CN101175377B

Movatterモバイル変換

Info

Publication number: CN101175377B
Application number: CN2006101427419A
Authority: CN
Inventors: 范文纲; 韦启锌
Original assignee: Inventec Corp
Current assignee: Shanghai Heze Electric Power Engineering Design And Consulting Co Ltd; State Grid Shanghai Electric Power Co Ltd
Priority date: 2006-10-30
Filing date: 2006-10-30
Publication date: 2010-08-25
Anticipated expiration: 2026-10-30
Also published as: CN101175377A

Abstract

An electronic component removing system and method is applied to a circuit board design system at least having a circuit layer, and an information storage unit is established; setting electronic component removal request information and storing the information to the information storage unit; detecting electronic components on each circuit layer of the circuit board, acquiring component information corresponding to the electronic components and storing the information to the information storage unit; extracting the electronic component removal requirement information and the component information from an information storage unit, comparing whether the component information is consistent with the electronic component removal requirement information or not, and if so, sending a removal instruction to remove the electronic component of which the component information is consistent with the electronic component removal requirement information from the circuit board; if not, the electronic component of which the component information is inconsistent with the electronic component removal requirement information is reserved. Therefore, the workload of searching and removing redundant electronic components can be saved, and omission is not easy to generate, so that the working efficiency can be improved.

Description

Translated fromChinese

电子组件移除系统及方法Electronic component removal system and method

技术领域technical field

本发明涉及一种电子组件移除系统及方法，特别是涉及一种应用于电路板设计系统中的电子组件移除系统及方法。The present invention relates to a system and method for removing electronic components, in particular to a system and method for removing electronic components applied in a circuit board design system.

背景技术Background technique

随着电子科技的高速发展，电子产品轻小化已经成为众所皆知的发展趋势，如移动电话，手提电脑，数字摄影机(DV)以及个人数字助理(PDA)，均为当前热门的电子产品，而该些电子产品之所以能在功能上越来越丰富多样但是外形却更小巧，正是因为其制作采用比以前更小的电子组件，更薄的电路板，因而可集成更多的电子组件及电路板而产品体积反而更小。With the rapid development of electronic technology, the miniaturization of electronic products has become a well-known development trend, such as mobile phones, laptop computers, digital cameras (DV) and personal digital assistants (PDA), are currently popular electronic products , and the reason why these electronic products can be more and more diverse in function but smaller in appearance is precisely because they use smaller electronic components and thinner circuit boards than before, so more electronic components can be integrated And the circuit board, but the product volume is smaller.

然而，当电路板层数增多电子组件集成度增高的同时，一些新的问题亦随之而来，由于当前集成电路工作频率非常高，电路板上具有许多高速信号(high_speed)通路且易受到电磁干扰，干扰来源多种多样，例如，电路板的孔壁镀铜过孔(PTH)和贯孔(via)的于每电路层都带有一个尺寸大于钻孔的铜垫(copper pad)，若铜垫在该层面与其它电子组件无电性连接，就不仅会形成多余短截线(stub)，而且还会使过孔阻抗发生变化，对高速信号线造成干扰，影响信号质量。However, when the number of circuit board layers increases and the integration of electronic components increases, some new problems also follow. Because the operating frequency of current integrated circuits is very high, there are many high-speed signal (high_speed) paths on the circuit board and are susceptible to electromagnetic interference. Interference, there are many sources of interference, for example, the copper-plated through-hole (PTH) and through-hole (via) of the circuit board have a copper pad (copper pad) with a size larger than the drilled hole on each circuit layer, if The copper pad is not electrically connected to other electronic components at this level, which will not only form redundant stubs, but also change the impedance of the via hole, causing interference to high-speed signal lines and affecting signal quality.

