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CN100357809C - Backlight module - Google Patents

Backlight module
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Publication number
CN100357809C
CN100357809CCNB031243096ACN03124309ACN100357809CCN 100357809 CCN100357809 CCN 100357809CCN B031243096 ACNB031243096 ACN B031243096ACN 03124309 ACN03124309 ACN 03124309ACN 100357809 CCN100357809 CCN 100357809C
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China
Prior art keywords
transducer
backlight module
cover plate
disposed
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB031243096A
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Chinese (zh)
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CN1542514A (en
Inventor
吴志刚
蔡宜轩
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AUO Corp
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AU Optronics Corp
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Publication date
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Priority to CNB031243096ApriorityCriticalpatent/CN100357809C/en
Publication of CN1542514ApublicationCriticalpatent/CN1542514A/en
Application grantedgrantedCritical
Publication of CN100357809CpublicationCriticalpatent/CN100357809C/en
Anticipated expirationlegal-statusCritical
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Abstract

Translated fromChinese

一种背光模块,主要由一模块体、一变换器、一变换器盖板以及一散热装置构成。该变换器配置于模块体的底部。该变换器盖板配置于模块体的底部,且变换器盖板的内表面与变换器接触,将变换器覆盖。该散热装置配置于变换器盖板的外表面上,且此散热装置具有多个散热片。通过将该散热装置配置在变换器盖板的外表面上,使得直接与变换器盖板接触的变换器所产生的高热能顺利地导出背光模块外,从而提高背光模块的亮度。

Figure 03124309

A backlight module mainly consists of a module body, a converter, a converter cover and a heat sink. The converter is arranged at the bottom of the module body. The converter cover is arranged at the bottom of the module body, and the inner surface of the converter cover contacts the converter to cover the converter. The heat sink is arranged on the outer surface of the converter cover, and the heat sink has a plurality of heat sinks. By arranging the heat sink on the outer surface of the converter cover, the high heat energy generated by the converter directly contacting the converter cover can be smoothly conducted out of the backlight module, thereby improving the brightness of the backlight module.

