| HiSilicon | |
|---|---|
 | |
| Stato |  Cina |
| Forma societaria | Sussidiaria |
| Fondazione | 2004 |
| Sede principale | Shenzhen |
| Gruppo | Huawei |
| Settore | Informatico |
| Prodotti | SoCs |
| Sito web | www.hisilicon.com |
| Modifica dati su Wikidata ·Manuale | |
HiSilicon (海思S,HǎisīP) è una azienda di semiconduttorifabless cinese con sede aShenzhen,Cina; è interamente posseduta daHuawei[1].
HiSilicon ha acquisito licenze daARM Holdings per almeno i seguenti core:ARM Cortex-A9 MPCore,ARM Cortex-M3,ARM Cortex-A7 MPCore,ARM Cortex-A15 MPCore,[2][3]ARM Cortex-A53,ARM Cortex-A57 e anche per la GPUMali-T628 MP4.[4][5] HiSilicon ha anche acquisito licenze daVivante Corporation per il loro motore grafico GC4000. Viene ritenuta il più grande progettista dicircuiti integrati della Cina.[6] Produce isystem-on-a-chip "KIRIN" e "K3".
| Model Number | Fab | CPU | GPU | Memory Technology | GPS | wireless | Disponibile da | Dispositivi | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarcitettura | Cores | Frq (MHz) | Microarcitettura | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| K3V1 (Hi3611) | 130 nm | ARMv5 | ARM9E | 1 | 800 | 2009 | Babiken Vefone V1, Ciphone 5 (C5), T5355, IHTC HD-2, 5-inch Huawei UMPC | |||||||||
Il primo prodotto conosciuto di HiSilicon è il K3V2 usato nello smartphoneHuawei Ascend D Quad XL (U9510)[7] e nel tabletHuawei MediaPad 10 FHD7.[8] Questo chipset è basato su l'ARM Cortex-A9 MPCore fabbricato a 40 nm ed usa la GPUVivante GC4000 GPU a 16 core.[9]Il SoC supporta LPDDR2-1066, ma i prodotti effettivamente realizzati usano invece l'LPDDR-900 per avere un basso consumo di corrente.
| Model Number | Fab | CPU | GPU | Memory Technology | GPS | wireless | Disponibile da | Dispositivi | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| K3V2 (Hi3620) | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | N.D. | N.D. | N.D. | N.D. | 2012 | Huawei MediaPad 10 FHD,Huawei Ascend D2 (U9510),Huawei Honor 2 (U9508),Huawei Ascend P6S,Huawei Ascend P2,Huawei Ascend Mate,Lenovo A376,STREAM X (GSL07S)) |
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| K3V2E | 40 nm | ARMv7 | Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB | 4 | 1.5 | Vivante GC4000 | 480 MHz, 30.7 GFLOPS | LPDDR2 | 64-bit dual-channel | 7.2 (up to 8.5) | N.D. | N.D. | N.D. | N.D. | 2013 | Huawei Honor 3 |
• supporta - USB2 / 13MP / Codifica video 1080P
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| KIRIN 620 | 28 nm | ARMv8-A | Cortex-A53 | 8 | 1.2 GHz (A53) | Mali-450 MP4 | 700 MHz | LPDDR3 ( MHz) | 64-bit dual-channel | 12.8 | N.D. | DUAL SIM LTE Cat.4 (150 Mbit/s) | N.D. | N.D. | Q1 2015 | Huawei P8 Lite, Huawei X4, Huawei Honor 4C |
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| KIRIN 910 | 28 nm HPM | ARMv7 | Cortex-A9 | 4 | 1.6 | ARMMali-450 MP4 | 533 MHz | LPDDR3 | 32-bit single-channel | 6.4 | N.D. | LTE Cat.4 | N.D. | N.D. | H1 2014 | HP Slate 7 VoiceTab Ultra, Huawei MediaPad X1,[10] Huawei P6 S,[11] Huawei MediaPad M1,[12] Huawei Honor 3C 4G |
| KIRIN 910T | 1.8 | 700 MHz | LPDDR3 | 32-bit single-channel | 6.4 | N.D. | LTE Cat.4 | N.D. | N.D. | H1 2014 | Huawei Ascend P7 | |||||
• Il SoC KIRIN 920 contiene anche unprocessore di immagini che supporta fino a 32 Megapixel
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| KIRIN 920 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE | 4+4 | 1.7 GHz (A15) 1.3 GHz (A7) | Mali-T624 MP4 | 600 MHz[senza fonte] | LPDDR3 (1600 MHz) | 32-bit dual-channel | 12.8 | N.D. | LTE Cat.6 (300 Mbit/s) | N.D. | N.D. | H2 2014 | Huawei Honor 6[13] |
| KIRIN 925 | 28 nm HPM | ARMv7 | Cortex-A15 Cortex-A7 big.LITTLE | 4+4 | 1.8 GHz (A15) 1.3 GHz (A7) | Mali-T628 MP4 | LPDDR3 (1600 MHz) | 32-bit dual-channel | 12.8 | N.D. | LTE Cat.6 (300 Mbit/s) | N.D. | N.D. | Q3 2014 | Huawei Ascend Mate7, Huawei Honor 6 Plus | |
