| Type | LGA-ZIF |
|---|---|
| Chip form factors | Flip-chip |
| Contacts | 1366 |
| FSB protocol | Intel QuickPath Interconnect |
| FSB frequency | 1× to 2×QuickPath |
| Processor dimensions | 45.07 mm × 42.57 mm[1] 1,912.5 mm² |
| Processors | Intel Core i7 (9xx series) Intel Xeon (35xx, 36xx, 55xx, 56xx series) |
| Predecessor | LGA 775 (high-end desktops and low-end servers) LGA 771 (low- and mid-end servers) |
| Successor | LGA 2011 (desktops, low- and mid-end servers) LGA 1356 (low-end, dual-processor servers) |
| Memory support | DDR3 |
This article is part of theCPU socket series | |
LGA 1366 (land grid array 1366), also known asSocket B,[2][3] is anIntelCPU socket. This socket supersedes Intel'sLGA 775 (Socket T) in the high-end and performance desktop segments. It also replaces the server-orientedLGA 771 (Socket J) in the entry level and is superseded itself byLGA 2011. This socket has 1,366 protruding pins which touch contact points on the underside of the processor (CPU)[4] and accesses up to three channels of DDR3 memory via the processor's internal memory controller.
Socket 1366 (Socket B) usesIntel QuickPath Interconnect (QPI) to connect the CPU to a reduced-functionnorthbridge that serves mainly as a PCI-Express controller. A slowerDMI is used to connect Intel's most recentnorthbridge and southbridge components. By comparison, Intel'sLGA 1156 (Socket H) moves the QPI link and PCI-Express controller onto the processor itself, using DMI to interface a single-component "chipset" (now calledPCH) that serves traditionalsouthbridge functions. The difference in pin number is mostly a reflection of the number of memory channels served.
In November 2008, Intel releasedCore i7, which was the first processor requiring this socket.
LGA 1366 socket and processors were discontinued sometime in early 2012,[5] having been superseded by theLGA 2011 andLGA 1356 socket, on 14 November 2011, supporting Sandy Bridge E-series processors. The accompanying LGA 1156 was discontinued at the same time, which was replaced byLGA 1155.
Socket B processors have the following mechanical maximum load limits which should not be exceeded during heatsink assembly, shipping conditions, or standard use. Load above those limits will crack the processor die and make it unusable. The limits are included in the table below.
| Location | Dynamic | Static |
|---|---|---|
| IHS Surface | 890N (200lbf; 90kp) | 266 N (60 lbf; 27 kp) |
Processors using this socket have a lower static load limit than previous models usingLGA 775. Available reference heat sinks include circular design and heatpipe design.[6]
The chipsets that support LGA 1366 are Intel'sX58 (desktop) and3400, 3420, 3450, 5500, 5520 and 7500 (server).