CN100521268C - Package and method of manufacturing the same - Google Patents

Abstract

A package and a method of manufacturing the same. The manufacturing method of the package includes: first, a chip is provided on a substrate, and the chip is electrically connected to the substrate. Then, an adhesion adjusting layer is formed on the chip. The adhesion force adjusting layer has a first adhesion force (adhesive force) with the chip. Then, a first lens layer is formed on the adhesion adjustment layer. The adhesive force adjusting layer and the first lens layer have a second adhesive force. The adhesive force adjusting layer covers the chip, so that the surface state of the chip is changed, and the interaction of the cohesive force and the surface tension of the first lens layer and the second adhesive force is beneficial to the forming of the first lens layer.

Description

Translated fromChinese

封装件及其制造方法Package and manufacturing method thereof

技术领域technical field

本发明涉及一种封装件及其制造方法，且特别涉及一种具有透镜层的封装件及其制造方法。The present invention relates to a package and its manufacturing method, and in particular to a package with a lens layer and its manufacturing method.

背景技术Background technique

请参照图1A，其示出传统的封装件的示意图。封装件100包括反射杯101、芯片103及封装胶体105。芯片103置放于反射杯101内。封装胶体105灌入反射杯101内，以覆盖芯片103。Please refer to FIG. 1A , which shows a schematic diagram of a conventional package. Thepackage 100 includes areflective cup 101 , achip 103 and anencapsulant 105 . Thechip 103 is placed in thereflective cup 101 . The encapsulant 105 is poured into thereflection cup 101 to cover thechip 103 .

封装胶体105依据反射杯101的形状成形。封装胶体105灌入反射杯101后，反射杯101不会脱离封装胶体105以重复使用。因此，使得此种封装件100的制造成本提高。Theencapsulant 105 is shaped according to the shape of thereflective cup 101 . After the encapsulant 105 is poured into thereflective cup 101 , thereflective cup 101 will not separate from theencapsulant 105 for repeated use. Therefore, the manufacturing cost of thepackage 100 is increased.

请参照图1B，其绘示另一种传统的封装件的示意图。相较于图1A的封装件100，图1B的封装件150还包括凸状胶体155。请参照图1C，其示出模具的示意图。凸状胶体155(如图1B所示)的材料灌入模具160的至少一个凹穴161中，并固化成为凸状胶体155。然后，如图1B所示，凸状胶体155再利用加热的方式粘合于封装胶体105的表面157上，以形成封装件150。Please refer to FIG. 1B , which is a schematic diagram of another conventional package. Compared with thepackage 100 of FIG. 1A , thepackage 150 of FIG. 1B further includes aprotruding glue 155 . Please refer to FIG. 1C , which shows a schematic diagram of the mold. The material of the convex glue 155 (shown in FIG. 1B ) is poured into at least onecavity 161 of themold 160 and cured into theconvex glue 155 . Then, as shown in FIG. 1B , theprotruding adhesive 155 is bonded to thesurface 157 of theencapsulant 105 by heating to form thepackage 150 .

虽然凸状胶体155可用以改善封装件150的光学特性，然而，封装件150的制造方法的步骤较为繁琐，其步骤包括图1A的封装件100的步骤及制造凸状胶体155的步骤。此外，封装件150在制造时需要模具160(如图1C所示)做为形成凸状胶体155的模具。因此，更加提高封装件150的制造成本。Although the protrudingglue 155 can be used to improve the optical properties of thepackage 150 , the steps of the manufacturing method of thepackage 150 are cumbersome, and the steps include the steps of thepackage 100 in FIG. 1A and the steps of manufacturing the protrudingglue 155 . In addition, thepackage 150 requires a mold 160 (as shown in FIG. 1C ) as a mold for forming the convexglue 155 during manufacture. Therefore, the manufacturing cost of thepackage 150 is further increased.

发明内容Contents of the invention

本发明提供了一种封装件及其制造方法，其利用附着力调整层调整第一透镜层的形状，以使光线通过第一透镜层后控制形成不同的光场分布。The present invention provides a package and its manufacturing method, which uses the adhesion adjustment layer to adjust the shape of the first lens layer, so that light can be controlled to form different light field distributions after passing through the first lens layer.

