CN101093827A - Light-emitting diode packaging structure - Google Patents

Abstract

The invention relates to a light emitting diode packaging structure which is used for emitting a target peak wavelength. The first crystal grain is arranged on the carrier body and has a first peak wavelength, and the first peak wavelength is larger than the target peak wavelength. The second crystal grain is arranged on the carrier body, the second crystal grain has a second peak wavelength, the second peak wavelength is smaller than the target peak wavelength, and the first crystal grain and the second crystal grain emit light with the same color system. The LED packaging structure can emit target peak wavelength by more than two LEDs so as to improve the utilization rate of crystal grains and reduce the production cost.

Description

Package structure for LED

Technical field

The present invention relates to a kind of diode package structure, particularly relate to a kind of encapsulating structure of light-emitting diode.

Background technology

Light-emitting diode is by the made light-emitting component of semi-conducting material, and element has two electrode terminals, applies voltage between terminal, feeds minimum voltage, via the combination in electronics electricity hole, dump energy can be excited with the form of light and disengage.

Be different from general incandescent lamp bulb, light-emitting diode belongs to chemiluminescence, has advantages such as power consumption is low, component life long, need not warm up the lamp time, reaction speed is fast.Add that its volume is little, vibration resistance, be fit to volume production, the demand on the fit applications is made the element of minimum or array easily.Light-emitting diode generally is used on the indicating device and display unit of information, communication, consumption electronic products at present, becomes critical elements indispensable in the daily life.Recently, utilize light-emitting diode more to be employed as LCD (Liquid crystal Display, backlight LCD), and the trend that replaces traditional cold cathodouminescence fluorescent tube is gradually arranged.

In the prior art, crystal grain in the package structure for LED (Die) normally utilizes crystalline substance of heap of stone (Epitaxy) processing procedure of manufacture of semiconductor to make, and wherein, the luminous wavelength of crystal grain is decided by the epitaxial layer material, brilliant processing procedure therefore of heap of stone is in the light-emitting diode processing procedure, the some that cost is the highest.

As shown in Figure 1, can have a plurality of LED crystal particle D on the semiconductor crystal wafer 1, and wafer 1 can be selected suitable crystal grain D after through cutting and encapsulates, package structure for LED is applied among the various products.

Though in manufacture process, wafer is controlled so that whole crystal grain sends the light of a color of object through identical processing procedure.But same batch of plural crystal grain that manufacturing is come out, or even the plural crystal grain on the same wafer usually all may have sizable wavelength change (wavelength lengthvariation).For example same batch crystal grain color of object is a green, but the long 500nm of being of the light wave spike that one of them crystal grain of possibility sends, and the light wave spike length that another crystal grain but may send is 506nm.

Yet, in some application, for example be in the senior car light of LCD backlight module or automobile, often need the almost consistent package structure for LED of plural wavelength.Therefore, the crest wavelength of crystal grain can be strict with.That is to say,, have only and fall into a narrow and small crest wave-length coverage person, just meet dealer's quality keyholed back plate standard, can be chosen to non-defective unit and be applied in the product no matter be same batch of plural crystal grain of producing or the plural crystal grain on the same wafer.Other crystal grain outside wave-length coverage often become defective products, can't use.Thus, crystal grain all on the wafer then can't use fully, and the crystal grain utilance is not high, make that the production cost of package structure for LED is high, and cause the waste of former material.

This shows that above-mentioned existing package structure for LED obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of package structure for LED of new structure, just becoming the current industry utmost point needs improved target.

Because the defective that above-mentioned existing package structure for LED exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of package structure for LED of new structure, can improve general existing package structure for LED, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.

Summary of the invention

Main purpose of the present invention is, overcome the defective that existing package structure for LED exists, and provide a kind of package structure for LED of new structure, technical problem to be solved is that to make it send the object wave spike by plural light-emitting diode long, to improve utilization ratio of crystal grains, and reduce production costs, thereby be suitable for practicality more.