由于电路板上每层都具有大量的过孔及贯孔，对应的铜垫数量亦极其巨大，现有的技术必须通过逐层电路板的检测，从而移除多余铜垫，不仅工作量大，而且极易遗漏，效率非常低下，而遗漏未删的铜垫必将随后续的电路板生产步骤制成于电路板成品中，可能会导致电路板因干扰问题而需返工甚至重新制作的不良后果。Since each layer on the circuit board has a large number of vias and through holes, the corresponding number of copper pads is also extremely large. The existing technology must pass the inspection of the circuit board layer by layer to remove the excess copper pads. Not only is the workload heavy, but And it is very easy to miss, the efficiency is very low, and the copper pads that are not deleted will be made into the finished circuit board with the subsequent circuit board production steps, which may lead to adverse consequences that the circuit board needs to be reworked or even remade due to interference problems .

综上所述，如何能高效率移除电路板各层的多余组件，特别是前述多余的铜垫，遂成为目前亟待解决的问题。To sum up, how to efficiently remove redundant components on each layer of the circuit board, especially the aforementioned redundant copper pads, has become an urgent problem to be solved.

发明内容Contents of the invention

鉴于上述现有技术的缺点，本发明的主要目的在于提供一种电子组件移除系统及方法，应用于电路板设计系统中，可自动侦测并移除电路板中的多余电子组件。In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a system and method for removing electronic components, which is applied in a circuit board design system and can automatically detect and remove redundant electronic components in a circuit board.

本发明的另一目的在于提供一种易于实现且高效率的电子组件移除系统及方法。Another object of the present invention is to provide an easy-to-implement and high-efficiency electronic component removal system and method.

为实现上述目的，本发明提供一种电子组件移除系统，是应用于用以设计具有至少一电路层的电路板的电路板设计系统中，该电子组件移除系统包括：设定模块，用以设定电子组件移除要求信息，其中，该电子组件是形成于该电路板设置有孔壁镀铜过孔(PTH)和贯孔(via)的电路层周围的铜垫(copper pad)，该电子组件移除要求信息是指该电子组件于该电路板上与所处的电路层及其它电路层的电子组件间无电性连接的信息；侦测模块，用以侦测该电路板各电路层上的电子组件并获取对应该电子组件的组件信息，其中，该组件信息指该电子组件于该电路板上与所处的电路层及其它电路层的电子组件间是否有电性连接，以及该电子组件是否设置于该电路板的顶层及/或底层的信息；信息存储单元，用以储存通过该设定模块所设定的电子组件移除要求信息及该侦测模块所获取的对应该电子组件的组件信息；对比模块，用以自该信息存储单元提取并对比该组件信息与该电子组件移除要求信息并于得到相符合的结果时发出移除指令，其中，该移除指令包括保留设置于该电路板的顶层及/或底层的电子组件的指令；以及移除模块，用以接收该移除指令，并依据该移除指令将应移除的电子组件自该电路板上移除。In order to achieve the above object, the present invention provides an electronic component removal system, which is applied in a circuit board design system for designing a circuit board with at least one circuit layer, the electronic component removal system includes: a setting module for To set the electronic component removal request information, wherein the electronic component is a copper pad (copper pad) formed around the circuit layer of the circuit board provided with hole wall copper-plated through holes (PTH) and through holes (via), The electronic component removal request information refers to the information that the electronic component is not electrically connected to the electronic component on the circuit layer and other circuit layers on the circuit board; the detection module is used to detect each Electronic components on the circuit layer and obtain component information corresponding to the electronic component, wherein the component information refers to whether the electronic component is electrically connected to the electronic component on the circuit layer and other circuit layers on the circuit board, and whether the electronic component is arranged on the top layer and/or bottom layer of the circuit board; the information storage unit is used to store the electronic component removal request information set by the setting module and the object obtained by the detection module The component information of the electronic component; the comparison module is used to extract and compare the component information and the electronic component removal requirement information from the information storage unit and issue a removal instruction when a matching result is obtained, wherein the removal instruction including an instruction to retain the electronic components arranged on the top layer and/or bottom layer of the circuit board; and a removal module for receiving the removal instruction and removing the electronic components to be removed from the circuit board according to the removal instruction remove.

