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CA2330426A1 - Material shaping device with a laser beam which is injected into a stream of liquid - Google Patents

Material shaping device with a laser beam which is injected into a stream of liquidDownload PDF

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Publication number
CA2330426A1
CA2330426A1CA002330426ACA2330426ACA2330426A1CA 2330426 A1CA2330426 A1CA 2330426A1CA 002330426 ACA002330426 ACA 002330426ACA 2330426 ACA2330426 ACA 2330426ACA 2330426 A1CA2330426 A1CA 2330426A1
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CA
Canada
Prior art keywords
liquid
stream
injected
laser beam
shaping device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002330426A
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French (fr)
Other versions
CA2330426C (en
Inventor
Bernold Richerzhagen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synova SA
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Individual
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Filing date
Publication date
Application filed by IndividualfiledCriticalIndividual
Publication of CA2330426A1publicationCriticalpatent/CA2330426A1/en
Application grantedgrantedCritical
Publication of CA2330426CpublicationCriticalpatent/CA2330426C/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Abstract

The invention relates to a method and device for shaping material of work pieces using a laser beam which is injected into a stream of liquid. The liquid which is to be formed into a stream by a nozzle channel is fed to the nozzle channel opening such that the flow does not swirl, especially without flow components which are tangential to the nozzle channel axis. The laser irradiation is focussed on the channel entry plane and the liquid is fed to the channel opening in such a way that a liquid retention space is avoided in the beam focussing ball and in the immediate surroundings thereof.
CA002330426A1998-04-301999-04-30Material shaping device with a laser beam which is injected into a stream of liquidExpired - LifetimeCA2330426C (en)

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
DE198194291998-04-30
DE19819429.31998-04-30
PCT/CH1999/000180WO1999056907A1 (en)1998-04-301999-04-30Material shaping device with a laser beam which is injected into a stream of liquid

Publications (2)

Publication NumberPublication Date
CA2330426A1true CA2330426A1 (en)1999-11-11
CA2330426C CA2330426C (en)2007-11-13

Family

ID=7866347

Family Applications (1)

Application NumberTitlePriority DateFiling Date
CA002330426AExpired - LifetimeCA2330426C (en)1998-04-301999-04-30Material shaping device with a laser beam which is injected into a stream of liquid

Country Status (4)

CountryLink
KR (1)KR100584310B1 (en)
CN (1)CN1134322C (en)
CA (1)CA2330426C (en)
WO (1)WO1999056907A1 (en)

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US6737606B2 (en)2001-09-102004-05-18Micron Technology, Inc.Wafer dicing device and method
US6888098B1 (en)2002-07-032005-05-03Scimed Life Systems, Inc.Tubular cutting process and system
US7358154B2 (en)2001-10-082008-04-15Micron Technology, Inc.Method for fabricating packaged die
US7375009B2 (en)2002-06-142008-05-20Micron Technology, Inc.Method of forming a conductive via through a wafer
US10160059B2 (en)2016-03-032018-12-25General Electric CompanyDecoupled liquid-jet guided laser nozzle cap
US10335900B2 (en)2016-03-032019-07-02General Electric CompanyProtective shield for liquid guided laser cutting tools
US10453704B2 (en)2003-05-062019-10-22Micron Technology, Inc.Method for packaging circuits

