Movatterモバイル変換


[0]ホーム

URL:


Jump to content
WikipediaThe Free Encyclopedia
Search

LGA 1151

From Wikipedia, the free encyclopedia
Intel microprocessor compatible socket

LGA 1151
Release dateSeptember 1, 2015 (2015-09-01)
Designed byIntel
Manufactured byLotes
TypeLGA-ZIF
Chip form factorsFlip-chip
Contacts1151
FSB protocolPCI Express
Processors
PredecessorLGA 1150
SuccessorLGA 1200
Memory support

This article is part of theCPU socket series

LGA 1151,[1] also known asSocket H4, is a type ofzero insertion forceflip-chipland grid array (LGA)socket forIntel desktopprocessors which comes in two distinct versions: the first revision which supports both Intel'sSkylake[2] andKaby Lake CPUs, and the second revision which supportsCoffee Lake CPUs exclusively.

LGA 1151 is designed as a replacement for theLGA 1150 (known asSocket H3). LGA 1151 has 1151 protruding pins to make contact with the pads on the processor. TheFully Integrated Voltage Regulator, i.e. a voltage regulator which integrated on the CPU's die, introduced with Haswell and Broadwell, has again been moved to the motherboard.

Most motherboards for the first revision of the socket support solelyDDR4 memory,[1] a lesser number supportDDR3(L) memory,[3] and the least number have slots for bothDDR4 orDDR3(L) but only one memory type can be installed.[4] Some haveUniDIMM support, enabling either type of memory to be placed in the same DIMM, rather than having separate DDR3 and DDR4 DIMMs.[5] The second revision socket motherboards support only DDR4 memory.

Skylake, Kaby Lake, and Coffee Lake chipsets supportVT-d,Intel Rapid Storage Technology,Intel Clear Video Technology, andIntel Wireless Display Technology (an appropriate CPU is required). Most motherboards with the LGA 1151 socket support varying video outputs (DVI,HDMI 1.4 orDisplayPort 1.2 – depending on the model).VGA output isoptional since Intel dropped support for this video interface starting with Skylake.[6] HDMI 2.0 (4K@60 Hz) is only supported on motherboards equipped with Intel's Alpine Ridge Thunderbolt controller.[7]

Skylake, Kaby Lake, and Coffee Lake chipsets do not support the legacyconventional PCI interface; however, motherboard vendors may implement it using external chips.

Heatsink

[edit]

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's socketsLGA 1156,LGA 1155,LGA 1150, LGA 1151 andLGA 1200. Cooling solutions should therefore be interchangeable.

LGA 1151 revision 1

[edit]

DDR3 memory support

[edit]

Intel officially states[8][9] that Skylake's and Kaby Lake'sintegrated memory controllers (IMC) support DDR3L memory modules only rated at 1.35 V and DDR4 at 1.2 V, which led to the speculation that higher voltages of DDR3 modules could damage or destroy the IMC and processor.[10] Meanwhile,ASRock,Gigabyte, andAsus guarantee that their Skylake and Kaby Lake DDR3 motherboards support DDR3 modules rated at 1.5 and 1.65V.[11][12][13]

Skylake chipsets (100 series and C230 series)

[edit]
See also:Sunrise Point
H110B150Q150H170C236Q170Z170
OverclockingCPU (via BCLK[14] only;[15] might be disabled in new motherboards and BIOS releases[16]) + GPU + RAM (limited)CPU (multiplier + BCLK[14]) + GPU + RAM
Kaby Lake CPUs supportYes, after a BIOS update[17]
Coffee Lake CPUs supportNo
Memory supportDDR4 (max. 32 GB total; 16 GB per slot) or

DDR3(L) (max. 16 GB total; 8 GB per slot)[18][19]

DDR4 (max. 64 GB total; 16 GB per slot) or

DDR3(L) (max. 32 GB total; 8 GB per slot)[18][20]

