CN100462815C - Backlight module - Google Patents

Abstract

The invention provides a backlight module, which comprises a light guide plate and a light source, wherein the light guide plate comprises a top surface, a bottom surface inclined relative to the top surface, a light incident surface arranged between the top surface and the bottom surface, a widening surface relative to the light incident surface and an inner surface with a diffusion pattern arranged on the bottom surface. Wherein, the area of the widening surface is larger than that of the light incident surface. The backlight module also comprises a circuit substrate which is arranged below the light source; the height of the widening surface is equal to the sum of the height of the light incident surface and the thickness of the circuit substrate. By adopting the backlight module, the light can be emitted from one side of the widened surface during the light guide plate emission process, so that the process yield of the light guide plate is improved.

Description

Module backlight

Technical field

The present invention is relevant for a kind of module backlight, refers to especially a kind ofly have from the backlight module of incidence surface to the cumulative light guide plate of another side thickness.

Background technology

Along with science and technology is maked rapid progress, various intelligent information products have been full of in modern's life, and flat-panel screens modules such as liquid crystal indicator have been played the part of considerable role in information products.Because liquid crystal indicator has that external form is frivolous, power consumption is few and characteristic such as radiationless pollution, therefore (personal digitalassistant is PDA) and on the portable type information products such as mobile phone to be widely used in mobile computer (notebook), personal digital assistant.

General liquid crystal indicator all comprises a module backlight, so that the display panels backlight to be provided.Please refer to shown in Figure 1, Fig. 1 be the tradition one module 10 backlight diagrammatic cross-section.Traditional backlight module 10 comprises alight source 12, alight guide plate 14, areflector plate 22 to be located atlight guide plate 14 belows, ashell 16,multi-disc blooming piece 18 and a printed circuit board (PCB) (printed circuit board PCB) 20 is located atlight source 12 belows.Wherein, printed circuit board (PCB) 20 is used for sending electric current or controlling signal to light source 12.Lightsource exiting surface 12a is close to setting in the face of theincidence surface 14a oflight guide plate 14, and the rough height that is equal to theincidence surface 14a oflight guide plate 14 of the height of lightsource exiting surface 12a, make and directly to inject in thelight guide plate 14, and avoid light leak viaincidence surface 14a bylight source 12 emitted light.Light guide plate 14 is that a thickness is dull and stereotyped uniformly, and after light was injectedlight guide plate 14, light can spread and penetrate via exitingsurface 14b, and then entered in the display panels (not shown) throughblooming piece 18.

As shown in Figure 1, because printed circuit board (PCB) 20 has certain thickness, and must be arranged atlight source 12 belows, cause the thickness oflight source 12 parts can be thicker than whole smoothlight guide plate 14, thereforeshell 16 bottoms that are used for fixing module 10 all components backlight usually must be according to the thickness oflight source 12 1 sides, produce and have darker spatial accommodation andplace light source 12 and printed circuit board (PCB) 20, the part that is used for placinglight guide plate 14 then has more shallow spatial accommodation.So it isshell 16 has a return portion 24 usually, comparatively complicated on making.From the above, a side that is used forccontaining light source 12 in the traditional backlight module 10 can be thicker than the opposite side of ccontaininglight guide plate 14, for example both thickness differences may for about 0.2 millimeter (millimetre) to 0.3 millimeter, for stressing light portable type information products, this kind thickness difference dissident is enough to influence the design of product structure.Therefore, the structural design of traditional backlight module 10 still must constantly improve, to meet the demand of its application product.

Moreover, because traditional light guide plate more than 14 is made with ejection forming technique, andlight guide plate 14 thickness of liquid crystal indicator about 0.8 millimeter (millimetre) in the existing portable type product, its jetting process has reached the limit of existing technology, and the ejaculation yield can reduce along with the thickness oflight guide plate 14 and reduce, therefore how to improve the thickness requirement oflight guide plate 14, produce the high light guide plate ofyield 14 to cooperate existing emission technology, still the problem that need solve for industry.

Summary of the invention

The object of the present invention is to provide and a kind ofly have from the module backlight of incidence surface to the cumulative light guide plate of another side thickness.

The invention provides a kind of module backlight, it comprises that a light guide plate and a light source be located at a side of light guide plate, make the light that light source produced to enter in the light guide plate, light guide plate comprises an end face, one bottom surface is obliquely installed and is not parallel to end face with respect to end face, one incidence surface is located between end face and the bottom surface, one wider faces (widened edge plane) greater than the incidence surface area, wherein, wider faces is located between end face and the bottom surface with respect to incidence surface, and incidence surface more regards to light source, the light that light source is produced can enter in the light guide plate, this module backlight also comprises a circuit substrate, and it is located at described light source below; Wherein, the height of this wider faces equal the height of this incidence surface and this circuit substrate thickness and.Described module backlight can comprise further that also the inner face one of the bottom surface that is arranged at light guide plate is diffusion patterned.