通过前述本发明的电子组件移除系统，执行本发明的电子组件移除方法包括如下步骤：建立一信息存储单元；设定电子组件移除要求信息并将该信息存储至该信息存储单元，其中，该电子组件是形成于该电路板设置有孔壁镀铜过孔(PTH)和贯孔(via)的电路层周围的铜垫(copper pad)，该电子组件移除要求信息指该电子组件于该电路板上与所处的电路层及其它电路层的电子组件间无电性连接的信息；侦测电路板各电路层上的电子组件并获取对应该电子组件的组件信息并将该信息存储至该信息存储单元，其中，该组件信息是指该电子组件于该电路板上与所处的电路层及其它电路层的电子组件间是否有电性连接，以及该电子组件是否设置于该电路板的顶层及/或底层的信息；自信息存储单元中提取该电子组件移除要求信息与该组件信息，并对比该组件信息与该电子组件移除要求信息是否相符合，若是，则发出移除指令，用以将该组件信息与电子组件移除要求信息相符合的电子组件自该电路板上移除，其中，该移除指令包括保留设置于该电路板的顶层及/或底层的电子组件的指令，用以保留该设置于该电路板的顶层及/或底层的电子组件；若否，则保留该组件信息与电子组件移除要求信息不相符合的电子组件以及设置于该电路板的顶层及/或底层的电子组件于该电路板。Through the aforementioned electronic component removal system of the present invention, executing the electronic component removal method of the present invention includes the following steps: establishing an information storage unit; setting electronic component removal request information and storing the information in the information storage unit, wherein , the electronic component is a copper pad (copper pad) formed around the circuit layer of the circuit board provided with copper-plated vias (PTH) and through holes (via), and the electronic component removal request information refers to the electronic component Information on the electrical connection between the circuit board and the electronic components on the circuit layer and other circuit layers; detect the electronic components on each circuit layer of the circuit board and obtain the component information corresponding to the electronic component and store the information Stored in the information storage unit, wherein the component information refers to whether there is an electrical connection between the electronic component on the circuit board and the electronic components on the circuit layer and other circuit layers, and whether the electronic component is arranged on the Information on the top layer and/or bottom layer of the circuit board; extract the electronic component removal request information and the component information from the information storage unit, and compare whether the component information is consistent with the electronic component removal request information, and if so, send A removal instruction is used to remove the electronic component whose component information matches the electronic component removal requirement information from the circuit board, wherein the removal instruction includes retaining the top layer and/or the bottom layer of the circuit board An instruction for electronic components to retain the electronic components disposed on the top layer and/or bottom layer of the circuit board; if not, retain the electronic components whose information does not match the electronic component removal requirement information and the electronic components disposed on the circuit The electronic components on the top and/or bottom layers of the board are on the circuit board.

相比于现有技术，本发明的电子组件移除方法及系统主要通过对比自动侦测到的电子组件对应的组件信息及设定的电子组件移除信息，若相符合则移除该电子组件。据此，能省却查找移除多余电子组件的工作量且不易产生遗漏，故能提高工作效率。Compared with the prior art, the electronic component removal method and system of the present invention mainly removes the electronic component by comparing the component information corresponding to the automatically detected electronic component with the set electronic component removal information. . Accordingly, the workload of finding and removing redundant electronic components can be saved and omissions are not easy to occur, so the work efficiency can be improved.

附图说明Description of drawings

图1显示为本发明的电子组件移除系统的基本架构方块示意图；FIG. 1 shows a schematic block diagram of the basic architecture of the electronic component removal system of the present invention;

图2显示为本发明的电子组件移除方法所需执行的处理流程。FIG. 2 shows the processing flow required for the electronic component removal method of the present invention.