MaximumDIMM slots24
MaximumUSB ports2.064
3.046810
MaximumSATA 3.0 ports4686
ProcessorPCI Express v3.0 configuration1 ×16Either 1 ×16; 2 ×8; or 1 ×8 and 2 ×4
PCH PCI Express configuration6 × 2.08 × 3.010 × 3.016 × 3.020 × 3.0
Independent Display Support
(digital ports/pipes)
3/23/3
SATARAID 0/1/5/10 supportNoYesIntel Rapid Storage Technology EnterpriseYes
IntelActive Management,Trusted Execution andvPro TechnologyNoYesNoYesNo
Chipset TDP6 W
Chipset lithography22 nm
Release dateSeptember 1, 2015[21][22]Q3'15[23]September 1, 2015[21][22]Q4'15[24]September 1, 2015[21][22]August 5, 2015[25]

Kaby Lake chipsets (200 series)

[edit]
See also:Union Point (chipset)

There is no equivalent Kaby Lake chipset analogous to the H110 chipset. Four additional PCH PCI-E lanes in Kaby Lake chipsets are reserved for implementing an M.2 slot to support Intel Optane Memory. Otherwise, corresponding Kaby Lake and Skylake chipsets are practically the same.[26]

Light blue indicates a difference between comparable Skylake and Kaby Lake chipsets.

B250Q250H270Q270Z270
OverclockingNo[27]CPU (multiplier + BCLK[28]) + GPU + RAM
Skylake CPUs supportYes
Coffee Lake CPUs supportNo
Memory supportDDR4 (max. 64 GB total; 16 GB per slot) or

DDR3(L) (max. 32 GB total; 8 GB per slot)[29]

MaximumDIMM slots4
MaximumUSB ports2.064
3.06810
MaximumSATA 3.0 ports6
ProcessorPCI Express v3.0 configuration1 ×16Either 1 ×16; 2 ×8; or 1 ×8 and 2 ×4
PCH PCI Express configuration12 × 3.014 × 3.020 × 3.024 × 3.0
Independent Display Support
(digital ports/pipes)
3/3
SATARAID 0/1/5/10 supportNoYes
IntelActive Management,Trusted Execution andvPro TechnologyNoYesNo
Intel Optane Memory SupportYes, requires Core i3/i5/i7 CPU[30]
Chipset TDP6 W[31]
Chipset lithography22 nm[31]
Release dateJanuary 3, 2017[32]

LGA 1151 revision 2

[edit]

Second revision of the LGA 1151 socket for Coffee Lake CPUs

[edit]

The LGA 1151 socket was revised for theCoffee Lake generation CPUs and comes along with the Intel 300-series chipsets.[33] While physical dimensions remain unchanged, the updated socket reassigns some reserved pins, adding power and ground lines to support the requirements of 6-core and 8-core CPUs. The new socket also relocates the processor detection pin, breaking compatibility with earlier processors and motherboards. As a result, desktopCoffee Lake CPUs are officially not compatible with the 100 (original Skylake) and 200 (Kaby Lake) series chipsets.[34] Similarly, 300 series chipsets officially only support Coffee Lake and are not compatible with Skylake and Kaby Lake CPUs.

Socket 1151 rev 2 is sometimes also referred to as "1151-2".

Coffee Lake chipsets (300 series and C240 series)

[edit]

Like with Kaby Lake chipsets, four additional PCH PCI-E lanes in Coffee Lake chipsets are reserved for implementing an M.2 slot to support Intel Optane Memory.

There's a 22 nm version of H310 chipset, H310C, which is sold only in China.[35] Motherboards based on this chipset support DDR3 memory as well.