根据本发明的第一方面，提出一种封装件的制造方法，此制造方法包括：首先，第一步骤，设置芯片于衬底上，使芯片与衬底电连接。接着，第二步骤，形成附着力调整层于芯片上。附着力调整层与芯片之间具有第一附着力。然后，第三步骤，形成由透镜构成的第一透镜层于附着力调整层上。附着力调整层与第一透镜层之间具有第二附着力，以调整第一透镜层的形状。由于附着力调整层覆盖于芯片改变了表面态，使得第一透镜层的材料的内聚力、表面张力与第二附着力的交互作用，有助于第一透镜层的成形。According to a first aspect of the present invention, a method for manufacturing a package is provided, and the method includes: first, a first step of disposing a chip on a substrate, and electrically connecting the chip to the substrate. Next, the second step is to form an adhesion adjustment layer on the chip. There is a first adhesion between the adhesion adjustment layer and the chip. Then, in the third step, a first lens layer composed of lenses is formed on the adhesion adjustment layer. There is a second adhesion force between the adhesion adjustment layer and the first lens layer, so as to adjust the shape of the first lens layer. Since the adhesion adjustment layer covers the chip and changes the surface state, the interaction between the cohesive force of the material of the first lens layer, the surface tension and the second adhesion force is conducive to the shaping of the first lens layer.

根据本发明的制造方法，其中在所述第三步骤之后，所述制造方法还包括：在所述第一透镜层上形成至少一个第二透镜层。According to the manufacturing method of the present invention, after the third step, the manufacturing method further includes: forming at least one second lens layer on the first lens layer.

根据本发明的制造方法，其中在所述第二步骤中，利用旋转涂抹、刷涂、喷涂、浸沾或点沾的方式在所述芯片上形成所述附着力调整层。According to the manufacturing method of the present invention, in the second step, the adhesion adjustment layer is formed on the chip by means of spin coating, brush coating, spray coating, dipping or spot dipping.

根据本发明的制造方法，其中在所述第三步骤中，利用点沾的方式在所述附着力调整层上形成所述第一透镜层。According to the manufacturing method of the present invention, in the third step, the first lens layer is formed on the adhesion adjustment layer by spotting.

根据本发明的制造方法，其中在所述第二步骤之后且在所述第三步骤之前，所述制造方法还包括：硬化所述附着力调整层。According to the manufacturing method of the present invention, after the second step and before the third step, the manufacturing method further includes: hardening the adhesion adjustment layer.

根据本发明的制造方法，其中所述第一步骤还包含利用导线电连接所述芯片与所述衬底。According to the manufacturing method of the present invention, the first step further includes electrically connecting the chip and the substrate with wires.

根据本发明的制造方法，其中所述第二步骤还包含覆盖部分的所述导线，使另一部分的所述导线露出在所述附着力调整层外。According to the manufacturing method of the present invention, the second step further includes covering a part of the wires so that another part of the wires is exposed outside the adhesion adjustment layer.

根据本发明的制造方法，其中所述第三步骤还包含覆盖露出另一部分的所述导线。According to the manufacturing method of the present invention, the third step further includes covering the exposed wire.

根据本发明的制造方法，其中所述第一透镜层实质上为半球体。According to the manufacturing method of the present invention, wherein the first lens layer is substantially a hemisphere.

根据本发明的制造方法，其中所述芯片为发光二极管芯片。According to the manufacturing method of the present invention, wherein the chip is a light emitting diode chip.

根据本发明的制造方法，其中所述衬底为印刷电路板。According to the manufacturing method of the present invention, wherein the substrate is a printed circuit board.

根据本发明的制造方法，其中所述第一透镜层与所述附着力调整层实质上为相同或不同的材料。According to the manufacturing method of the present invention, wherein the first lens layer and the adhesion adjustment layer are substantially the same or different materials.

根据本发明的第二方面，提出一种封装件。封装件包括衬底、芯片、附着力调整层及由透镜构成的第一透镜层。芯片设置于衬底上，且芯片与衬底电连接。附着力调整层设置于芯片上并覆盖部分衬底。附着力调整层与芯片之间具有第一附着力。第一透镜层设置于附着力调整层上。附着力调整层与第一透镜层之间具有第二附着力，以调整第一透镜层的形状。芯片的表面态的改变，有助于第一透镜层的成形。According to a second aspect of the invention, a package is proposed. The package includes a substrate, a chip, an adhesion adjustment layer and a first lens layer composed of lenses. The chip is arranged on the substrate, and the chip is electrically connected with the substrate. The adhesion adjustment layer is arranged on the chip and covers part of the substrate. There is a first adhesion between the adhesion adjustment layer and the chip. The first lens layer is disposed on the adhesion adjustment layer. There is a second adhesion force between the adhesion adjustment layer and the first lens layer, so as to adjust the shape of the first lens layer. The change of the surface state of the chip contributes to the shaping of the first lens layer.

