation body, and the condensation section of the heat pipe is passed through the second heat dissipation part of the second heat dissipation body Among them, the first heat dissipation part of the second heat sink is located above the plane where the top surface of the additional card is located, a part of the second heat dissipation part extends to the bottom surface of the additional card, and the other part is connected to the first heat dissipation part and exceeds the bottom surface of the additional card and is located Additional card outside.

Description

Heat abstractor

Technical field

The present invention relates to the heat abstractor of a kind of heat abstractor, particularly additional card.

Background technology

Along with technology such as high frequency imaging processing in recent years, wireless telecommunications constantly develop, calculate function and fast, directly use latest technology for making, the additional card that comprises video card, video image card (VGA card) is installed in usually and is used for improving its arithmetic speed, functipnal capability in the computer apparatus.For example image card generally comprises an independent processor, is called image processor (GPU), and storer and other circuit components together are assembled on the circuit board.Especially the GPU capacity is big, to produce heat big to be installed in electronic component on the various cards, as can not efficiently radiates heat influencing the normal operation of image card.Therefore, common mounted on surface one heating radiator at GPU dispels the heat.

Typical heating radiator has bigger volume and higher height by the aluminium extruded moulding, comprises base and the some heat radiator extended from base, in order to heat is distributed to the external world that absorb heat from heat-generating electronic elements such as GPU.Yet the distance between the additional card is narrow and small, can't hold the heating radiator of large volume like this.

Summary of the invention

In view of this, be necessary in fact to provide a kind of suitable additional card, heat abstractor that heat dispersion is good.

A kind of heat abstractor, be used for the electronic element radiating on the additional card, this additional card has a top surface and the basal surface relative with this top surface, this heat abstractor comprises first radiator that is attached on the additional card top surface electronic component, second radiator that is provided with at interval with first radiator and a heat pipe that is connected this two radiator, this heat pipe comprises an evaporator section and a condensation segment, wherein this second radiator comprises first radiating part that is positioned at the additional card outside and second radiating part that is extended to the additional card basal surface by this first radiating part, the evaporator section of heat pipe is arranged in first radiator, the condensation segment of heat pipe is arranged in second radiating part of second radiator, wherein first radiating part of second radiator is positioned at the top on plane, additional card top surface place, a second radiating part part extends to the basal surface of additional card, and another part connects first radiating part and exceeds the additional card basal surface and be positioned at the additional card outside.

Compared with prior art, second radiator in the heat abstractor of the present invention extends to the basal surface of additional card, can better utilize the space at the additional card back side to dispel the heat.

With reference to the accompanying drawings, the invention will be further described in conjunction with concrete embodiment.

Description of drawings

Fig. 1 is the three-dimensional combination figure of heat abstractor first embodiment of the present invention.

Fig. 2 is the three-dimensional exploded view of Fig. 1.

Fig. 3 is the three-dimensional exploded view at another visual angle of Fig. 1.

Fig. 4 is the three-dimensional combination figure of heat abstractor second embodiment of the present invention.

Fig. 5 is the three-dimensional exploded view of Fig. 4.

Embodiment

See also Fig. 1 to Fig. 3, be first embodiment of heat abstractor of the present invention, comprisefirst radiator 10 to the electronic component on theadditional card 50 40 heat radiation, withfirst radiator 10 at interval settingssecond radiator 20 and be connected theheat pipe 30 of first andsecond radiator 10,20.Thisadditional card 50 has top surface and the basal surface relative with top surface, and electronic component 40 is arranged on the top surface, and offers four throughholes 59 all around near electronic component 40 on theadditional card 50.

First radiator 10 comprises theheating radiator 160 that the substrate 120, that is sticked on electronic component 40 surfaces combines with substrate 120.Retaining element such asscrew 180 are used for substrate 120 is fixed toheating radiator 160 bottoms.This substrate 120 is a rectangular metal plate body, and its upper surface middle part is provided with asemi-circular grooves 122, and the relative both sides of thissemi-circular grooves 122 are respectively arranged with a rectangle raised line 124, is respectively arranged with athrough hole 126 on four jiaos of substrate 120.