Figure 03124309

Description

Backlight module
Technical field
The present invention is about a kind of backlight module, and the backlight module of particularly discharging about a kind of high heat that has heat abstractor and can effectively transducer (inverter) be produced.
Background technology
The progressive rapidly tremendous progress that is indebted to semiconductor subassembly or man-machine display device mostly of multimedia society.With regard to display, cathode ray tube (CRT) is monopolized monitor market in recent years because of having excellent display quality and its economy always.Yet, operate the environment of a plurality of terminating machine/display equipments on the table for the individual, or with the incision of the viewpoint of environmental protection, if predicted with the trend of saving the energy, cathode-ray tube (CRT) is because of still existing a lot of problems in space utilization and the energy resource consumption, and can't effectively provide solution for the demand of light, thin, short, little and low consumpting power.Therefore, the LCD (LCD) with high image quality, high spatial utilization ratio, low consumpting power, advantageous characteristic such as radiationless becomes the main flow in market gradually.
It should be noted that because liquid crystal molecule itself can't be luminous, so must provide liquid crystal panel required area source, make liquid crystal panel reach the effect of demonstration, and obtain enough brightness and contrast simultaneously by means of backlight module.Backlight module is divided into two kinds of side incident type and straight-down negatives usually, wherein, the backlight module of side incident type need pass through a light guide plate (light guideplate), line source is converted to the required area source of liquid crystal panel, the backlight module of straight-down negative then need not dispose light guide plate, just can directly provide liquid crystal panel required area source.
Fig. 1 is the decomposing schematic representation of backlight module in the prior art.Fig. 2 is the combination synoptic diagram of backlight module in the prior art.Please jointly with reference to Fig. 1 and Fig. 2,backlight module 100, this sentences bottom-lighting type back light module is example, it mainly is made of amodule body 110, atransducer 120 and a transducer cover plate 130.Module body 110 mainly is made of an outer framework (bezel back) 112 and a plurality of cold-cathode fluorescence lamp (CCFL) 114, these cold-cathode fluorescence lamps 114 are disposed in theouter framework 112, and the material ofouter framework 112 for example is the reflection material, in order to the light that cold-cathode fluorescence lamp 114 is launched, concentrate liquid crystal panel (figure does not show) projection of being disposed towardsmodule body 110 tops.
As shown in Figures 1 and 2,transducer 120 is disposed at the bottom ofmodule body 110, andtransducer cover plate 130 is disposed at the bottom ofmodule body 110, andtransducer cover plate 130 has an inside surface 132 and an outside surface 134, wherein this inside surface 132 contacts withtransducer 120, andtransducer 120 is covered.Transducer 120 mainly is made of acircuit board 122 and at least one lamp source drivenunit 124, and wherein lamp source drivenunit 124 is disposed on thecircuit board 122, and lamp source drivenunit 124 contacts with the inside surface 132 of transducer cover plate 130.Lamp source drivenunit 124 can produce high heat in order to drive cold-cathode fluorescence lamp 114 during its running, and therefore, lamp source drivenunit 124 can be considered the main heat source in thebacklight module 100.
As mentioned above, in the prior art aftertransducer 120 andtransducer cover plate 130 are assembled to the bottom ofmodule body 110 in regular turn,transducer cover plate 130 is about to transducer 120 and covers, the high heat that itstransducer 120 is produced when running can be towards the conduction of the bottom ofmodule body 110, cause the rising ofmodule body 110 internal temperatures, whenmodule body 110 temperature inside are higher than the luminance temperature of cold-cathode fluorescence lamp 114, promptly can influence the luminescence efficiency of cold-cathode fluorescence lamp 114, and then the brightness that directly has influence onbacklight module 100 presents.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of backlight module, it can successfully be derived the high heat that transducer produced outside the backlight module, operate under the environment of high temperature to avoid cold-cathode fluorescence lamp, and then the raising brightness of backlight module represents.
Based on above-mentioned purpose, the present invention proposes a kind of backlight module, and it mainly is made of a module body, a transducer, a transducer cover plate and a heat abstractor.Wherein, converters is in the bottom of module body; The transducer cover plate is disposed at the bottom of module body, and the transducer cover plate has an inside surface and an outside surface, and the inside surface of transducer cover plate contacts with transducer, and transducer is covered and this transducer cover plate and this transducer are electrically insulated; Heat abstractor (heat sink) is disposed on the outside surface of transducer cover plate, and this heat abstractor has a plurality of heat radiator.
Based on above-mentioned purpose, the present invention also proposes a kind of backlight module, and it mainly is made of a module body, a transducer and a transducer cover plate.Wherein, converters is in the bottom of module body; The transducer cover plate is disposed at the bottom of module body, and the transducer cover plate has an inside surface and an outside surface, and the inside surface of transducer cover plate contacts with transducer, and transducer is covered, and the outside surface of transducer cover plate has a plurality of heat radiator.
In preferred embodiment of the present invention, above-mentioned module body mainly is made of an outer framework and at least one cold-cathode fluorescence lamp.Wherein, this outer framework has an inside surface and an outside surface, and converters is on this outside surface, and cold-cathode fluorescence lamp then is disposed in the outer framework.For example dispose a reflector plate (reflector) on the inside surface of outer framework,, concentrate the liquid crystal panel projection of being disposed towards the module body top in order to the light that cold-cathode fluorescence lamp is launched.In addition, the material of outer framework itself also can adopt the reflection material, with the assembly cost and the time of saving reflector plate.
In preferred embodiment of the present invention, present in order to promote brightness of backlight module, optionally dispose a diffusion sheet and a brightening piece, wherein diffusion sheet for example is to be disposed on the module body and corresponding to the top of cold-cathode fluorescence lamp, and brightening piece for example is to be disposed on the diffusion sheet.
In preferred embodiment of the present invention, above-mentioned transducer mainly is made of a circuit board and at least one lamp source driven unit, and wherein lamp source driven unit is disposed on the circuit board, and lamp source driven unit contacts with the inside surface of transducer cover plate.