附图标记说明Explanation of reference signs

1电子组件移除系统1Electronic component removal system

10设定模块10 setting module

11侦测模块11 detection module

12信息存储单元12 information storage unit

13对比模块13 comparison module

14移除模块14 Remove the module

2电路板设计系统2 Circuit Board Design System

20电路板20 circuit boards

S1～S6方法步骤S1～S6 method steps

具体实施方式Detailed ways

以下通过特定的具体实例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其它优点与功效。本发明亦可通过其它不同的具体实例加以施行或应用，本说明书中的各项细节亦可基于不同观点与应用，在不背离本发明的精神下进行各种修改与变更。Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

如图1所示用以说明本发明的电子组件移除系统1的基本架构方块示意图。如图所示，本发明的电子组件移除系统1，应用于电路板设计系统2中，该电路板设计系统2可为例如Protel、EDA、allegro等PCB layout设计软件等，用以设计具有至少一电路层的电路板的电路板设计系统，而本发明的电子组件移除系统1则对应该电路板设计系统2，为外挂或内置于该电路板设计软件的插件程序；本发明的电子组件移除系统1包括：设定模块10、侦测模块11、信息存储单元12、对比模块13以及移除模块14。FIG. 1 is a schematic block diagram illustrating the basic structure of the electronic component removal system 1 of the present invention. As shown in the figure, the electronic component removal system 1 of the present invention is applied in the circuitboard design system 2, and the circuitboard design system 2 can be PCB layout design software such as Protel, EDA, allegro, etc. A circuit board design system for a circuit board of a circuit layer, and the electronic component removal system 1 of the present invention corresponds to the circuitboard design system 2, which is a plug-in program for external or built-in circuit board design software; the electronic component of the present invention The removal system 1 includes: asetting module 10 , adetection module 11 , aninformation storage unit 12 , acomparison module 13 and aremoval module 14 .

该设定模块10，用以设定电子组件移除要求信息，本实施例中，该设定模块10包括一图形操作接口，供用户设定该电子组件移除要求信息时使用。Thesetting module 10 is used to set the electronic component removal request information. In this embodiment, thesetting module 10 includes a graphical operation interface for users to use when setting the electronic component removal request information.

该侦测模块11，用以侦测该电路板20的各电路层上的电子组件并获取对应该电子组件的组件信息。Thedetection module 11 is used for detecting electronic components on each circuit layer of thecircuit board 20 and obtaining component information corresponding to the electronic components.

该信息存储单元12，用以储存该电子组件移除要求信息及该侦测模块11所获取的对应该电子组件的组件信息，可为例如数据库，内存等。Theinformation storage unit 12 is used to store the electronic component removal request information and the component information corresponding to the electronic component acquired by thedetection module 11 , which can be, for example, a database, a memory, and the like.

该对比模块13，用以自该信息存储单元12提取并对比该组件信息与该电子组件移除要求信息并于得到相符合的结果时发出移除指令。Thecomparison module 13 is used for extracting and comparing the component information and the electronic component removal requirement information from theinformation storage unit 12 and issuing a removal instruction when a matching result is obtained.

该移除模块14，用以接收该移除指令，并依据该移除指令将该组件信息与该电子组件移除要求信息相符的电子组件自该电路板20上移除。Theremoval module 14 is configured to receive the removal instruction, and remove the electronic component whose component information matches the electronic component removal requirement information from thecircuit board 20 according to the removal instruction.

本实施例中，该电子组件是形成于电路板20设置有孔壁镀铜过孔(PTH)和贯孔(via)的电路层周围的铜垫(copper pad)，该电子组件移除要求信息指电子组件于电路板20上与所处的电路层及其它电路层的电子组件间无电性连接的信息，而该组件信息指电子组件于电路板20上与所处的电路层及其它电路层的电子组件间是否有电性连接，以及该电子组件是否设置于该电路板20的顶层及/或底层的信息。需补充说明，电子组件于电路板20上与所处的电路层及其它电路层的电子组件间是否有电性连接的信息，通过该电路组件是否有与所处的电路层及其它电路层的电子组件间电性连接的设定参数，为判断标准。In this embodiment, the electronic component is a copper pad (copper pad) formed around the circuit layer of thecircuit board 20 provided with copper-plated through holes (PTH) and through holes (via), and the electronic component removes the required information Refers to the information about the electrical connection between the electronic components on thecircuit board 20 and the electronic components on the circuit layer and other circuit layers, and the component information refers to the electronic components on thecircuit board 20 and the circuit layer and other circuits Whether there is an electrical connection between the electronic components of the layer, and whether the electronic components are disposed on the top layer and/or the bottom layer of thecircuit board 20 . It should be added that the electronic components on thecircuit board 20 have information on whether there is an electrical connection between the electronic components on the circuit layer and other circuit layers, and whether there is any connection between the circuit components and the circuit layer and other circuit layers. The setting parameters of the electrical connection between electronic components are the criteria for judging.