H310B365B360H370C246Q370Z370Z390
OverclockingNoCPU (multiplier + BCLK[36]) + GPU + RAM
Skylake/Kaby Lake CPUs supportNo
Coffee Lake (8th gen) CPUs supportYes
Coffee Lake Refresh (9th gen) CPUs supportYes with BIOS updateYesYes with BIOS updateYes
Memory [DDR4]

by Coffee Lake

generation

8th genMax. 32 GB total; 16 GB per slotMax. 64 GB total; 16 GB per slot
9th genMax. 64 GB total; 32 GB per slotMax. 128 GB total; 32 GB per slot[37]
MaximumDIMM slots24
Maximum USB 2.0 ports10141214
Maximum

USB 3.1 ports configuration

Gen14 Ports8 Ports6 Ports8 Ports10 Ports
Gen2N/AUp to 4 PortsUp to 6 PortsN/AUp to 6 Ports
MaximumSATA 3.0 ports4686
ProcessorPCI Express v3.0 configuration1 ×16Either 1 ×16; 2 ×8; or 1 ×8 and 2 ×4
PCH PCI Express configuration6 × 2.020 × 3.012 × 3.020 × 3.024 × 3.0
Independent Display Support (digital ports/pipes)3/23/3
Integrated Wireless (802.11ac)Yes**NoYes**NoYes**
SATARAID 0/1/5/10 supportNoYesNoYesIntel Rapid Storage Technology EnterpriseYes
Intel Optane Memory SupportNoYes, requires Core i3/i5/i7/i9 CPUYes, requires Core i3/i5/i7/i9 or Xeon E CPUYes, requires Core i3/i5/i7/i9 CPU
Intel Smart Sound TechnologyNoYes
Chipset TDP6 W[38][39][40][41][42][43][44][45]
Chipset lithography14 nm[38]22 nm[39]14 nm[40][41][42][43]22 nm[44]14 nm[45]
Release dateApril 2, 2018[46]Q4'18April 2, 2018October 5, 2017[47]October 8, 2018[48]

** depends on OEM's implementation

See also

[edit]