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EP1269535B1 (en)*2000-04-042007-10-10Synova S.A.Method for cutting an object and for further processing the cut material and a carrier for holding the object or the cut material
US6563080B2 (en)2001-02-152003-05-13Scimed Life Systems, Inc.Laser cutting of stents and other medical devices
US6777647B1 (en)*2003-04-162004-08-17Scimed Life Systems, Inc.Combination laser cutter and cleaner
US7476034B2 (en)2003-08-282009-01-13Boston Scientific Scimed, Inc.Dynamic bushing for medical device tubing
EP1657020A1 (en)*2004-11-102006-05-17Synova S.A.Process and device for optimising the coherence of a fluidjet used for materialworking and fluid flow nozzle for such a device
EP1940579B1 (en)*2005-05-172010-06-23Technikus AgMethod for material working by means of a laser guided in a water jet and device for carrying out said method
JP4844715B2 (en)*2005-08-252011-12-28澁谷工業株式会社 Hybrid laser processing equipment
JP2007144494A (en)*2005-11-302007-06-14Tokyo Electron LtdApparatus and method for laser processing
DE102006038001B3 (en)*2006-08-142008-03-27Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Procedure for drying and/or dry holding of workpiece during fluid jet guidance processing of the workpiece, comprises supplying dry inert gas at a process head, which is conveyed nearly at the workpiece, whose processed area is dried
US12290277B2 (en)2007-01-022025-05-06Aquabeam, LlcTissue resection with pressure sensing
US9232959B2 (en)2007-01-022016-01-12Aquabeam, LlcMulti fluid tissue resection methods and devices
US8134098B2 (en)*2007-09-282012-03-13Sugino Machine LimitedLaser machining apparatus using laser beam introduced into jet liquid column
US7722661B2 (en)2007-12-192010-05-25Boston Scientific Scimed, Inc.Stent
ES2769535T3 (en)2008-03-062020-06-26Aquabeam Llc Tissue ablation and cauterization with optical energy carried in a fluid stream
EP2208568A1 (en)*2009-01-202010-07-21Synova S.A.Apparatus and method for processing material by means of laser
DE102009011305A1 (en)*2009-03-022010-09-09Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Back contacting solar cells and methods of making same
US9848904B2 (en)2009-03-062017-12-26Procept Biorobotics CorporationTissue resection and treatment with shedding pulses
DE102010011580B4 (en)*2010-03-162020-01-02Vollmer Werke Maschinenfabrik Gmbh Device and method for measuring a liquid jet, in particular used as a light guide, and device for processing a workpiece
DE102011001322A1 (en)*2011-03-162012-09-20Ipg Laser Gmbh Machine and method for material processing of workpieces with a laser beam
CN102259236A (en)*2011-07-012011-11-30中国电子科技集团公司第四十五研究所Alignment device for coupling of water-jet guided laser
CN102259237B (en)*2011-07-012014-09-03中国电子科技集团公司第四十五研究所Regulator for coupling of laser beam and water jet
EP3351196A1 (en)2012-02-292018-07-25Procept Biorobotics CorporationAutomated image-guided tissue resection and treatment
JP5877432B2 (en)*2012-02-292016-03-08株式会社スギノマシン Laser processing equipment
US8969760B2 (en)2012-09-142015-03-03General Electric CompanySystem and method for manufacturing an airfoil
US8993923B2 (en)2012-09-142015-03-31General Electric CompanySystem and method for manufacturing an airfoil
JP6403695B2 (en)2013-02-142018-10-10プロセプト バイオロボティクス コーポレイション Aqua ablation aqua beam ophthalmic surgery method and apparatus
US11440135B2 (en)2013-05-232022-09-13Trumpf Werkzeugmaschinen Gmbh + Co. KgLaser machining nozzle for a laser machining device, and laser machining device
CN105408050B (en)*2013-05-232018-04-20通快机床两合公司Laser machining nozzle and the laser processing device for laser processing device
EP2957378A1 (en)*2014-06-162015-12-23Synova SAMachining head for coupling a laser beam and a fluid beam with an interface
GB201419809D0 (en)2014-11-072014-12-24Element Six Technologies LtdA method of fabricating plates of super-hard material and cutting techniques suitable for such a method
US9770785B2 (en)2014-11-182017-09-26General Electric CompanySystem and method for forming a cooling hole in an airfoil
DE102014223716A1 (en)2014-11-202016-05-25Siemens Aktiengesellschaft Device and method for processing a component by means of a propagating in a liquid jet laser beam
US9895755B2 (en)2014-12-092018-02-20Kennametal Inc.Cutting insert with internal coolant passages and method of making same
US9776284B2 (en)2015-01-222017-10-03General Electric CompanySystem and method for cutting a passage in an airfoil
EP3124165B1 (en)2015-07-282020-06-17Synova S.A.Process of treating a workpiece using a liquid jet guided laser beam
DE102016116512A1 (en)2016-09-032018-03-08Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for machining a workpiece
EP3300833B1 (en)2016-10-032019-11-27Synova SADevice for generating a jet of liquid
EP3525943B1 (en)*2016-10-172020-07-08ABB Schweiz AGCleaning device and method for controlling a laser focus inside a fluid beam, and a system including the cleaning device
CA3049626A1 (en)*2017-01-232018-07-26Subaru CorporationLaser peening processing apparatus and laser peening processing method
DE102017112113A1 (en)2017-06-012018-12-06Lohmann-Koester Gmbh & Co. Kg Method for producing a sieve-shaped demolding tool and sieve-shaped demolding tool
EP3466597A1 (en)*2017-10-052019-04-10Synova S.A.Apparatus for machining a workpiece with a laser beam
EP3470165B1 (en)*2017-10-132023-08-16Synova S.A.Apparatus for machining a workpiece with a liquid jet guided laser beam and the assembly thereof
CN108132511A (en)*2017-12-212018-06-08暨南大学A kind of compound camera lens for diamond laser cutting
CN108480842B (en)*2018-06-122022-11-29桂林电子科技大学Water-conducting laser coupling shunting voltage stabilizer
PL3965990T3 (en)*2019-05-082025-03-03Wsoptics Technologies GmbhMethod and device for laser processing a workpiece
CN113618232B (en)*2021-07-282024-03-19中国科学院宁波材料技术与工程研究所Double-beam coupling water guide machining head device and machining method