The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of package structure for LED that the present invention proposes, long in order to send an object wave spike, it comprises: a supporting body; One first crystal grain is arranged at this supporting body, and this first crystal grain luminous has a primary peak wavelength, and this primary peak wavelength is long greater than this object wave spike; And one second crystal grain, being arranged at this supporting body, this second crystal grain luminous has a secondary peak wavelength, and this secondary peak wavelength is long less than this object wave spike, and this primary peak wavelength and this secondary peak wavelength belong to same colour system.

The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.

Aforesaid package structure for LED, wherein said supporting body are a substrate or a lead frame.

Aforesaid package structure for LED, wherein said first crystal grain and this second crystal grain while or not luminous simultaneously.

Aforesaid package structure for LED, the difference of wherein said primary peak wavelength and this secondary peak wavelength is less than 50nm.

Aforesaid package structure for LED, the difference of wherein said primary peak wavelength and this secondary peak wavelength is less than 30nm.

Aforesaid package structure for LED, the difference of wherein said target wavelength and this primary peak wavelength is not equal to or equals the difference of this target wavelength and this secondary peak wavelength.

Aforesaid package structure for LED, wherein said first crystal grain is different with the luminous intensity of this second crystal grain.

Aforesaid package structure for LED, wherein said object wave spike are about between between the 615nm to 650nm, approximately between between the 515nm to 555nm or approximately between between the 455nm to 485nm.

Aforesaid package structure for LED, it more comprises one the 3rd crystal grain, and it has one the 3rd crest wavelength, and this primary peak wavelength, this secondary peak wavelength and the 3rd crest wavelength belong to this colour system.

Aforesaid package structure for LED, wherein said the 3rd crest wavelength is greater than this primary peak wavelength, and the difference of the 3rd crest wavelength and this secondary peak wavelength is less than 50nm.

Aforesaid package structure for LED, wherein said the 3rd crest wavelength is less than this secondary peak wavelength, and the difference of this primary peak wavelength and the 3rd crest wavelength is less than 50nm.

By technique scheme, package structure for LED of the present invention has following advantage at least:

A kind of package structure for LED of the present invention has plural crystal grain and primary peak wavelength and secondary peak wavelength and belongs to same colour system.Compared with prior art, package structure for LED of the present invention can be by selecting the plural crystal grain with suitable coupling wavelength, just capable of being combinedly goes out the long plural crystal grain of object wave spike, and plural plural crystal grain is packaged together.Thus, package structure for LED can make human eye in object wave spike strong point, experiences just like two luminous intensities with the long light-emitting diode of object wave spike.In addition, by the process of selecting coupling crystal grain, the encapsulation dealer scope that can relax the crest wavelength of non-defective unit crystal grain, and then can promote the crystal grain utilance of same wafer or same batch of wafer reducing production costs, and reduces the waste of former material.

In sum, the package structure for LED of novelty of the present invention, it is long to send the object wave spike by plural light-emitting diode, with the raising utilization ratio of crystal grains, and reduces production costs.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing package structure for LED has the effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.

Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.

Description of drawings

Fig. 1 is the schematic diagram that wafer forms plural crystal grain in the prior art through cutting.

Fig. 2 is a schematic diagram of package structure for LED of the present invention.

Fig. 3 is another schematic diagram of package structure for LED of the present invention.

Fig. 4 is another schematic diagram of package structure for LED of the present invention.

Fig. 5 is another schematic diagram of package structure for LED of the present invention.

Fig. 6 is in the package structure for LED of the present invention, a schematic diagram of first crystal grain and second spectrum of wavelengths that crystal grain sends, and wherein, the difference of first crystal grain and target wavelength equals the difference of second crystal grain and target wavelength.

Fig. 7 is in the package structure for LED of the present invention, another schematic diagram of first crystal grain and second spectrum of wavelengths that crystal grain sends, and wherein, the difference of first crystal grain and target wavelength is not equal to the difference of second crystal grain and target wavelength.

