| US3749649A (en)* | 1971-12-16 | 1973-07-31 | M & T Chemicals Inc | Bright tin-lead alloy plating |
| US3926749A (en)* | 1971-12-20 | 1975-12-16 | M & T Chemicals Inc | Tin-lead alloy plating |
| GB1469547A (en)* | 1973-06-28 | 1977-04-06 | Minnesota Mining & Mfg | Tin/lead electr-plating baths |
| US3875029A (en)* | 1974-02-19 | 1975-04-01 | R O Hull & Company Inc | Plating bath for electrodeposition of bright tin and tin-lead alloy |
| US4053372A (en)* | 1975-10-09 | 1977-10-11 | Amp Incorporated | Tin-lead acidic plating bath |
| US4207148A (en)* | 1975-11-28 | 1980-06-10 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
| CA1077430A (en)* | 1975-11-28 | 1980-05-13 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
| US4067781A (en)* | 1977-01-10 | 1978-01-10 | Rapids Felix R | Method for electroplating |
| US4135991A (en)* | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
| GB2013241B (en)* | 1977-11-16 | 1982-03-24 | Dipsol Chem | Electroplating bath for depositing tin or tin alloy with brightness |
| US4347107A (en)* | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
| SE8204505L (en)* | 1981-09-08 | 1983-03-09 | Occidental Chem Co | ELECTROPLETING FOR PROVISION OF TIN LEAD ALLOYS ON DIFFERENT SUBSTRACTS |
| US4871429A (en)* | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US5066367B1 (en)* | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US5094726B1 (en)* | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US4765871A (en)* | 1981-12-28 | 1988-08-23 | The Boeing Company | Zinc-nickel electroplated article and method for producing the same |
| US4701244A (en)* | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
| US4717460A (en)* | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
| US4640746A (en)* | 1984-10-11 | 1987-02-03 | Learonal, Inc. | Bath and process for plating tin/lead alloys on composite substrates |
| DE3440668A1 (en)* | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | METHOD FOR PRESERVING THE SOLUTABILITY OF LEAD TIN |
| US4582576A (en)* | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US4681670A (en)* | 1985-09-11 | 1987-07-21 | Learonal, Inc. | Bath and process for plating tin-lead alloys |
| US4880507A (en)* | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
| US5174887A (en)* | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| US4844780A (en)* | 1988-02-17 | 1989-07-04 | Maclee Chemical Company, Inc. | Brightener and aqueous plating bath for tin and/or lead |
| US4849059A (en)* | 1988-09-13 | 1989-07-18 | Macdermid, Incorporated | Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor |
| US4885064A (en)* | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
| WO1993009276A1 (en)* | 1991-11-01 | 1993-05-13 | National-Standard Company | Age resistant solder coatings |
| US5698087A (en)* | 1992-03-11 | 1997-12-16 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US5346607A (en)* | 1992-09-30 | 1994-09-13 | Weirton Steel Corporation | Electrolytic tinplating and product |
| DE4422756C1 (en)* | 1994-06-29 | 1995-04-20 | Goldschmidt Ag Th | Self-regulating, acid electrolyte for dip tinning of aluminium alloys |
| US5560813A (en)* | 1994-09-09 | 1996-10-01 | National Science Council | Solder electroplating solution containing gelatin |
| US6949816B2 (en)* | 2003-04-21 | 2005-09-27 | Motorola, Inc. | Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same |
| US6175752B1 (en) | 1998-04-30 | 2001-01-16 | Therasense, Inc. | Analyte monitoring device and methods of use |
| US8688188B2 (en) | 1998-04-30 | 2014-04-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US8480580B2 (en)* | 1998-04-30 | 2013-07-09 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US8974386B2 (en) | 1998-04-30 | 2015-03-10 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US9066695B2 (en)* | 1998-04-30 | 2015-06-30 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US8465425B2 (en) | 1998-04-30 | 2013-06-18 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US20080076997A1 (en)* | 1998-04-30 | 2008-03-27 | Abbott Diabetes Care, Inc. | Analyte monitoring device and methods of use |
| US8346337B2 (en) | 1998-04-30 | 2013-01-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US6560471B1 (en) | 2001-01-02 | 2003-05-06 | Therasense, Inc. | Analyte monitoring device and methods of use |
| US6582582B2 (en) | 2001-03-09 | 2003-06-24 | Donald Becking | Electroplating composition and process |
| EP1397068A2 (en) | 2001-04-02 | 2004-03-17 | Therasense, Inc. | Blood glucose tracking apparatus and methods |
| US6562221B2 (en) | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
| TWI268292B (en)* | 2002-03-05 | 2006-12-11 | Shipley Co Llc | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| US7273540B2 (en)* | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| US7811231B2 (en) | 2002-12-31 | 2010-10-12 | Abbott Diabetes Care Inc. | Continuous glucose monitoring system and methods of use |
| WO2007143225A2 (en)* | 2006-06-07 | 2007-12-13 | Abbott Diabetes Care, Inc. | Analyte monitoring system and method |
| JP5622360B2 (en)* | 2009-01-16 | 2014-11-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Electrotin plating solution and electrotin plating method |
| US8834958B2 (en) | 2011-07-08 | 2014-09-16 | The United States Of America As Represented By The Secretary Of The Army | Process of making negative electrode |
| GB201815262D0 (en)* | 2018-09-19 | 2018-10-31 | Lankem Ltd | Composition and method |