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US4952771A (en)*1986-12-181990-08-28Aesculap AgProcess for cutting a material by means of a laser beam
FR2676913B1 (en)*1991-05-281993-08-13Lasag Ag MATERIAL ABLATION DEVICE, PARTICULARLY FOR DENTISTRY.
DE4418845C5 (en)*1994-05-302012-01-05Synova S.A. Method and device for material processing using a laser beam
US5773791A (en)*1996-09-031998-06-30Kuykendal; RobertWater laser machine tool

Cited By (10)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6737606B2 (en)2001-09-102004-05-18Micron Technology, Inc.Wafer dicing device and method
US7358154B2 (en)2001-10-082008-04-15Micron Technology, Inc.Method for fabricating packaged die
US8138617B2 (en)2001-10-082012-03-20Round Rock Research, LlcApparatus and method for packaging circuits
US7375009B2 (en)2002-06-142008-05-20Micron Technology, Inc.Method of forming a conductive via through a wafer
US6888098B1 (en)2002-07-032005-05-03Scimed Life Systems, Inc.Tubular cutting process and system
US9180032B2 (en)2002-07-032015-11-10Boston Scientific Scimed, Inc.Tubular cutting process and system
US10453704B2 (en)2003-05-062019-10-22Micron Technology, Inc.Method for packaging circuits
US10811278B2 (en)2003-05-062020-10-20Micron Technology, Inc.Method for packaging circuits
US10160059B2 (en)2016-03-032018-12-25General Electric CompanyDecoupled liquid-jet guided laser nozzle cap
US10335900B2 (en)2016-03-032019-07-02General Electric CompanyProtective shield for liquid guided laser cutting tools

Also Published As

Publication numberPublication date
WO1999056907A1 (en)1999-11-11
CA2330426C (en)2007-11-13
KR20010043171A (en)2001-05-25
CN1134322C (en)2004-01-14
CN1306467A (en)2001-08-01
KR100584310B1 (en)2006-05-26

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EEERExamination request
MKEXExpiry

Effective date:20190430
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