承前所述，本发明的系统通过该对比模块13对电路板20上各电路层上由该侦测模块11所获取的电子组件的组件信息及设定电子组件移除要求信息进行对比看是否相符合，即判断该电子组件是否与电路板20上其它电子组件有电性连接，若符合，即无电性连接，则将该电子组件自该电路板20移除。As mentioned above, the system of the present invention uses thecomparison module 13 to compare the component information of the electronic components obtained by thedetection module 11 on each circuit layer on thecircuit board 20 and the set electronic component removal request information to see if they are consistent. If it matches, it is to judge whether the electronic component is electrically connected to other electronic components on thecircuit board 20 .

须特别说明，于本发明的其它实施例中，该电子组件可为例如电阻，电感器等各种电子组件的其中之一，而该电子组件移除要求信息可根据实际需要而设定，例如电阻值的多少，电感值的多少等等，该组件信息亦对应该电子组件移除要求信息的变更而变化，均不以本实施例为限。It should be noted that in other embodiments of the present invention, the electronic component can be one of various electronic components such as resistors and inductors, and the electronic component removal request information can be set according to actual needs, such as The value of the resistance, the value of the inductance, etc., the component information also changes according to the change of the electronic component removal request information, which are not limited to this embodiment.

本发明的电子移除方法的方法流程如图2所示。该方法包括如下步骤：The process flow of the electron removal method of the present invention is shown in FIG. 2 . The method comprises the steps of:

在步骤S1中，先建立一信息存储单元12，例如创建数据库等。接着进行步骤S2。In step S1, first establish aninformation storage unit 12, such as creating a database. Then proceed to step S2.

在步骤S2中，设定电子组件移除要求信息，亦即电子组件于电路板20各层与其它电子组件间无电性连接的信息，并将该信息存储至该信息存储单元12。在本实施例中，该电子组件是形成于该电路板20设置有孔壁镀铜过孔(PTH)和贯孔(via)的电路层周围的铜垫(copper pad)，该电子组件移除要求信息指电子组件于该电路板20上与所处的电路层及其它电路层的电子组件间无电性连接的信息。接着进行步骤S3。In step S2 , the electronic component removal request information, ie the information that the electronic component is not electrically connected to other electronic components at each layer of thecircuit board 20 , is set, and the information is stored in theinformation storage unit 12 . In this embodiment, the electronic component is a copper pad (copper pad) formed around the circuit layer of thecircuit board 20 provided with copper-plated through holes (PTH) and through holes (via), and the electronic component is removed The required information refers to the information that the electronic components on thecircuit board 20 are not electrically connected to the circuit layer and the electronic components of other circuit layers. Then proceed to step S3.

在步骤S3中，侦测电路板20各电路层上的电子组件并获取对应该电子组件的组件信息，亦即电子组件于电路板20各层与其它电子组件间是否无电性连接的信息，并将该信息存储至该信息存储单元12。在本实施例中，该组件信息指该电子组件于该电路板20上与所处的电路层及其它电路层的电子组件间是否有电性连接，以及该电子组件是否设置于该电路板的顶层及/或底层的信息接着进行步骤S4。In step S3, detect the electronic components on each circuit layer of thecircuit board 20 and obtain the component information corresponding to the electronic components, that is, whether the electronic components are electrically connected between each layer of thecircuit board 20 and other electronic components, And store the information in theinformation storage unit 12. In this embodiment, the component information refers to whether there is an electrical connection between the electronic component on thecircuit board 20 and the electronic components on the circuit layer and other circuit layers, and whether the electronic component is arranged on the circuit board. The information of the top layer and/or the bottom layer then proceeds to step S4.