根据本发明的封装件，还包括：至少一个第二透镜层，所述第二透镜层设置在所述第一透镜层上。The package according to the present invention further comprises: at least one second lens layer disposed on the first lens layer.

根据本发明的封装件，其中所述芯片以导线电连接所述衬底，部分所述导线露出于所述附着力调整层外，所述第一透镜层还覆盖露出的所述导线。According to the package of the present invention, wherein the chip is electrically connected to the substrate by wires, part of the wires are exposed outside the adhesion adjustment layer, and the first lens layer also covers the exposed wires.

根据本发明的封装件，其中所述衬底为印刷电路板。A package according to the present invention, wherein said substrate is a printed circuit board.

根据本发明的封装件，其中所述芯片为发光二极管芯片。According to the package of the present invention, wherein the chip is a light emitting diode chip.

根据本发明的封装件，其中所述第一透镜层实质上为半球体。According to the package of the present invention, wherein the first lens layer is substantially hemispherical.

根据本发明的封装件，其中所述附着力调整层的材料为聚四氟乙烯、环氧树脂或硅胶。According to the package of the present invention, the material of the adhesion adjustment layer is polytetrafluoroethylene, epoxy resin or silica gel.

根据本发明的封装件，其中所述第一透镜层的材料为环氧树脂或硅胶。According to the package of the present invention, the material of the first lens layer is epoxy resin or silicone.

为让本发明的上述内容能更明显易懂，下文特举较佳实施例，并配合附图，作详细说明如下：In order to make the above-mentioned content of the present invention more obvious and understandable, the preferred embodiments are specifically cited below, together with the accompanying drawings, and are described in detail as follows:

附图说明Description of drawings

图1A示出传统的封装件的示意图。FIG. 1A shows a schematic diagram of a conventional package.

图1B示出另一种传统的封装件的示意图。FIG. 1B shows a schematic diagram of another conventional package.

图1C示出模具的示意图。Figure 1C shows a schematic diagram of the mold.

图2示出根据本发明第一实施例的封装件的制造方法的流程图。FIG. 2 shows a flowchart of a manufacturing method of a package according to a first embodiment of the present invention.

图3A～图3C示出图2的制造方法的流程示意图。3A to 3C show schematic flow charts of the manufacturing method in FIG. 2 .

图4示出图3C的芯片射出光线的示意图。FIG. 4 shows a schematic diagram of light emitted from the chip of FIG. 3C .

图5示出根据本发明第二实施例的封装件的示意图。Fig. 5 shows a schematic view of a package according to a second embodiment of the invention.

其中，附图标记说明如下：Wherein, the reference signs are explained as follows:

100、150、200、300：封装件100, 150, 200, 300: packages

101：反射杯　　　　　　　　103：芯片101: Reflector Cup 103: Chip

105：封装胶体              155：凸状胶体105: Packaging colloid 155: Convex colloid

157：表面                  160：模具157: Surface 160: Mold

161：凹穴                  210：衬底161: Dimple 210: Substrate

215：导线                  220：芯片215: Wire 220: Chip

230：附着力调整层          240：第一透镜层230: Adhesion adjustment layer 240: First lens layer

340：第二透镜层            400：光线340: second lens layer 400: light

410：光场分布410: Light field distribution

具体实施方式Detailed ways

第一实施例first embodiment

请同时参照图2及图3A～图3C，图2示出根据本发明第一实施例的封装件的制造方法的流程图，图3A～图3C示出图2的制造方法的流程示意图。Please refer to FIG. 2 and FIGS. 3A-3C at the same time. FIG. 2 shows a flow chart of the manufacturing method of the package according to the first embodiment of the present invention, and FIGS. 3A-3C show a schematic flow chart of the manufacturing method of FIG. 2 .

首先，如图2及图3A所示，在步骤301中，设置芯片220在衬底210上。芯片220例如是利用至少一个导线215与衬底210电连接。First, as shown in FIG. 2 and FIG. 3A , instep 301 , thechip 220 is disposed on thesubstrate 210 . Thechip 220 is electrically connected to thesubstrate 210 by using at least onewire 215 , for example.

