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AU2002351166A1 - Heat dissipating component using high conducting inserts - Google Patents

Heat dissipating component using high conducting inserts

Info

Publication number
AU2002351166A1
AU2002351166A1AU2002351166AAU2002351166AAU2002351166A1AU 2002351166 A1AU2002351166 A1AU 2002351166A1AU 2002351166 AAU2002351166 AAU 2002351166AAU 2002351166 AAU2002351166 AAU 2002351166AAU 2002351166 A1AU2002351166 A1AU 2002351166A1
Authority
AU
Australia
Prior art keywords
heat dissipating
dissipating component
thermal conductivity
thickness
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002351166A
Inventor
Gary G. Chen
Daniel W. Krassowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Graftech Inc
Original Assignee
Graftech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graftech IncfiledCriticalGraftech Inc
Publication of AU2002351166A1publicationCriticalpatent/AU2002351166A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element.
AU2002351166A2001-12-132002-11-27Heat dissipating component using high conducting insertsAbandonedAU2002351166A1 (en)

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
US10/015,4592001-12-13
US10/015,459US6758263B2 (en)2001-12-132001-12-13Heat dissipating component using high conducting inserts
PCT/US2002/038061WO2003052340A1 (en)2001-12-132002-11-27Heat dissipating component using high conducting inserts

Publications (1)

Publication NumberPublication Date
AU2002351166A1true AU2002351166A1 (en)2003-06-30

Family

ID=21771534

Family Applications (1)

Application NumberTitlePriority DateFiling Date
AU2002351166AAbandonedAU2002351166A1 (en)2001-12-132002-11-27Heat dissipating component using high conducting inserts

Country Status (9)

CountryLink
US (1)US6758263B2 (en)
EP (1)EP1454108B1 (en)
CN (1)CN100380087C (en)
AT (1)ATE460634T1 (en)
AU (1)AU2002351166A1 (en)
DE (1)DE60235647D1 (en)
DK (1)DK1454108T3 (en)
ES (1)ES2341643T3 (en)
WO (1)WO2003052340A1 (en)

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Also Published As

Publication numberPublication date
US20030116312A1 (en)2003-06-26
CN1620592A (en)2005-05-25
WO2003052340A1 (en)2003-06-26
EP1454108A4 (en)2006-04-19
US6758263B2 (en)2004-07-06
ES2341643T3 (en)2010-06-24
EP1454108A1 (en)2004-09-08
DE60235647D1 (en)2010-04-22
CN100380087C (en)2008-04-09
EP1454108B1 (en)2010-03-10
DK1454108T3 (en)2010-06-14
HK1078926A1 (en)2006-03-24
ATE460634T1 (en)2010-03-15

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