AU2003235633A1 - Bonding device and method for production thereof - Google Patents

Bonding device and method for production thereof

Info

Publication number: AU2003235633A1
Authority: AU; Australia
Prior art keywords: production; bonding device; bonding
Prior art date: 2002-01-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Inventor

Karlheinz Bock

Martin Konig

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV

Original Assignee

Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-01-18

Filing date

2003-01-15

Publication date

2003-07-30

2002-08-22Priority claimed from DE10238587Aexternal-prioritypatent/DE10238587B4/en

2003-01-15Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eVfiledCriticalFraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV

2003-07-30Publication of AU2003235633A1publicationCriticalpatent/AU2003235633A1/en

2003-07-30Publication of AU2003235633A8publicationCriticalpatent/AU2003235633A8/en

StatusAbandonedlegal-statusCriticalCurrent

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/701—Organic molecular electronic devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/761—Biomolecules or bio-macromolecules, e.g. proteins, chlorophyl, lipids or enzymes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
- H—ELECTRICITY
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/95053—Bonding environment
- H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95121—Active alignment, i.e. by apparatus steering
- H01L2224/95122—Active alignment, i.e. by apparatus steering by applying vibration
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
- H01L2224/95147—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium by molecular lock-key, e.g. by DNA
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- H01L2924/01082—Lead [Pb]
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- H01L2924/01084—Polonium [Po]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/211—Fullerenes, e.g. C60
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Nanotechnology (AREA)
Spectroscopy & Molecular Physics (AREA)
Biophysics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Health & Medical Sciences (AREA)
Biochemistry (AREA)
General Physics & Mathematics (AREA)
General Health & Medical Sciences (AREA)
Molecular Biology (AREA)
Life Sciences & Earth Sciences (AREA)
Materials Engineering (AREA)
Mathematical Physics (AREA)
Theoretical Computer Science (AREA)
Crystallography & Structural Chemistry (AREA)
Manufacturing & Machinery (AREA)
Apparatus Associated With Microorganisms And Enzymes (AREA)
Adhesives Or Adhesive Processes (AREA)
Lining Or Joining Of Plastics Or The Like (AREA)

AU2003235633A2002-01-182003-01-15Bonding device and method for production thereofAbandonedAU2003235633A1 (en)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
DE10201881.2		2002-01-18
DE10201881		2002-01-18
DE10238587ADE10238587B4 (en)	2002-01-18	2002-08-22	Method for producing a composite device
DE10238587.4		2002-08-22
PCT/EP2003/000359WO2003060995A2 (en)	2002-01-18	2003-01-15	Bonding device and method for production thereof

Publications (2)

Publication Number	Publication Date
AU2003235633A1true AU2003235633A1 (en)	2003-07-30
AU2003235633A8 AU2003235633A8 (en)	2003-07-30

Family

ID=26010940

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003235633AAbandonedAU2003235633A1 (en)	2002-01-18	2003-01-15	Bonding device and method for production thereof

Country Status (4)

Country	Link
EP (1)	EP1464080B1 (en)
AU (1)	AU2003235633A1 (en)
DE (1)	DE50308112D1 (en)
WO (1)	WO2003060995A2 (en)

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7525194B2 (en)	2005-07-27	2009-04-28	Palo Alto Research Center Incorporated	System including self-assembled interconnections
US7662708B2 (en)	2005-07-27	2010-02-16	Palo Alto Research Center Incorporated	Self-assembled interconnection particles
US7504331B2 (en)	2005-07-27	2009-03-17	Palo Alto Research Center Incorporated	Method of fabricating self-assembled electrical interconnections
TWI500126B (en)*	2013-01-02	2015-09-11	Au Optronics Corp	Method of packaging driving device of display device and package structure of driving device of display device

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US5075253A (en)*	1989-04-12	1991-12-24	Advanced Micro Devices, Inc.	Method of coplanar integration of semiconductor IC devices
DE3924454A1 (en)*	1989-07-24	1991-02-07	Cornelis P Prof Dr Hollenberg	THE APPLICATION OF DNA AND DNA TECHNOLOGY FOR THE CONSTRUCTION OF NETWORKS FOR USE IN CHIP CONSTRUCTION AND CHIP PRODUCTION (DNA CHIPS)
US6652808B1 (en)*	1991-11-07	2003-11-25	Nanotronics, Inc.	Methods for the electronic assembly and fabrication of devices
US5545291A (en)*	1993-12-17	1996-08-13	The Regents Of The University Of California	Method for fabricating self-assembling microstructures
US5997861A (en)*	1994-10-31	1999-12-07	Burstein Laboratories, Inc.	Antiviral supramolecules containing target-binding molecules and therapeutic molecules bound to spectrin
US6265021B1 (en)*	1998-07-31	2001-07-24	International Business Machines Corporation	Nanoparticle structures utilizing synthetic DNA lattices
WO2001095375A1 (en)*	2000-06-06	2001-12-13	The Penn State Research Foundation	An electro-fluidic assembly process for integration of electronic devices onto a substrate
US6291266B1 (en)*	2000-11-29	2001-09-18	Hrl Laboratories, Llc	Method for fabricating large area flexible electronics
US6974604B2 (en)*	2001-09-28	2005-12-13	Hrl Laboratories, Llc	Method of self-latching for adhesion during self-assembly of electronic or optical components

2003
- 2003-01-15AUAU2003235633Apatent/AU2003235633A1/ennot_activeAbandoned
- 2003-01-15WOPCT/EP2003/000359patent/WO2003060995A2/enactiveIP Right Grant
- 2003-01-15DEDE50308112Tpatent/DE50308112D1/ennot_activeExpired - Lifetime
- 2003-01-15EPEP03729462Apatent/EP1464080B1/ennot_activeExpired - Lifetime

Also Published As

Publication number	Publication date
EP1464080A2 (en)	2004-10-06
WO2003060995A3 (en)	2004-03-04
AU2003235633A8 (en)	2003-07-30
WO2003060995A2 (en)	2003-07-24
EP1464080B1 (en)	2007-09-05
DE50308112D1 (en)	2007-10-18

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Legal Events

Date	Code	Title	Description
2004-10-07	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase

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