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AU2325900A - Exposure device, exposure method, and device manufacturing method - Google Patents

Exposure device, exposure method, and device manufacturing method

Info

Publication number
AU2325900A
AU2325900AAU23259/00AAU2325900AAU2325900AAU 2325900 AAU2325900 AAU 2325900AAU 23259/00 AAU23259/00 AAU 23259/00AAU 2325900 AAU2325900 AAU 2325900AAU 2325900 AAU2325900 AAU 2325900A
Authority
AU
Australia
Prior art keywords
exposure
device manufacturing
manufacturing
exposure device
exposure method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU23259/00A
Inventor
Naomasa Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon CorpfiledCriticalNikon Corp
Publication of AU2325900ApublicationCriticalpatent/AU2325900A/en
Abandonedlegal-statusCriticalCurrent

Links

Classifications

Landscapes

AU23259/00A1999-03-122000-02-04Exposure device, exposure method, and device manufacturing methodAbandonedAU2325900A (en)

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
JP66736991999-03-12
JP11/667361999-03-12
PCT/JP2000/000604WO2000055891A1 (en)1999-03-122000-02-04Exposure device, exposure method, and device manufacturing method

Publications (1)

Publication NumberPublication Date
AU2325900Atrue AU2325900A (en)2000-10-04

Family

ID=13324480

Family Applications (1)

Application NumberTitlePriority DateFiling Date
AU23259/00AAbandonedAU2325900A (en)1999-03-122000-02-04Exposure device, exposure method, and device manufacturing method

Country Status (5)

CountryLink
US (1)US6842221B1 (en)
KR (1)KR20020006670A (en)
AU (1)AU2325900A (en)
TW (1)TW473816B (en)
WO (1)WO2000055891A1 (en)

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JP2001308003A (en)*2000-02-152001-11-02Nikon Corp Exposure method and apparatus, and device manufacturing method
KR20010095087A (en)2000-03-302001-11-03시마무라 테루오Exposure apparatus, exposure method, and method of manufacturing device
JP3628939B2 (en)*2000-06-272005-03-16松下電器産業株式会社 Exposure method and exposure apparatus
WO2002093626A1 (en)*2001-05-162002-11-21Nikon CorporationAligning method and aligner, and method and system for conveying substrate
US6619903B2 (en)*2001-08-102003-09-16Glenn M. FriedmanSystem and method for reticle protection and transport
JP2004022916A (en)*2002-06-192004-01-22Nikon Corp Laser light source control method and apparatus, exposure method and apparatus, and device manufacturing method
KR20050085235A (en)*2002-12-102005-08-29가부시키가이샤 니콘Exposure system and device producing method
US6765203B1 (en)*2003-01-312004-07-20Shimadzu CorporationPallet assembly for substrate inspection device and substrate inspection device
KR100490594B1 (en)*2003-02-182005-05-19삼성전자주식회사Method for safely storing an object, and apparatus having a storage box and a stocker for storing an object
KR101577555B1 (en)*2003-04-112015-12-14가부시키가이샤 니콘Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US6876439B2 (en)*2003-05-292005-04-05Asml Holding N.V.Method to increase throughput in a dual substrate stage double exposure lithography system
US6781674B1 (en)*2003-05-292004-08-24Asml Holding N.V.System and method to increase throughput in a dual substrate stage double exposure lithography system
US7371287B2 (en)*2003-05-292008-05-13Perkinelmer, Inc.Substrate handling system
TWI433212B (en)2003-06-192014-04-01尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
JP2005057154A (en)*2003-08-072005-03-03Canon Inc Exposure equipment
US7123344B2 (en)*2003-09-292006-10-17Asml Netherlands B.V.Lithographic apparatus and device manufacturing method
JP4564742B2 (en)*2003-12-032010-10-20キヤノン株式会社 Exposure apparatus and device manufacturing method
US7053980B2 (en)*2004-01-232006-05-30Asml Netherlands B.V.Lithographic alignment system
US7589822B2 (en)*2004-02-022009-09-15Nikon CorporationStage drive method and stage unit, exposure apparatus, and device manufacturing method
JP4383911B2 (en)*2004-02-032009-12-16キヤノン株式会社 Exposure apparatus and semiconductor device manufacturing method
US7184123B2 (en)*2004-03-242007-02-27Asml Netherlands B.V.Lithographic optical system
KR101123187B1 (en)*2004-03-312012-03-19에이에스엠엘 네델란즈 비.브이.Method and device for removing particles generated by means of a radiation source during generation of short-wave radiation
JP2006049815A (en)*2004-07-022006-02-16Canon IncAligner
US7126664B2 (en)*2004-07-122006-10-24Asml Netherlands B.V.Lithographic apparatus and a device manufacturing method
US7253880B2 (en)*2004-11-242007-08-07Asml Netherlands B.V.Lithographic apparatus and device manufacturing method
US20060199274A1 (en)*2005-03-012006-09-07Canon Kabushiki KaishaAtmosphere conditioning method, exposure apparatus, and device manufacturing method
US7880217B2 (en)2005-07-302011-02-01Taiwan Semiconductor Manufacturing Co., Ltd.Programmable non-volatile memory (PNVM) device
US7665981B2 (en)*2005-08-252010-02-23Molecular Imprints, Inc.System to transfer a template transfer body between a motion stage and a docking plate
WO2007024345A2 (en)*2005-08-252007-03-01Molecular Imprints, Inc.System to transfer a template transfer body between a motion stage and a docking plate
JP2007281142A (en)*2006-04-052007-10-25Canon Inc Exposure apparatus and method, and device manufacturing method
US7933000B2 (en)*2006-11-162011-04-26Asml Netherlands B.V.Device manufacturing method, method for holding a patterning device and lithographic apparatus including an applicator for applying molecules onto a clamp area of a patterning device
US8237911B2 (en)2007-03-152012-08-07Nikon CorporationApparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
WO2009012919A1 (en)*2007-07-202009-01-29Carl Zeiss Smt AgMethod for examining a wafer with regard to a contamination limit and euv projection exposure system
NL1036181A1 (en)*2007-11-302009-06-04Asml Netherlands Bv A lithographic apparatus, a projection system and a device manufacturing method.
NL1036567A1 (en)*2008-03-282009-09-29Asml Netherlands Bv A lithographic apparatus and a vacuum chamber.
US8383202B2 (en)2008-06-132013-02-26Kateeva, Inc.Method and apparatus for load-locked printing
US12018857B2 (en)2008-06-132024-06-25Kateeva, Inc.Gas enclosure assembly and system
US9312159B2 (en)*2009-06-092016-04-12Nikon CorporationTransport apparatus and exposure apparatus
JP5617708B2 (en)*2011-03-162014-11-05東京エレクトロン株式会社 Lid opening / closing device
TWI611479B (en)*2016-09-292018-01-11台灣積體電路製造股份有限公司Method for forming a thin film assembly
US10176967B2 (en)*2017-02-232019-01-08Hermes Microvision, Inc.Load lock system for charged particle beam imaging
KR102675777B1 (en)*2017-07-312024-06-18삼성전자주식회사Pellicle for photomask, reticle including the same and method for manufacturing the same
US10994239B2 (en)2018-03-082021-05-04Sandisk Technologies LlcSpiral gas adsorption apparatus and method of using the same
JP7285648B2 (en)*2019-01-312023-06-02株式会社Screenホールディングス Conveying device, exposure device, and conveying method
CN114072732A (en)*2019-07-012022-02-18Asml荷兰有限公司 Surface treatment apparatus and method for surface treatment of patterned devices and other substrates
US11803129B2 (en)2021-08-132023-10-31Taiwan Semiconductor Manufacturing Company, Ltd.Semiconductor processing tool and methods of operation
CN114280893B (en)*2021-11-252023-08-01中国科学院微电子研究所Pollution control system and method of photoetching machine and photoetching machine
KR102534667B1 (en)*2022-10-202023-05-26세미랩코리아 주식회사Device for in-chamber type thin film analysis