接着，如图2及图3B所示，在步骤303中，形成附着力调整层230在芯片220上。附着力调整层230与芯片220之间具有第一附着力。Next, as shown in FIG. 2 and FIG. 3B , instep 303 , anadhesion adjustment layer 230 is formed on thechip 220 . There is a first adhesion between theadhesion adjustment layer 230 and thechip 220 .

然后，如图3C所示，形成第一透镜层240在附着力调整层230上，以形成封装件200。其中，附着力调整层230与第一透镜层240之间具有第二附着力。由于附着力调整层230覆盖在芯片220上改变了表面态，使得第一透镜层240的材料的内聚力、表面张力与第二附着力的交互作用，有助于第一透镜层240的成形。Then, as shown in FIG. 3C , afirst lens layer 240 is formed on theadhesion adjustment layer 230 to form thepackage 200 . Wherein, there is a second adhesion between theadhesion adjustment layer 230 and thefirst lens layer 240 . Since the surface state of thechip 220 is changed by theadhesion adjustment layer 230 , the interaction between the cohesion, surface tension and the second adhesion of the material of thefirst lens layer 240 is helpful to the shaping of thefirst lens layer 240 .

附着力为两种物质之间的分子吸引力。也就是说，当附着力越小时，两种物质之间的分子吸引力越小，当附着力越大时，两种物质之间的分子吸引力越大。在本实施例中，由于附着力调整层230覆盖在芯片220上改变了表面态，使得第一透镜层240的材料的内聚力、表面张力与附着力调整层间的第二附着力交互作用，相较于第一附着力而言，有助于第一透镜层240的成形。Adhesion is the molecular attraction between two substances. That is to say, when the adhesion is smaller, the molecular attraction between the two substances is smaller, and when the adhesion is larger, the molecular attraction between the two substances is greater. In this embodiment, since theadhesion adjustment layer 230 is covered on thechip 220 and changes the surface state, the cohesion and surface tension of the material of thefirst lens layer 240 interact with the second adhesion between the adhesion adjustment layers. Compared with the first adhesive force, it is helpful to the shaping of thefirst lens layer 240 .

再者，在本实施例中，芯片220例如是发光二极管(Light Emitting Diode，LED)，且衬底210例如是印刷电路板(Printed Circuit Board，PCB)。请参照图4，其示出图3C的芯片射出光线的示意图。当芯片220发光时，光线400分别通过附着力调整层230及第一透镜层240。由于附着力调整层230可调整第一透镜层240的形状，因此当光线400通过第一透镜层240后可控制形成不同的光场分布410。较佳地，在本实施例中，第一透镜层240可透过适当地调整，而成为半球体。Furthermore, in this embodiment, thechip 220 is, for example, a light emitting diode (Light Emitting Diode, LED), and thesubstrate 210 is, for example, a printed circuit board (Printed Circuit Board, PCB). Please refer to FIG. 4 , which shows a schematic view of light emitted from the chip in FIG. 3C . When thechip 220 emits light, the light 400 passes through theadhesion adjustment layer 230 and thefirst lens layer 240 respectively. Since theadhesion adjustment layer 230 can adjust the shape of thefirst lens layer 240 , when the light 400 passes through thefirst lens layer 240 , it can be controlled to form differentlight field distributions 410 . Preferably, in this embodiment, thefirst lens layer 240 can become a hemisphere through proper adjustment.

如图3B所示，当附着力调整层230覆盖芯片220时，附着力调整层230较为平坦。如此，附着力调整层230仅覆盖部分的导线215，另一部分的导线215则露出于附着力调整层230外。如图3C所示，当第一透镜层240覆盖于附着力调整层230时，第一透镜层240较为凸出。如此，虽然附着力调整层230仅可覆盖部分的导线215，另一部分的导线215则露出于附着力调整层230外，但第一透镜层240可覆盖露出的导线。As shown in FIG. 3B , when theadhesion adjustment layer 230 covers thechip 220 , theadhesion adjustment layer 230 is relatively flat. In this way, theadhesion adjustment layer 230 only covers a part of thewires 215 , and another part of thewires 215 is exposed outside theadhesion adjustment layer 230 . As shown in FIG. 3C , when thefirst lens layer 240 covers theadhesion adjustment layer 230 , thefirst lens layer 240 is more protruding. In this way, although theadhesion adjustment layer 230 can only cover part of thewires 215 and another part of thewires 215 is exposed outside theadhesion adjustment layer 230 , thefirst lens layer 240 can cover the exposed wires.