Fig. 8 is another schematic diagram of package structure for LED of the present invention.

1: wafer

2,2 ': package structure for LED

21,21 ': supporting body

22: the first crystal grain

23: the second crystal grain

24: the three crystal grain

25: lead-in wire

26: adhesive material

27: inside conductor

D: crystal grain

λ_t: the object wave spike is long

λ₁: the primary peak wavelength

λ₂: the secondary peak wavelength

λ₃: the 3rd crest wavelength

Embodiment

Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of package structure for LED, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.

At first, see also Fig. 2 to Fig. 3, first embodiment of package structure for LED of the present invention.

See also shown in Figure 2ly, package structure forLED 2 comprises a supportingbody 21, onefirst crystal grain 22 and one second crystal grain 23.Wherein, package structure forLED 2 is in order to send an object wave peak wavelength X_t(target peak wavelength), object wave spike length can for example be between the ruddiness between the 615nm to 650nm, between the green glow between the 515nm to 555nm or crest wavelength approximately between the blue light between the 455nm to 485nm.That is to say that object wave spike length can be stipulated specification voluntarily by the dealer, the crest wavelength that receives for package structure forLED 2 relief human eyes.And package structure forLED 2 can utilize the persistence of vision phenomenon of human eye, is simultaneously luminous or not luminous simultaneously no matter makefirst crystal grain 22 andsecond crystal grain 23, and it is long all to obtain the object wave spike.

Certainly, package structure forLED 2 object wave spikes are long also can be defined as respectively between first ruddiness (R1) between the 620.5nm to 645.0nm, crest wavelength approximately between second ruddiness (R2) between the 612.5nm to 620.5nm, crest wavelength approximately between first green glow (G1) between the 520nm to 550nm, crest wavelength approximately between second green glow (G2) between the 490nm to 520nm, crest wavelength approximately between first blue light (B1) between the 460nm to 490nm or crest wavelength approximately between second blue light (B2) between the 440nm to 460nm.

See also Fig. 2,first crystal grain 22 andsecond crystal grain 23 are arranged at supportingbody 21 respectively.Wherein, supportingbody 21 can be a substrate or a lead frame.In the present embodiment, the encapsulation form of light-emitting diode and the material of substrate are not limited.For example, when supportingbody 21 is substrate, can be transparency carrier, also can be opaque substrate.And the pattern of encapsulation can be as among Fig. 2 being surface encapsulation (SurfaceMounting Device, form SMD).First crystal grain 22 andsecond crystal grain 23 can go between (wiring) 25 by plural number and electrically connect with supportingbody 21, utilizeadhesive material 26 protectionfirst crystal grain 22 andsecond crystal grain 23 again.

Consult shown in Figure 3ly clearly, certainly,first crystal grain 22 andsecond crystal grain 23 also can electrically carry out signal with the external world and link up by lead (interconnection) 27 within on the substrate, and do not need lead-in wire.Wherein,first crystal grain 22 andsecond crystal grain 23 also can utilize the form of covering crystalline substance (flip chip) and be installed on supportingbody 21.

See also shown in Figure 4ly, when supporting body 21 ' was lead frame, then Feng Zhuan pattern then became the form of leaded package (leadframe package).In addition, among Fig. 5, the mode thatfirst crystal grain 22 andsecond crystal grain 23 also can pile up is provided with and cooperates substrate and lead frame to be used as supportingbody 21,21 ' again.

See also Fig. 2 and shown in Figure 6 again,first crystal grain 22 has a primary peak wavelength X₁, the primary peak wavelength X₁Greater than object wave peak wavelength X_tSecond crystal grain 23 has a secondary peak wavelength X₂, the secondary peak wavelength X₂Less than object wave peak wavelength X_tWherein,first crystal grain 22 andsecond crystal grain 23 belong to the light of same colour system, and for examplefirst crystal grain 22 andsecond crystal grain 23 light of greening colour system all for example is green, dark green, andfirst crystal grain 22 andsecond crystal grain 23 can be the crystal grain of institute's output on the same wafer.Certainly, butfirst crystal grain 22 andsecond crystal grain 23 also can be by different wafers be the same batch of crystal grain of being produced that in the present embodiment,first crystal grain 22 andsecond crystal grain 23 are example with the crystal grain of same wafer institute output.