在步骤S4中，自信息存储单元12中提取并对比该电子组件移除要求信息与该移除要求信息是否相符合。若是则进行步骤S5；若否则进行步骤S6。In step S4, extract from theinformation storage unit 12 and compare whether the electronic component removal requirement information matches the removal requirement information. If yes, go to step S5; otherwise, go to step S6.

在步骤S5中，将该组件信息与电子组件移除要求信息相符合的电子组件自该电路板20上移除，亦即移除于电路板20各层与其它电子组件无电性连接的组件信息所对应的电子组件，其中，该移除指令包括保留设置于该电路板20的顶层及/或底层的电子组件的指令，用以保留该设置于该电路板的顶层及/或底层的电子组件。In step S5, the electronic components whose component information matches the electronic component removal requirement information are removed from thecircuit board 20, that is, components that are not electrically connected to other electronic components on each layer of thecircuit board 20 are removed The electronic component corresponding to the information, wherein the removal instruction includes an instruction to retain the electronic component disposed on the top layer and/or bottom layer of thecircuit board 20, so as to retain the electronic component disposed on the top layer and/or bottom layer of thecircuit board 20 components.

在步骤S6中，保留该组件信息与电子组件移除要求信息不相符合的电子组件，以及设置于该电路板20的顶层及/或底层的电子组件于该电路板20上。In step S6 , the electronic components whose component information does not match the electronic component removal requirement information, and the electronic components disposed on the top layer and/or bottom layer of thecircuit board 20 are kept on thecircuit board 20 .

综上所述，本发明的电子移除系统及方法，通过前述设定模块、侦测模块、信息存储单元、对比模块以及移除模块间的相互运作，能侦测符合该移除要求的电子组件并加以移除，不仅省却查找移除多余电子组件的工作量且不易产生遗漏，故能提高工作效率。In summary, the electron removal system and method of the present invention can detect electrons that meet the removal requirements through the interaction between the aforementioned setting module, detection module, information storage unit, comparison module, and removal module. Components are removed, which not only saves the workload of finding and removing redundant electronic components, but also prevents omissions, so it can improve work efficiency.

上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改与改变。因此，本发明的权利保护范围，应如前述的权利要求书所列。The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Any person skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be as listed in the preceding claims.

Claims

Translated fromChinese

1.一种电子组件移除系统，应用于用以设计具有至少一电路层的电路板的电路板设计系统中，其特征在于，该电子组件移除系统包括：1. An electronic component removal system applied in a circuit board design system for designing a circuit board with at least one circuit layer, characterized in that the electronic component removal system comprises:

设定模块，用以设定电子组件移除要求信息，其中，该电子组件是形成于电路板设置有孔壁镀铜过孔和贯孔的电路层周围的铜垫，该电子组件移除要求信息是指该电子组件于该电路板上与所处的电路层及其它电路层的电子组件间无电性连接的信息；The setting module is used to set the electronic component removal requirement information, wherein the electronic component is a copper pad formed around the circuit layer of the circuit board provided with copper-plated via holes and through holes on the hole wall, and the electronic component removal requirement Information refers to the information that there is no electrical connection between the electronic component on the circuit board and the circuit layer where it is located and electronic components on other circuit layers;

侦测模块，用以侦测该电路板各电路层上的电子组件并获取对应该电子组件的组件信息，其中，该组件信息指该电子组件于该电路板上与所处的电路层及其它电路层的电子组件间是否有电性连接，以及该电子组件是否设置于该电路板的顶层及/或底层的信息；The detection module is used to detect the electronic components on each circuit layer of the circuit board and obtain component information corresponding to the electronic component, wherein the component information refers to the circuit layer and other components on the circuit board where the electronic component is located Whether there is an electrical connection between the electronic components on the circuit layer, and information on whether the electronic components are placed on the top and/or bottom layers of the circuit board;

信息存储单元，用以储存通过该设定模块所设定的电子组件移除要求信息及该侦测模块所获取的对应该电子组件的组件信息；an information storage unit for storing the electronic component removal request information set by the setting module and the component information corresponding to the electronic component acquired by the detection module;