此外，如图3C所示，本实施例的附着力调整层230除了覆盖芯片220之外，附着力调整层230还覆盖部分衬底210。然而，附着力调整层230还可覆盖全部衬底210。此部分视工艺需求。附着力调整层230可以旋转涂抹、刷涂、喷涂、浸沾或点沾的方式形成于芯片220及衬底210上。在本实施例中，第一透镜层240以点沾的方式形成于附着力调整层230上。In addition, as shown in FIG. 3C , in addition to covering thechip 220 , theadhesion adjusting layer 230 of this embodiment also covers part of thesubstrate 210 . However, theadhesion adjustment layer 230 may also cover theentire substrate 210 . This part depends on the process requirements. Theadhesion adjustment layer 230 can be formed on thechip 220 and thesubstrate 210 by spin coating, brush coating, spray coating, dipping or spot dipping. In this embodiment, thefirst lens layer 240 is formed on theadhesion adjustment layer 230 by spotting.

附着力调整层230的材料例如是聚四氟乙烯(PTFE)、环氧树脂(epoxy)或硅胶(silicon)，第一透镜层240的材料则例如是环氧树脂或硅胶。第一透镜层240的材料及附着力调整层230的材料可为相同的材料，或可为相异的材料。在本实施例中，附着力调整层230与第一透镜层240选用相同的材料，例如是环氧树脂。也就是说，第一附着力由芯片220或印刷电路板(衬底210)与环氧树脂(附着力调整层230)所形成，第二附着力由环氧树脂(附着力调整层230)与环氧树脂(第一透镜层240)所形成。依据实验结果，由于衬底210与芯片220的表面态的改变，使得第一透镜层240的材料的内聚力、表面张力与附着力调整层间的第二附着力交互作用后，有助于第一透镜层240的成形。The material of theadhesion adjusting layer 230 is, for example, polytetrafluoroethylene (PTFE), epoxy or silicon, and the material of thefirst lens layer 240 is, for example, epoxy or silicon. The material of thefirst lens layer 240 and the material of theadhesion adjustment layer 230 may be the same material, or may be different materials. In this embodiment, theadhesion adjusting layer 230 and thefirst lens layer 240 are made of the same material, such as epoxy resin. That is to say, the first adhesion is formed by thechip 220 or the printed circuit board (substrate 210) and epoxy resin (adhesion adjustment layer 230), and the second adhesion is formed by epoxy resin (adhesion adjustment layer 230) and epoxy resin (first lens layer 240). According to the experimental results, due to the change of the surface state of thesubstrate 210 and thechip 220, after the cohesion, surface tension of the material of thefirst lens layer 240 interact with the second adhesion between the adhesion adjustment layers, it is helpful for the first Forming of thelens layer 240 .

在本实施例中，如图2及图3C所示，在步骤303及步骤305之间，制造方法较佳地还包括硬化附着力调整层230的步骤。此步骤为了使附着力调整层230硬化至不流动状态，以使第一透镜层240稳固地形成于附着力调整层230上。其中，硬化的方式例如是利用加热或以紫外线(UV Light)照射，以使附着力调整层230硬化。In this embodiment, as shown in FIG. 2 and FIG. 3C , betweenstep 303 and step 305 , the manufacturing method preferably further includes a step of hardening theadhesion adjustment layer 230 . This step is to harden theadhesion adjustment layer 230 to a stagnant state, so that thefirst lens layer 240 is firmly formed on theadhesion adjustment layer 230 . Wherein, the way of hardening is, for example, heating or irradiating with ultraviolet light (UV Light) to harden theadhesion adjusting layer 230 .

第二实施例second embodiment

请参照图5，其示出根据本发明第二实施例的封装件的示意图。本实施例的封装件300与第一实施例的封装件200不同之处在于多个第二透镜层340形成于第一透镜层240上，更进一步调整第二透镜层340的形状。Please refer to FIG. 5 , which shows a schematic diagram of a package according to a second embodiment of the present invention. Thepackage 300 of this embodiment is different from thepackage 200 of the first embodiment in that a plurality of second lens layers 340 are formed on thefirst lens layer 240 , and the shape of the second lens layers 340 is further adjusted.