When selecting crystal grain, need to measure earlier the crest wavelength of each crystal grain, be fit to be packaged together the plural crystal grain that the crest wavelength can match each other to pick out.Wherein, as long as the primary peak wavelength X offirst crystal grain 22₁Secondary peak wavelength X withsecond crystal grain 23₂Difference (Δ λ) less than 50nm, can match each other, be positioned in the same encapsulating structure.

In the present embodiment, to send object wave peak wavelength X_tFor the package structure forLED 2 of 530nm is an example.When the long difference offirst crystal grain 22 and object wave spike equalssecond crystal grain 23 and object wave peak wavelength X_tDifference, for example: the primary peak wavelength X₁Be about 535nm, the secondary peak wavelength X₂Be about 525nm, and the luminous efficiency of supposingfirst crystal grain 22 andsecond crystal grain 23 is when identical, provide identical electric current tofirst crystal grain 22 andsecond crystal grain 23, no matter be thatfirst crystal grain 22 andsecond crystal grain 23 are luminous simultaneously or take turns fast when luminous, human eye is experienced the luminous intensity that object wave spike long value 530nm is presented, and isfirst crystal grain 22 andsecond crystal grain 23 totalling (shown in the dotted line spectrum of wavelengths) in object wave spike long value 530nm place luminous intensity.That is to say that by the coupling of wavelength, afterfirst crystal grain 22 andsecond crystal grain 23 was packaged together,first crystal grain 22 andsecond crystal grain 23 is capable of being combined to go out object wave peak wavelength X_t, making human eye can't differentiate plural intergranule has the wavelength difference, can send target crest light wavelength lambda just like take two_tDie package the same together.

See also Fig. 2 and Fig. 7, in the present embodiment, to send object wave peak wavelength X_tFor the package structure forLED 2 of 530nm is an example.The difference of growing whenfirst crystal grain 22 and object wave spike is a half of the long difference ofsecond crystal grain 23 and object wave spike, for example: the primary peak wavelength X₁Be about 535nm, the secondary peak wavelength X₂Be about 520nm, suppose underfirst crystal grain 22 situation also identical, can promote the curtage value to two times offirst crystal grain 22, so that the luminous intensity offirst crystal grain 22 is two times ofsecond crystal grain 23 with the luminous efficiency of second crystal grain 23.As shown in Figure 7, luminous simultaneously or take turns fast when luminous whenfirst crystal grain 22 andsecond crystal grain 23, human eye is experienced object wave spike long value λ_tThe luminous intensity that the place presents is thatfirst crystal grain 22 andsecond crystal grain 23 are in object wave spike long value λ_tThe totalling (shown in the dotted line spectrum of wavelengths) of place's luminous intensity.

Under the preferable situation, the primary peak wavelength X₁With the secondary peak wavelength X₂Difference less than 30nm, the long luminous intensity of the object wave spike that is combined into is stronger, and can form a main crest (main peak).In addition, just the wavelength offirst crystal grain 22 andsecond crystal grain 23 adds the General Logistics Department at last, can't form single main crest, but because the luminance purity of light-emitting diode is higher, human eye still can't pick out the loss on the color saturation (Color Saturation).

Then, see also Fig. 8, with explanation package structure for LED second embodiment of the present invention.

Package structure for LED 2 ' more comprises one the3rd crystal grain 24, and the3rd crystal grain 24 has one the 3rd crest wavelength X₃, the3rd crystal grain 24 andfirst crystal grain 22 andsecond crystal grain 23 send the light of same colour system.For instance, whenfirst crystal grain 22 andsecond crystal grain 23 all send peach light, the3rd crystal grain 24 sends wine-colored light, all belongs to the light of red colour system.