对比模块，用以自该信息存储单元提取并对比该组件信息与该电子组件移除要求信息并在得到相符合的结果时发出移除指令，其中，该移除指令包括保留设置于该电路板的顶层及/或底层的电子组件的指令；以及The comparison module is used to extract and compare the component information and the electronic component removal requirement information from the information storage unit, and issue a removal instruction when a matching result is obtained, wherein the removal instruction includes retaining the electronic component on the circuit board instructions for the top and/or bottom electronic components of the

移除模块，用以接收该移除指令，并依据该移除指令将应移除的电子组件自该电路板上移除。The removal module is used for receiving the removal instruction, and removing the electronic component to be removed from the circuit board according to the removal instruction.

2.根据权利要求1所述的电子组件移除系统，其特征在于，该对比模块得到该组件信息与该信息存储单元中的移除要求信息不符合的结果时，不发出移除指令。2 . The electronic component removal system according to claim 1 , wherein the comparison module does not issue a removal instruction when the result that the component information does not match the removal requirement information in the information storage unit is obtained. 3 .

3.一种电子组件移除方法，应用于用以设计具有至少一电路层的电路板的电路板设计系统中，其特征在于，该电子组件移除方法包括如下步骤：3. A method for removing an electronic component, applied in a circuit board design system for designing a circuit board with at least one circuit layer, characterized in that the method for removing an electronic component comprises the following steps:

1)、建立一信息存储单元；1), establish an information storage unit;

2)、设定电子组件移除要求信息并将该信息存储至该信息存储单元，其中，该电子组件是形成于该电路板设置有孔壁镀铜过孔和贯孔的电路层周围的铜垫，该电子组件移除要求信息指电子组件于该电路板上与所处的电路层及其它电路层的电子组件间无电性连接的信息；2) Set the electronic component removal requirement information and store the information in the information storage unit, wherein the electronic component is formed around the circuit layer of the circuit board with copper-plated vias and through holes on the hole wall; Pad, the electronic component removal request information refers to the information that the electronic component is not electrically connected to the circuit layer on the circuit board and the electronic components on other circuit layers;

3)、侦测电路板各电路层上的电子组件并获取对应该电子组件的组件信息并将该信息存储至该信息存储单元，其中，该组件信息指该电子组件于该电路板上与所处的电路层及其它电路层的电子组件间是否有电性连接，以及该电子组件是否设置于该电路板的顶层及/或底层的信息；3) Detecting the electronic components on each circuit layer of the circuit board and obtaining the component information corresponding to the electronic component and storing the information in the information storage unit, wherein the component information refers to the electronic component on the circuit board and all Whether there is an electrical connection between the circuit layer at the location and the electronic components of other circuit layers, and whether the electronic component is placed on the top layer and/or bottom layer of the circuit board;

4)、自信息存储单元中提取该电子组件移除要求信息与该组件信息，并对比该组件信息与该电子组件移除要求信息是否相符合，若是，则进至步骤5，若否，则进至步骤6；4) Extract the electronic component removal requirement information and the component information from the information storage unit, and compare whether the component information matches the electronic component removal requirement information, if yes, go to step 5, if not, then Go to step 6;

5)、发出移除指令，用以将该组件信息与电子组件移除要求信息相符合的电子组件自该电路板上移除，其中，该移除指令包括保留设置于该电路板的顶层及/或底层的电子组件的指令，用以保留该设置于该电路板的顶层及/或底层的电子组件；以及5) Send a removal instruction to remove the electronic component whose component information matches the electronic component removal requirement information from the circuit board, wherein the removal instruction includes retaining the top layer of the circuit board and instructions for retaining the electronic components disposed on the top and/or bottom layers of the circuit board; and

6)、保留该组件信息与电子组件移除要求信息不相符合的电子组件以及设置于该电路板的顶层及/或底层的电子组件于该电路板上。6) Keep the electronic components whose component information does not match the electronic component removal requirement information and the electronic components arranged on the top layer and/or bottom layer of the circuit board on the circuit board.