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US5422704A (en)*1992-07-131995-06-06Intel CorporationPellicle frame
US5344677A (en)*1992-08-271994-09-06Hong Gilbert HPhotochemically stable deep ultraviolet pellicles for excimer lasers
US5559584A (en)*1993-03-081996-09-24Nikon CorporationExposure apparatus
JPH0922111A (en)*1995-07-051997-01-21Shin Etsu Chem Co Ltd Pellicle
US5883704A (en)1995-08-071999-03-16Nikon CorporationProjection exposure apparatus wherein focusing of the apparatus is changed by controlling the temperature of a lens element of the projection optical system
JPH0973167A (en)1995-09-051997-03-18Mitsui Petrochem Ind Ltd MASK WITH MASK PROTECTION DEVICE, MANUFACTURING METHOD THEREOF, AND EXPOSURE METHOD USING THE MASK
KR970067591A (en)*1996-03-041997-10-13오노 시게오 Projection exposure equipment
JP3690540B2 (en)*1996-03-042005-08-31株式会社ニコン Projection exposure equipment
JP4011687B2 (en)*1997-10-012007-11-21キヤノン株式会社 Mask structure, exposure apparatus using the mask structure, and semiconductor device manufacturing method using the mask structure
JPH11204396A (en)*1998-01-081999-07-30Canon Inc Semiconductor manufacturing system and device manufacturing method
JPH11274050A (en)*1998-03-251999-10-08Canon Inc Exposure apparatus and device manufacturing method
US6153044A (en)*1998-04-302000-11-28Euv LlcProtection of lithographic components from particle contamination
JP2000019721A (en)*1998-07-032000-01-21Canon Inc Reticle container, exposure method and device manufacturing method

Also Published As

Publication numberPublication date
WO2000055891A1 (en)2000-09-21
TW473816B (en)2002-01-21
KR20020006670A (en)2002-01-24
US6842221B1 (en)2005-01-11

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Legal Events

DateCodeTitleDescription
MK6Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase

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