Thisheating radiator 160 comprises abase 161 and is positioned at the some radiatingfins 162 that are provided with at interval on thebase 161 by the aluminium extruded moulding.Thisbase 161 is provided with arectangular depression portion 163 towardsadditional card 50, and to accommodate substrate 120, after substrate 120 was contained indepressed part 163, its baseplane flushed with the baseplane ofheating radiator 160bases 161depressed parts 163 both sides.Thesebase 161depressed parts 163 central authorities are provided with asemi-circular grooves 164 corresponding with thegroove 122 of substrate 120, thesegroove 122 both sides form the stage portion (figure does not show) that matches with the raised line 124 of substrate 120, and thissemi-circular grooves 164 is positioned at the middle part of this stage portion.The both sides ofsemi-circular grooves 164 are provided with throughhole 126 corresponding four threadedholes 168 with substrate 120.Screw 180 passes the throughhole 126 on the substrate 120 and screws togather with threadedhole 168 onheating radiator 160bases 161, and substrate 120 is fixed on thebase 161 of heating radiator 160.Offer four-way hole 166 in thisheating radiator 160 and throughhole 59 corresponding positions on theadditional card 50,first radiator 10 is fixed toadditional card 50 top surfaces thereby wear for screw rod spare 190.

Thissecond radiator 20 is fastened successively by some radiating fins that are parallel to each other 22 to be formed.Each radiating fin 22 is all L-shaped, comprises that one firstradiating part 221 reaches from first radiating part, 221 vertically extending one second radiating parts 225.Wherein, this firstradiating part 221 is positioned at the outside ofadditional card 50, and is in the top position on plane,additional card 50 top surface place; Secondradiating part 225 is by the vertical basal surface that forms and extend toadditional card 50 that extends of bottom margin of firstradiating part 221, promptly, second radiating part, 225 integral body are positioned at the below on plane,additional card 50 basal surface place, the part of secondradiating part 225 extends to the basal surface ofadditional card 50, and another part then is positioned at the lateral surface ofadditional card 50 with firstradiating part 221; Secondradiating part 225 of each radiating fin 22 is positioned on the part inadditional card 50 outsides offers a through hole, and some radiating fins 22 are interconnected to form acircular channel 226.

Please further consult Fig. 2 to Fig. 3,heat pipe 30 takes the shape of the letter U, and comprises anevaporator section 32, is parallel to acondensation segment 36 ofevaporator section 32 and connects thelinkage section 34 of thisevaporator section 32, condensation segment 36.In thisevaporator section 32 is contained in substrate 120 bywelding groove 122 and thegroove 164 common holes of forming ofheating radiator 160bases 161, thiscondensation segment 36 is contained in thepassage 226 ofsecond radiator 20 by welding.Thislinkage section 34 comprise extend fromevaporator section 32 bending and be positioned in first section 342 ofadditional card 50 top surfaces, and have a down dip that bending is extended mutually and be positioned at second section 344 ofadditional card 50 basal surfaces below from first section 342.This second section 344 outside that is positioned atadditional card 50.

For strengthening the intensity ofadditional card 50, to avoid owing to first radiator, the 10 overweightadditional card 50 that cause are out of shape, this heat abstractor further comprises a backboard 60.Thisbackboard 60 is positioned at the top of second radiatingpart 225 of basal surface,second radiator 20 of additional card 50.Thisbackboard 60 is cruciform, respectively is provided with a double-screw bolt 62 on four jiaos.Four Luorod members 190 pass the throughhole 166 on thesandwich part 160, the throughhole 59 on theadditional card 50 successively, and screw togather with double-screw bolt 62 and heat abstractor is fixed on the additional card 50.50 ofbackboard 60 and additional card are provided with isolating pad (figure do not show), when this heat abstractor is subjected to the external force vibrations so that buffer action to be provided.

After heat abstractor was fixed inadditional card 50, the lower surface of the substrate 120 offirst radiator 10 was fitted in the upper surface of electronic component 40; Simultaneously, theevaporator section 32 ofheat pipe 30 is contained in the passage ofheating radiator 160 and substrate 120 formation closely, and thecondensation segment 36 ofheat pipe 30 is contained in thepassage 226 ofsecond radiator 20 closely.At this moment,heat pipe 30 can be with the heat transferred onfirst radiator 10 of fitting in electronic component 40 tosecond radiator 20 away from electronic component 40, and then is dispersed in the external environment and goes.

See also Fig. 4 to Fig. 5, be the second embodiment of the present invention.This heat abstractor is similar to the heat abstractor among first embodiment, comprises theheat pipe 30 andsecond radiator 20 equally.This heat abstractor further comprises one first radiator 10a.Thisfirst radiator 10a comprises a substrate 120a and asandwich part 160a, and wherein the structure of this substrate 120a is identical with substrate 120 among first embodiment, and its middle part is provided with on a semi-circular grooves and four jiaos and is respectively arranged with through hole 126a.Thissandwich part 160a comprise asmooth top 161a, from the extended vertically downward connectingportion 162a in the relative both sides of 161a, this top and from connectingportion 162a base vertical outward extending junction surface 163a.On four jiaos ofjunction surface 163a, offer a throughhole 166a respectively.The top 161a of thissandwich part 160a and substrate 120a together form theevaporation part 32 of a passage to accommodate heat pipe 30.Luorod member 190 passes throughhole 166a, the throughhole 126a on the base on the 163a of junction surface and the throughhole 59 on theadditional card 50 and thefirst radiator 10a is fixed on the additional card 50.Other features of second embodiment please refer to the character pair of first embodiment, do not give unnecessary details at this.