In preferred embodiment of the present invention, for example dispose one first radiating gasket (thermal pad) between above-mentioned transducer and the transducer cover plate, and for example dispose one second radiating gasket between transducer cover plate and the heat abstractor.In addition, an also configurable heat-conducting glue between transducer cover plate and the heat abstractor.By first, second above-mentioned radiating gasket or heat-conducting glue to promote the radiating effect of heat abstractor.
The present invention is by increasing configuration one heat abstractor at integrally formed a plurality of heat radiator on the outside surface of transducer cover plate or on the outside surface of transducer cover plate, make the high heat energy that transducer produced that directly contacts successfully derive outside the backlight module, and then promote representing of backlight module brightness with the transducer cover plate.
Description of drawings
For above and other objects of the present invention, feature and advantage can be become apparent, hereinafter will be described in detail a preferred embodiment of the present invention in conjunction with the following drawings, wherein:
Fig. 1 is the decomposing schematic representation of backlight module in the prior art;
Fig. 2 is the combination synoptic diagram of backlight module in the prior art;
Figure 3 shows that the decomposing schematic representation of the preferred embodiment of backlight module of the present invention; And
Figure 4 shows that the combination synoptic diagram of the preferred embodiment of backlight module of the present invention.
Reference numeral:
134,234: outside surface
216: reflector plate
217: diffusion sheet
218: brightening piece
236: heat radiator
240: heat abstractor
242: heat radiator
250: the first radiating gaskets
260: the second radiating gaskets
Embodiment
Figure 3 shows that the decomposing schematic representation of the preferred embodiment of backlight module of the present invention.Figure 4 shows that the combination synoptic diagram of the preferred embodiment of backlight module of the present invention.Please jointly with reference to Fig. 3 and Fig. 4, this sentences bottom-lighting type back light module is example, and it mainly is made of amodule body 210, atransducer 220, atransducer cover plate 230 and a heat abstractor 240.Wherein, mainly by anouter framework 212 and 214 formations of a plurality of cold-cathode fluorescence lamp (CCFL), these cold-cathode fluorescence lamps 214 are disposed in theouter framework 212 module body 210.For example dispose areflector plate 216 on the inside surface ofouter framework 212,, concentrate liquid crystal panel (figure does not show) projection of being disposed towardsmodule body 210 tops in order to the light that cold-cathode fluorescence lamp 214 is launched.Certainly,outer framework 212 materials own also can adopt the reflection material, with the assembly cost and the time of savingreflector plate 216.
In addition, for the brightness of promotingbacklight module 200 presents, optionally dispose adiffusion sheet 217 and a brighteningpiece 218, whereindiffusion sheet 217 for example is to be disposed on themodule body 210 and corresponding to the top of cold-cathode fluorescence lamp 214, and brighteningpiece 218 for example is to be disposed on thediffusion sheet 218.
As shown in Figures 3 and 4,transducer 220 is disposed at the bottom ofmodule body 210, andtransducer cover plate 230 is disposed at the bottom ofmodule body 210, andtransducer cover plate 230 has an inside surface 232 and an outside surface 234, wherein this inside surface 232 contacts withtransducer 230, andtransducer 220 is covered.Transducer 220 mainly is made of acircuit board 222 and at least one lamp source drivenunit 224, and wherein lamp source drivenunit 224 is disposed on thecircuit board 222, and lamp source drivenunit 224 contacts with the inside surface 232 oftransducer cover plate 230.
Please continue to consult Fig. 3 and Fig. 4,heat abstractor 240 is disposed on the outside surface 234 oftransducer cover plate 230, and thisheat abstractor 240 has a plurality of heat radiator 242.Configuration by above-mentionedheat abstractor 240, the high heat energy that the lamp source drivenunit 224 of thefeasible transducer 220 that directly contacts withtransducer cover plate 230 is produced conducts on theheat abstractor 240 viatransducer cover plate 230, and this high heat energy is successfully derived outside the backlight module 200.So, the cold-cathode fluorescence lamp 214 ofmodule body 210 inside can be in normal luminance temperature, and then promotes representing ofbacklight module 200 brightness.
As shown in Figure 4, for example dispose one firstradiating gasket 250 betweentransducer 220 and thetransducer cover plate 230, and for example dispose one second radiatinggasket 260 betweentransducer cover plate 230 and theheat abstractor 240, configuration by first radiatinggasket 250 and second radiatinggasket 260, the high heat thattransducer 220 is produced can conduct on theheat abstractor 240 more swimmingly, to promote the radiating effect of heat abstractor 240.Certainly, also configurable one has thermal conduction characteristic and the heat-conducting glue that binds function (figure does not show) concurrently betweentransducer cover plate 230 and theheat abstractor 240,heat abstractor 240 directly is attached on thetransducer cover plate 230, and then saves the cost of assembling.
In the foregoing description, be on the outside surface of transducer cover plate, to increase configuration one heat abstractor, make the high heat energy that transducer produced that directly contacts successfully derive outside the backlight module, and then promote representing of backlight module brightness with the transducer cover plate.Yet, those skilled in the art all can be known by inference easily, the present invention also not only is confined to increase on the outside surface of transducer cover plate configuration one heat abstractor, can be on transducer cover plate ground outside surface direct integrally formed a plurality of heat radiator, can reach the effect of heat radiation too.
In sum, backlight module of the present invention has following advantage at least:
1. the present invention is increasing configuration one heat abstractor or integrally formed a plurality of heat radiator on the outside surface of transducer cover plate on the outside surface of transducer cover plate, make the high heat energy that transducer produced that directly contacts successfully derive outside the backlight module, and then promote representing of backlight module brightness with the transducer cover plate.
2. the present invention is disposing a radiating gasket between transducer and the transducer cover plate and between transducer cover plate and the heat abstractor, and the high heat that transducer is produced can conduct on the heat abstractor more swimmingly, and then promotes the radiating effect of heat abstractor.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; those skilled in the art is under the situation that does not break away from the spirit and scope of the present invention; can carry out some change or improvement, thus protection scope of the present invention later on the limited range of attached claims be as the criterion.