本发明上述实施例所公开的封装件及其制造方法，其利用附着力调整层调整第一透镜层的形状，以使光线通过第一透镜层后实质上可控制形成不同的光场分布。再者，附着力调整层及第一透镜层完全地覆盖导线，以保护导线。此外，本实施例的封装件及其制造方法可降低制造成本及缩减封装件的体积。In the package and its manufacturing method disclosed in the above-mentioned embodiments of the present invention, the adhesion adjustment layer is used to adjust the shape of the first lens layer, so that the light can substantially control and form different light field distributions after passing through the first lens layer. Furthermore, the adhesion adjustment layer and the first lens layer completely cover the wires to protect the wires. In addition, the package and its manufacturing method of this embodiment can reduce the manufacturing cost and reduce the volume of the package.

综上所述，虽然本发明已以较佳实施例公开如上，然其并非用以限定本发明。本领域技术人员，在不脱离本发明的精神和范围内，当可作各种的变化与修改。因此，本发明的保护范围当视后附的权利要求为准。In summary, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

Claims (20)

1. the manufacture method of a packaging part comprises:

First step is provided with chip on substrate, and described chip is electrically connected with described substrate;

Second step forms adhesive force and adjusts layer on described chip, has first adhesive force between described adhesive force adjustment layer and the described chip; And

Third step forms first lens jacket that is made of lens and adjusts on the layer at described adhesive force, has second adhesive force between described adhesive force adjustment layer and described first lens jacket, to adjust the shape of described first lens jacket.

2. manufacture method as claimed in claim 1, wherein after described third step, described manufacture method also comprises:

On described first lens jacket, form at least one second lens jacket.

3. manufacture method as claimed in claim 1, the mode of wherein in described second step, utilize that rotation is smeared, brushed, spraying, dipping or point being stained with form described adhesive force and adjust layer on described chip.

4. manufacture method as claimed in claim 1, wherein in described third step, the mode of utilizing point to be stained with is adjusted at described adhesive force and is formed described first lens jacket on the layer.

5. manufacture method as claimed in claim 1, wherein after described second step and before described third step, described manufacture method also comprises:

The described adhesive force that hardens is adjusted layer.

6. manufacture method as claimed in claim 1, wherein said first step also comprise utilizes lead to be electrically connected described chip and described substrate.

7. manufacture method as claimed in claim 6, wherein said second step also comprises the described lead of cover part, and the described lead of another part is exposed outside described adhesive force is adjusted layer.

8. manufacture method as claimed in claim 7, wherein said third step also comprise the described lead that another part is exposed in covering.

9. manufacture method as claimed in claim 1, wherein said first lens jacket is essentially hemisphere.

10. manufacture method as claimed in claim 1, wherein said chip are light-emitting diode chip for backlight unit.

11. manufacture method as claimed in claim 1, wherein said substrate are printed circuit board (PCB).

12. manufacture method as claimed in claim 1, it is identical or different material that wherein said first lens jacket and described adhesive force are adjusted layer.

13. a packaging part comprises:

Substrate;

Chip is arranged on the described substrate, and described chip is electrically connected with described substrate;

Adhesive force is adjusted layer, is arranged on the described chip and the described substrate in cover part, has first adhesive force between described adhesive force adjustment layer and the described chip; And

By first lens jacket that lens constitute, be arranged on described adhesive force and adjust on the layer, have second adhesive force between described adhesive force adjustment layer and described first lens jacket, to adjust the shape of described first lens jacket.

14. packaging part as claimed in claim 13 also comprises:

At least one second lens jacket, described second lens are stacked to be located on described first lens jacket.

15. packaging part as claimed in claim 13, wherein said chip is electrically connected described substrate with lead, and the described lead of part is exposed to described adhesive force and adjusts outside the layer, and described first lens jacket also covers the described lead that exposes.

16. packaging part as claimed in claim 13, wherein said substrate are printed circuit board (PCB).

17. packaging part as claimed in claim 13, wherein said chip are light-emitting diode chip for backlight unit.

18. packaging part as claimed in claim 13, wherein said first lens jacket is essentially hemisphere.

19. packaging part as claimed in claim 13, the material of wherein said adhesive force adjustment layer is polytetrafluoroethylene, epoxy resin or silica gel.

20. packaging part as claimed in claim 13, the material of wherein said first lens jacket are epoxy resin or silica gel.

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