Claims (9)

Translated fromChinese

1.一种散热装置，用于对附加卡上的电子元件散热，该附加卡具有一顶表面及与该顶表面相对的底表面，该散热装置包括贴设于附加卡顶表面电子元件上的第一散热体、与第一散热体间隔设置的第二散热体及连接该二散热体的一热管，该热管包括一蒸发段及一冷凝段，其特征在于：该第二散热体包括位于附加卡外侧的第一散热部及由该第一散热部延伸至附加卡底表面的第二散热部，热管的蒸发段穿设于第一散热体中，热管的冷凝段穿设于第二散热体的第二散热部中，其中第二散热体的第一散热部位于附加卡顶表面所在平面的上方，第二散热部一部分延伸至附加卡的底表面，另一部分连接第一散热部且超出附加卡底表面且位于附加卡外侧。1. A heat sink is used to dissipate heat to electronic components on an add-on card, the add-on card has a top surface and a bottom surface opposite to the top surface, the heat sink includes an electronic component attached to the top surface of the add-on card The first radiating body, the second radiating body spaced apart from the first radiating body, and a heat pipe connecting the two radiating bodies, the heat pipe includes an evaporation section and a condensing section, and it is characterized in that: the second radiating body includes an additional The first heat dissipation part on the outside of the card and the second heat dissipation part extending from the first heat dissipation part to the bottom surface of the additional card, the evaporation section of the heat pipe is passed through the first heat dissipation body, and the condensation section of the heat pipe is passed through the second heat dissipation body In the second heat dissipation part of the second heat dissipation body, the first heat dissipation part of the second heat dissipation body is located above the plane where the top surface of the additional card is located, a part of the second heat dissipation part extends to the bottom surface of the additional card, and the other part is connected to the first heat dissipation part and exceeds the surface of the additional card. bottom surface of the card and on the outside of the add-in card.2.如权利要求1所述的散热装置，其特征在于：所述热管的冷凝段固定于位于附加卡外侧部分的第二散热部中。2 . The heat dissipation device according to claim 1 , wherein the condensation section of the heat pipe is fixed in the second heat dissipation portion located outside the additional card. 3 .3.如权利要求1所述的散热装置，其特征在于：第二散热体由若干L形的散热鳍片组成。3. The heat dissipation device according to claim 1, wherein the second heat dissipation body is composed of a plurality of L-shaped heat dissipation fins.4.如权利要求2所述的散热装置，其特征在于：该第一散热体包括一散热器及贴合于散热器底部且与电子元件接触的一基板，所述热管的蒸发段夹置于散热器底部与基板之间。4. The heat dissipation device according to claim 2, wherein the first heat dissipation body comprises a heat sink and a substrate attached to the bottom of the heat sink and in contact with the electronic components, and the evaporation section of the heat pipe is sandwiched between between the bottom of the heat sink and the base plate.5.如权利要求2所述的散热装置，其特征在于：该第一散热体包括一夹合部及位于夹合部底部的一基板，该夹合部包括一平整的顶部，该夹合部的顶面与基板一同形成一通道，所述热管的冷凝段收容于该通道中。5. The heat dissipation device according to claim 2, wherein the first heat dissipation body comprises a clamping portion and a substrate located at the bottom of the clamping portion, the clamping portion comprises a flat top, and the clamping portion The top surface of the heat pipe together with the base plate forms a channel, and the condensing section of the heat pipe is accommodated in the channel.6.如权利要求1所述的散热装置，其特征在于：该热管的蒸发段平行于冷凝段。6. The heat dissipation device according to claim 1, wherein the evaporation section of the heat pipe is parallel to the condensation section.7.如权利要求6所述的散热装置，其特征在于：该热管还包括一连接段，该连接段包括从蒸发段弯折延伸而出的、且位于附加卡上方的第一段，及从第一段弯折延伸至附加卡下方的第二段。7. The heat dissipation device according to claim 6, characterized in that: the heat pipe further comprises a connection section, the connection section includes a first section bent and extended from the evaporating section and located above the additional card, and from The first section bends and extends to the second section below the add-in card.8.如权利要求7所述的散热装置，其特征在于：该第二段位于附加卡的外侧。8. The heat dissipation device as claimed in claim 7, wherein the second section is located outside the add-on card.9.如权利要求8所述的散热装置，其特征在于：该热管大致呈U形。9. The heat dissipation device as claimed in claim 8, wherein the heat pipe is substantially U-shaped.

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