The present invention also provides a kind of module backlight, it comprises a light source and a light guide plate, and described light guide plate has one first and one second, and wherein this first face regards to this light source, this second then with respect to this first, and this height of second is greater than this height of first; This module backlight also comprises a circuit substrate, and it is located at this light source below; Wherein, this height of second equal this height of first and this circuit substrate thickness and.

Because light guide plate of the present invention has uneven thickness, makes wider faces greater than the incidence surface area, therefore when the light guide plate jetting process, can penetrate, to promote the process rate of light guide plate by wider faces one side.

Description of drawings

Fig. 1 is the diagrammatic cross-section of traditional backlight module.

Fig. 2 a, Fig. 2 b are the diagrammatic cross-section of first embodiment of the present invention's module backlight.

Fig. 3 is the diagrammatic cross-section of second embodiment of the present invention's module backlight.

10module 12 light sources backlight

12a exiting surface 14 light guide plate

14a incidence surface 14b exiting surface

16 shells, 18 blooming pieces

20 printed circuit board (PCB)s, 22 reflector plates

24 return portion, 50 modules backlight

52 light sources, 54 light guide plate

56 shells, 58 blooming pieces

60 circuit substrates, 62 reflector plates

64 light source exiting surfaces, 66 incidence surfaces

68 wider faces, 70 end faces

72 bottom surfaces, 74 diffusion patterned structures

76 fixedlybottom surface 78 is diffusion patterned

Embodiment

Please refer to shown in Fig. 2 a, Fig. 2 a is the diagrammatic cross-section of first embodiment of the present invention's module backlight.The present invention's module 50 backlight can be applicable to a liquid crystal indicator or other needs in the device of backlight.Module 50 backlight comprises that alight guide plate 54, alight source 52 be located atincidence surface 66 sides, oflight guide plate 54 and be used for holdinglight source 52 and be located atlight source 52 belows withshell 56, acircuit substrate 60 oflight guide plate 54, and pluralpieces blooming piece 58 is located atlight guide plate 54 tops.Wherein,light source 52 comprises at least one light emitting diode or other suitable luminescence component, andcircuit substrate 60 is preferably a printed circuit board (PCB).Becausecircuit substrate 60 has certain thickness, can cause module 50 thickness of two sides inequalities backlight, therefore the invention provideslight guide plate 54 with wedge structure, details are as follows for its structure.

Light guide plate 54 comprises that anend face 70,bottom surface 72, anincidence surface 66 with respect toend face 70 are used for receiving light thatlight source 52 produced and betweenend face 70 andbottom surface 72, and awider faces 68 is betweenend face 70 andbottom surface 72 and with respect to incidence surface 66.By Fig. 2 a as can be known,bottom surface 72 is not parallel toend face 70, and the thickness oflight guide plate 54 is thickeied towider faces 68 directions byincidence surface 66, make the area ofwider faces 68 greater than the area ofincidence surface 66, and the vertical height H ofwider faces 68 is also greater than the vertical height h ofincidence surface 66, and for example height H is greater than about 0.1 millimeter to 2 millimeters of height h.Therefore,light guide plate 54 roughly forms the shape of clapboard, and at the thickness of thewider faces 68 sides thickness greater thanincidence surface 66 sides.In addition, according to preferred embodiment of the present invention,light guide plate 54 comprises that in addition one diffusion patterned 78 is arranged at or is formed at the inner face ofbottom surface 72, is used for changing the light course in the light guide plate 54.After exitingsurface 64 ejaculations of light bylight source 52, can injectlight guide plate 54 by theincidence surface 66 oflight guide plate 54, change course and whole thelight guide plate 54 that distribute via diffusion patterned 78, penetrate byend face 70 again, provide light to the display panels (not shown) through theblooming piece 58 ofend face 70 tops.Please refer to shown in Fig. 2 b, the diffusion patterned structure 74 of another kind of the present invention has been shown in Fig. 2 b, wherein this diffusion patterned structure 74 for example can be a diaphragm, utilizes the bottom surface of pasting or otherwise being arranged atlight guide plate 54.