Claims (10)

1. backlight module comprises:
One module body;
One transducer is disposed at the bottom of this module body;
One transducer cover plate, the bottom that is disposed at this module body to be covering this transducer, and this transducer cover plate and this transducer be electrically insulated, and wherein this transducer cover plate has an inside surface and an outside surface, and this inside surface contacts with this transducer; And
One heat abstractor is disposed on this outside surface, and this heat abstractor has a plurality of heat radiator.
2. backlight module as claimed in claim 1, wherein this module body comprises:
One outer framework has an inside surface and an outside surface, and wherein this converters is on this outside surface; And
At least one cold-cathode fluorescence lamp is disposed in this outer framework.
3. backlight module as claimed in claim 2, the material of wherein being somebody's turn to do outer framework are a reflection material.
4. backlight module as claimed in claim 2 also comprises a reflector plate, and wherein this reflector plate is disposed on this inside surface of this outer framework.
5. backlight module as claimed in claim 2 also comprises a diffusion sheet, and wherein this diffusion sheet is disposed on this module body, and corresponding to the top of this cold-cathode fluorescence lamp.
6. backlight module as claimed in claim 5 also comprises a brightening piece, and wherein this brightening piece is disposed on this diffusion sheet.
7. backlight module as claimed in claim 1, wherein this transducer comprises:
One circuit board; And
At least one lamp source driven unit is disposed on this circuit board, and this lamp source driven unit contacts with this transducer cover plate.
8. backlight module as claimed in claim 1 also comprises one first radiating gasket, and wherein this radiating gasket is disposed between this transducer and this transducer cover plate.
9. backlight module as claimed in claim 1 also comprises one second radiating gasket, and wherein this radiating gasket is disposed between this transducer cover plate and this heat abstractor.
10. backlight module as claimed in claim 1 also comprises a heat-conducting glue, and wherein this heat-conducting glue is disposed between this transducer cover plate and this heat abstractor.
CNB031243096A2003-04-302003-04-30 Backlight moduleExpired - LifetimeCN100357809C (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CNB031243096ACN100357809C (en)2003-04-302003-04-30 Backlight module

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CNB031243096ACN100357809C (en)2003-04-302003-04-30 Backlight module

Publications (2)

Publication NumberPublication Date
CN1542514A CN1542514A (en)2004-11-03
CN100357809Ctrue CN100357809C (en)2007-12-26

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN100373234C (en)*2004-11-292008-03-05友达光电股份有限公司 Backlight module
TWI460495B (en)*2011-11-072014-11-11Au Optronics CorpDisplay module

Citations (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5857767A (en)*1996-09-231999-01-12Relume CorporationThermal management system for L.E.D. arrays
US6407781B2 (en)*2000-03-242002-06-18Hitachi, Ltd.LCD device having electronic formed within concave portion of a reflector
CN1372317A (en)*2002-03-112002-10-02威盛电子股份有限公司 Chip cooling package structure and manufacturing method thereof
CN2534775Y (en)*2002-04-032003-02-05英业达股份有限公司 Heat conduction and heat dissipation structure of circuit board electronic components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5857767A (en)*1996-09-231999-01-12Relume CorporationThermal management system for L.E.D. arrays
US6407781B2 (en)*2000-03-242002-06-18Hitachi, Ltd.LCD device having electronic formed within concave portion of a reflector
CN1372317A (en)*2002-03-112002-10-02威盛电子股份有限公司 Chip cooling package structure and manufacturing method thereof
CN2534775Y (en)*2002-04-032003-02-05英业达股份有限公司 Heat conduction and heat dissipation structure of circuit board electronic components

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