When package structure for LED 2 ' had three crystal grain, the maximum crest wavelength of crystal grain and the difference of minimum crest wavelength should be less than 50nm.That is to say, when the 3rd crest wavelength X₃Greater than the primary peak wavelength X₁The time, the 3rd crest wavelength X₃With the secondary peak wavelength X₂Difference less than 50nm.And when the 3rd crest wavelength X₃Less than the secondary peak wavelength X₂The time, the 3rd crest wavelength X₃With the primary peak wavelength X₁Difference less than 50nm.

Under the preferable situation, in the plural crystal grain of package structure for LED 2 ', the difference of maximum crest wavelength and minimum crest wavelength should be less than 30nm.

Certainly, in the package structure for LED of the present invention, also do not limit the crystal grain quantity in the encapsulating structure, as long as be plural crystal grain.

In sum, a kind of package structure for LED of the present invention has plural crystal grain and primary peak wavelength and secondary peak wavelength and belongs to same colour system.Compared with prior art, package structure for LED of the present invention can be by selecting the plural crystal grain with suitable coupling wavelength, just capable of being combinedly goes out the long plural crystal grain of object wave spike, and plural crystal grain more than two is packaged together.Thus, the encapsulating structure of light-emitting diode can make human eye in object wave spike strong point, experiences just like two luminous intensities with object wave spike long hair optical diode.In addition, by the process of selecting coupling crystal grain, the encapsulation dealer scope that can relax the crest wavelength of non-defective unit crystal grain, and then can promote the crystal grain utilance of same wafer or same batch of wafer reducing production costs, and reduces the waste of former material.

The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.

Claims (11)

1, a kind of package structure for LED, long in order to send an object wave spike, it is characterized in that it comprises:

One supporting body;

One first crystal grain is arranged at this supporting body, and this first crystal grain luminous has a primary peak wavelength, and this primary peak wavelength is long greater than this object wave spike; And

One second crystal grain is arranged at this supporting body, and this second crystal grain luminous has a secondary peak wavelength, and this secondary peak wavelength is long less than this object wave spike, and this primary peak wavelength and this secondary peak wavelength belong to same colour system.

2, package structure for LED according to claim 1 is characterized in that wherein said supporting body is a substrate or a lead frame.

3, package structure for LED according to claim 1 is characterized in that wherein said first crystal grain and this second crystal grain while or not luminous simultaneously.

4, package structure for LED according to claim 1, the difference that it is characterized in that wherein said primary peak wavelength and this secondary peak wavelength is less than 50nm.

5, package structure for LED according to claim 1, the difference that it is characterized in that wherein said primary peak wavelength and this secondary peak wavelength is less than 30nm.

6, package structure for LED according to claim 1 is characterized in that the difference of wherein said target wavelength and this primary peak wavelength, is not equal to or equals the difference of this target wavelength and this secondary peak wavelength.

7, package structure for LED according to claim 1 is characterized in that wherein said first crystal grain is different with the luminous intensity of this second crystal grain.

8, package structure for LED according to claim 1 is characterized in that wherein said object wave spike is about between between the 615nm to 650nm, approximately between between the 515nm to 555nm or approximately between between the 455nm to 485nm.

9, package structure for LED according to claim 1 is characterized in that it more comprises:

One the 3rd crystal grain, it has one the 3rd crest wavelength, and this primary peak wavelength, this secondary peak wavelength and the 3rd crest wavelength belong to this colour system.

10, package structure for LED according to claim 9 is characterized in that wherein said the 3rd crest wavelength greater than this primary peak wavelength, and the difference of the 3rd crest wavelength and this secondary peak wavelength is less than 50nm.

11, package structure for LED according to claim 9 is characterized in that wherein said the 3rd crest wavelength less than this secondary peak wavelength, and the difference of this primary peak wavelength and the 3rd crest wavelength is less than 50nm.

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