In the present embodiment, module 50 backlight comprises that in addition areflector plate 62 is located at 72 belows, bottom surface oflight guide plate 54, and therefore the light that penetrates frombottom surface 72 can be reflected thesheet 62 reflected backlight guide plate 54, to improve light utilization.By Fig. 2 a, Fig. 2 b as can be known, becauselight guide plate 54 is thicker away from the thickness oflight source 52 1 sides, supplied the thickness thatlight source 52 sides increase because ofcircuit substrate 56, therefore thereflector plate 62 ofcircuit substrate 60 andwider faces 68 belows can just be arranged on the fixedlybottom surface 76 ofshell 56, makes that fixedlybottom surface 76 can be parallel toend face 70.

The design of module 50 backlight according to the present invention, because wider faces 68 areas oflight guide plate 54 are bigger, therefore when makinglight guide plate 54 with injection molding method, can penetrate bywider faces 68 1 sides, penetrate yield to improve, avoid causing light guide plate to make the problem of difficulty because light guide plate crosses thin in the prior art.

Please refer to Fig. 3, Fig. 3 is the diagrammatic cross-section of second embodiment of the present invention's module backlight.Be simplified illustration, each assembly of Fig. 3 is continued to use the element numbers of Fig. 2.In the present embodiment,shell 56 employings own have the reflection ray materials with function makes, and for example is white bright dough model material material etc., to save the overall space of module 50 backlight.Therefore, the rough summation that equals the height andcircuit substrate 60 thickness ofincidence surface 66 of the height ofwider faces 68, and on all rough fixedlybottom surface 76 that is arranged atshell 56 incircuit substrate 60 and the base of wider faces 68.It should be noted that the setting of having omitted a reflector plate, so the height H ofwider faces 68 can be bigger than first embodiment, so more can improve the ejaculation yield oflight guide plate 54 owing to present embodiment.Moreover in the present embodiment, it is diffusion patterned 78 that the inner face of thebottom surface 72 oflight guide plate 54 is formed with, and is used for improving the light course, its can etching or mode such as printing form.

Moreover, no matter be the first embodiment of the present invention or second embodiment, all can apply in the existing traditional backlight module, as long as adopt the light source of thinner thickness, and cooperate wedge shape light guide plate of the present invention, make near the light guide plate of light source side thinlyyer, then remain unchanged, the thickness of whole module backlight is reduced away from the light guide plate of light source side.

Compared to prior art, feasible thinner because the present invention uses the wedge shape light guide plate in module backlight near the light guide plate of light source side, and do not have return portion of the prior art, therefore can effectively reduce the integral thickness of module backlight.In addition, because light guide plate has the bigger wider faces design of area away from light source side, therefore can utilize the bigger wider faces of area to carry out injection molding manufacture procedure, improve the process rate of light guide plate, can solve the processing procedure bottleneck of existing thin light guide panel to make light guide plate.

The above only is preferred embodiment of the present invention, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to covering scope of the present invention.

Claims (22)