• supporta - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-Band a/b/g/n WI_FI / BT 4.0 Low Energy / USB2 / 32MP ISP / Codifica video 1080P
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| KIRIN 930 | 28 nm HPM | ARMv8-A | Cortex-A53e Cortex-A53 big.LITTLE | 4+4 | 2.0 GHz (A53e) 1.5 GHz (A53) | Mali-T628 MP4 | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | N.D. | DUAL SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) | N.D. | N.D. | Q1 2015 | Huawei MediaPad X2,Huawei P8 | |
| KIRIN 935 | 28 nm HPM | ARMv8-A | Cortex-A53e Cortex-A53 big.LITTLE | 4+4 | 2.2 GHz (A53e) 1.5 GHz (A53) | Mali-T628 MP4 | LPDDR3 (1600 MHz) | 64-bit dual-channel | 12.8 | N.D. | DUAL SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) | N.D. | N.D. | Q1 2015 | Huawei Honor 7,Huawei P8 MAX,Huawei Mate S | |
• supporta - SD 4.1 (UHS-I) / eMMC 5.1 / MU-MIMO ac WI_FI / BT 4.2 Smart / USB3.0 / 32MP ISP / Codifica video 4K
| Model Number | Fab | CPU | GPU | Memory Technology | Nav | wireless | Sampling Availability | Utilizing Devices | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitecture | Cores | Frq (GHz) | Microarchitecture | Frq (MHz) | Type | Bus width (bit) | Bandwidth (GB/s) | Cellular | WLAN | PAN | |||||
| KIRIN 940 | 16 nm FinFET Plus[14] | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE | 4+4 | 2.2 GHz (A72) 1.5 GHz (A53) | Mali-T860 | LPDDR4 | 64-bit dual-channel | 12.8 | N.D. | DUAL SIM LTE Cat.7 (DL:300 Mbit/s UP:100 Mbit/s) | N.D. | N.D. | Q3 2015 | ||
• supporta: - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Codifica video 10-bit 4K nativa / coprocessore i5 / Tensilica HiFi 4 DSP
| Modello | Fab | CPU | GPU | Tecnologia memoria | Nav | wireless | Disponibile da | Dispositivi | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitettura | Core | Frq (GHz) | Microarchitettura | Frq (MHz) | Tipo | Larghezza Bus (bit) | Banda (GB/s) | Reti cellulare | WLAN | PAN | |||||
| KIRIN 950 | 16 nm FinFET Plus | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE | 4+4 | 2.3 GHz (A72) 1.8 GHz (A53) | Mali-T880 MP4 | 900 MHz(122.4GFlops) | LPDDR4 | 64-bit dual-channel | 25.6GB/s | N.D. | DUAL SIM LTE Cat.10 (DL:450 Mbit/s UP:100 Mbit/s) | N.D. | N.D. | Q4 2015 | Huawei Mate 8, Honor 8, Honor V8 (KNT-AL10, KNT-TL10) |
| Kirin 955[15] | 16 nm FinFET Plus | ARMv8-A | Cortex-A72 Cortex-A53 big.LITTLE | 4+4 | 2.5 GHz (4 x A72) 1.8 GHz (4 x A53) | Mali-T880 MP4 | 900 MHz(122.4GFlops) | LPDDR3(3 GB)LPDDR4 (4 GB) | 64-bit dual-channel | 25.6 GB/s | N.D. | Dual SIM LTE Cat.6 | N.D. | N.D. | Q2 2016 | Huawei P9, Huawei P9 Plus, Honor V8 (KNT-AL20), Honor Note 8 |
| Modello | Fab | CPU | GPU | Tecnologia memoria | Nav | wireless | Disponibile da | Dispositivi | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Instruction set | Microarchitettura | Core | Frq (GHz) | Microarchitettura | Frq (MHz) | Tipo | Larghezza Bus (bit) | Banda (GB/s) | Reti cellulare | WLAN | PAN | |||||
| Kirin 960[16] | TSMC 16 nm FFC | ARMv8-A | Cortex-A73 Cortex-A53 big.LITTLE | 4+4 | 2.362 (A73) 1.844 (A53) | Mali-G71 MP8 | 1037 MHz (282GFlops) | LPDDR4-1800 | 64-bit(2x32-bit) Dual-channel | 29.8 | N.D. | Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO | N.D. | N.D. | Q4 2016 | Huawei Mate 9, Huawei Mate 9 Porsche Design, Huawei Mate 9 Pro, Honor V9, Huawei P10, Huawei P10 Plus, Honor 8 pro, Honor 9 |
Altri progetti
Wikimedia Commons contiene immagini o altri file suHiSilicon
| Huawei | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Smartphone |
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| Altro | EMUI · Huawei Symantec ·HiSilicon | ||||||||