Translated fromChinese

1.一种背光模组，该背光模组包括：1. A backlight module, the backlight module comprising:一导光板，其具有一顶面、一底面、一入光面及一加宽面，该底面相对该顶面倾斜，且该底面不平行于该顶面，该入光面位于该顶面与该底面之间，该加宽面相对于该入光面而位于该顶面与该底面之间，且该加宽面的面积大于该入光面的面积；以及A light guide plate, which has a top surface, a bottom surface, a light incident surface and a widened surface, the bottom surface is inclined relative to the top surface, and the bottom surface is not parallel to the top surface, the light incident surface is located between the top surface and Between the bottom surfaces, the widened surface is located between the top surface and the bottom surface relative to the light incident surface, and the area of the widened surface is larger than the area of the light incident surface; and一光源，其设于面向该入光面处，使该光源所产生的光线由该入光面进入该导光板中；a light source, which is arranged at the place facing the light incident surface, so that the light generated by the light source enters the light guide plate from the light incident surface;一电路基板，其设于所述光源下方；a circuit substrate, which is arranged under the light source;其中，该加宽面的高度等于该入光面的高度与该电路基板的厚度和。Wherein, the height of the widened surface is equal to the sum of the height of the light incident surface and the thickness of the circuit substrate.2.如权利要求1所述的背光模组，其特征在于，该导光板由该入光面沿着该加宽面的方向加宽。2. The backlight module according to claim 1, wherein the light guide plate is widened from the light incident surface along the direction of the widened surface.3.如权利要求1所述的背光模组，其特征在于，该加宽面的高度大于该入光面的高度。3. The backlight module according to claim 1, wherein the height of the widened surface is greater than the height of the light incident surface.4.如权利要求3所述的背光模组，其特征在于，该加宽面的高度较该入光面的高度厚约0.1毫米至2毫米。4. The backlight module as claimed in claim 3, wherein the height of the widened surface is about 0.1 mm to 2 mm thicker than that of the light incident surface.5.如权利要求1所述的背光模组，其特征在于，该电路基板为一印刷电路板。5. The backlight module as claimed in claim 1, wherein the circuit substrate is a printed circuit board.6.如权利要求1所述的背光模组，其特征在于，所述背光模组还包括一外壳，该外壳具有一平行于所述顶面的固定底面。6. The backlight module according to claim 1, wherein the backlight module further comprises a housing having a fixed bottom surface parallel to the top surface.7.如权利要求1所述的背光模组，其特征在于，所述背光模组还包括一反射片，其设于该底面下方。7. The backlight module as claimed in claim 1, further comprising a reflective sheet disposed under the bottom surface.8.如权利要求1所述的背光模组，其特征在于，该光源包括一发光二极管。8. The backlight module as claimed in claim 1, wherein the light source comprises a light emitting diode.9.如权利要求1所述的背光模组，其特征在于，该背光模组还包括一光学膜片，其设于该顶面上方。9. The backlight module as claimed in claim 1, further comprising an optical film disposed above the top surface.10.如权利要求1所述的背光模组，其特征在于，该导光板还包括一扩散图案结构，其设置于该底面。10. The backlight module according to claim 1, wherein the light guide plate further comprises a diffusion pattern structure disposed on the bottom surface.11.如权利要求1所述的背光模组，其特征在于，该导光板的底面的内面形成有一扩散图案。11. The backlight module as claimed in claim 1, wherein a diffusion pattern is formed on the inner surface of the bottom surface of the light guide plate.12.一种背光模组，包括：12. A backlight module, comprising:一光源；以及a light source; and一导光板，具有一第一面以及一第二面，其中该第一面面对于该光源，该第二面则相对于该第一面，且该第二面的高度大于该第一面的高度；A light guide plate has a first surface and a second surface, wherein the first surface faces the light source, the second surface is opposite to the first surface, and the height of the second surface is greater than that of the first surface high;一电路基板，其设于该光源下方；a circuit substrate, which is arranged under the light source;其中，该第二面的高度等于该第一面的高度与该电路基板的厚度和。Wherein, the height of the second surface is equal to the sum of the height of the first surface and the thickness of the circuit substrate.13.如权利要求12所述的背光模组，其特征在于，该导光板由该第一面沿着该第二面的方向加宽。13. The backlight module according to claim 12, wherein the light guide plate is widened from the first surface along the direction of the second surface.14.如权利要求12所述的背光模组，其特征在于，该第二面的高度较该第一面的高度厚约0.1毫米至2毫米。14. The backlight module as claimed in claim 12, wherein the height of the second surface is about 0.1 mm to 2 mm thicker than that of the first surface.15.如权利要求12所述的背光模组，其特征在于，该电路基板为一印刷电路板。15. The backlight module as claimed in claim 12, wherein the circuit substrate is a printed circuit board.16.如权利要求12所述的背光模组，其特征在于，该导光板还具有一顶面及一底面，该顶面设于该第一面与该第二面之间，该底面相对该顶面而倾斜，且该底面不平行于该顶面。16. The backlight module according to claim 12, wherein the light guide plate further has a top surface and a bottom surface, the top surface is disposed between the first surface and the second surface, and the bottom surface is opposite to the The top surface is inclined, and the bottom surface is not parallel to the top surface.17.如权利要求16所述的背光模组，其特征在于，所述背光模组还包括一外壳，其具有一平行于该顶面的固定底面。17. The backlight module according to claim 16, further comprising a housing having a fixed bottom surface parallel to the top surface.18.如权利要求16所述的背光模组，其特征在于，该导光板还包括一扩散图案结构，其设置于导光板的底面。18. The backlight module according to claim 16, wherein the light guide plate further comprises a diffusion pattern structure disposed on the bottom surface of the light guide plate.19.如权利要求16所述的背光模组，其特征在于，该导光板的底面的内面形成有一扩散图案。19. The backlight module as claimed in claim 16, wherein a diffusion pattern is formed on the inner surface of the bottom surface of the light guide plate.20.如权利要求12所述的背光模组，其特征在于，所述背光模组还包括一反射片，设于该导光板下方。20. The backlight module according to claim 12, further comprising a reflective sheet disposed under the light guide plate.21.如权利要求12所述的背光模组，其特征在于，所述背光模组还包括一光学膜片，设于该导光板上方。21. The backlight module according to claim 12, further comprising an optical film disposed above the light guide plate.22.如权利要求12所述的背光模组，其特征在于，所述光源包括一发光二极管。22. The backlight module as claimed in claim 12, wherein the light source comprises a light emitting diode.

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