References

[edit]
  1. ^abCutress, Ian (August 5, 2015)."Intel Skylake Z170 Motherboards: A Quick Look at 55+ New Products".AnandTech. RetrievedAugust 5, 2015.
  2. ^"MSI Z170A GAMING M7 (Intel LGA-1151) Review".TechpowerUp. August 5, 2015. RetrievedAugust 5, 2015.
  3. ^"GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0)".Gigabyte. RetrievedSeptember 7, 2015.
  4. ^"ASRock > B150M Combo-G".ASRock. RetrievedSeptember 15, 2015.
  5. ^Cutress, Ian (August 5, 2015)."The Intel 6th Gen Skylake Review: Core i7-6700K and i5-6600K Tested".AnandTech. RetrievedAugust 5, 2015.
  6. ^"Intel® Core™ i7-6700K Processor (8M Cache, up to 4.20 GHz)".intel. RetrievedAugust 6, 2015.
  7. ^Cutress, Ian (August 5, 2015)."Intel Skylake Z170 Motherboards: A Quick Look at 55+ New Products".AnandTech. RetrievedAugust 6, 2015.
  8. ^"Intel® Core™ i7-6700K Processor (8M Cache, up to 4.20 GHz) Specifications".Intel. RetrievedFebruary 6, 2016.
  9. ^"Intel® Core™ i7-7700K Processor (8M Cache, up to 4.50 GHz) Product Specifications".Intel. RetrievedAugust 7, 2017.
  10. ^Sexton, Michael Justin Allen (September 28, 2015)."Skylake's IMC Supports Only DDR3L".Tom's Hardware. RetrievedSeptember 29, 2015.
  11. ^"GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0)".Gigabyte. RetrievedFebruary 6, 2016.
  12. ^"Fatal1ty Z170 Gaming K4/D3 Memory Support List".ASRock. RetrievedFebruary 6, 2016.
  13. ^Günsch, Michael (August 5, 2015)."Skylake-Mainboards: Asus präsentiert Z170-Platinen mit DDR3 bis 1,65 Volt".ComputerBase (in German). RetrievedFebruary 6, 2016.
  14. ^abCutress, Ian (August 5, 2015)."The Intel 6th Gen Skylake Review: Core i7-6700K and i5-6600K Tested".AnandTech. RetrievedSeptember 18, 2015.
  15. ^"Asus H170-PLUS D3 Manual"(PDF).ASUS. RetrievedSeptember 18, 2015.
  16. ^Ung, Gordon (February 8, 2016)."It's official: Intel shuts down the cheap overclocking party by closing Skylake loophole".PCWorld. RetrievedFebruary 9, 2016.
  17. ^Wilson, Matthew (October 6, 2016)."MSI and Asus update motherboards with Kaby Lake support".KitGuru. RetrievedNovember 3, 2016.
  18. ^abShilov, Anton (May 22, 2015)."Intel bids adieu to DDR3: Majority of 'Skylake-S' mainboards to use DDR4".KitGuru. RetrievedMay 25, 2015.
  19. ^"GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0)".Gigabyte. RetrievedSeptember 7, 2015.
  20. ^"GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0)".Gigabyte. RetrievedSeptember 7, 2015.
  21. ^abcSexton, Michael Justin Allen (September 2, 2015)."Asus Announces 10 New Motherboards Based On Latest 100-Series Intel Chipsets".Tom's Hardare. RetrievedOctober 3, 2015.
  22. ^abc"ASUS Announces H170, B150, H110 and Q170 Motherboard Series".ASUS. RetrievedOctober 3, 2015.
  23. ^"Intel® Q150 Chipset (Intel® GL82Q150 PCH) Specifications".Intel. RetrievedDecember 26, 2015.
  24. ^"Intel® C236 Chipset (Intel® GL82C236 PCH) Specifications".Intel. RetrievedDecember 26, 2015.
  25. ^"Intel Unleashes Next-Gen Enthusiast Desktop PC Platform at Gamescom".Intel Newsroom. August 5, 2015. RetrievedAugust 5, 2015.
  26. ^Shrout, Ryan (January 3, 2017)."The Intel Core i7-7700K Review - Kaby Lake and 14nm+ | Z270 Chipset and ASUS Maximus IX Code".PC Perspective. Archived fromthe original on February 6, 2019. RetrievedJanuary 26, 2017.
  27. ^Wallossek, Igor; Alcorn, Paul (January 3, 2017)."Intel Kaby Lake: Z270, Optane, Overclocking & HD Graphics 630".Tom's Hardware. RetrievedJanuary 18, 2017.
  28. ^Soderstrom, Thomas (November 29, 2016)."Overclocking Intel's Core i7-7700K: Kaby Lake Hits The Desktop!".Tom's Hardware. RetrievedJanuary 18, 2017.
  29. ^"B150M-C D3 | Motherboards".ASUS. RetrievedMay 17, 2017.
  30. ^"Intel® Optane™ Memory".Intel. RetrievedJanuary 18, 2017.
  31. ^ab"Intel® Z270 Chipset Specifications".Intel® ARK (Product Specs). RetrievedJanuary 18, 2017.
  32. ^Shenoy, Navin (January 3, 2017)."Get Ready for the Best New PCs for the New Year with New 7th Generation Intel Core Processors".Intel Newsroom. RetrievedJanuary 18, 2017.
  33. ^Cutress, Ian (October 5, 2017)."The AnandTech Coffee Lake Review: Initial Numbers on the Core i7-8700K and Core i5-8400".AnandTech. RetrievedOctober 5, 2017.
  34. ^Cutress, Ian (August 21, 2017)."Intel Launches 8th Generation Core CPUs, Starting with Kaby Lake Refresh for 15W Mobile".AnandTech. RetrievedAugust 22, 2017.
  35. ^Tyson, Mark (September 20, 2018)."Intel tech roll back: it is fabbing the new H310C chipset at 22nm".Hexus. RetrievedJanuary 13, 2019.
  36. ^Soderstrom, Thomas (November 5, 2017)."ASRock Z370 Taichi Benchmarks & Rating".Tom's Hardware. RetrievedApril 3, 2018.
  37. ^Cutress, Ian (October 15, 2018)."Intel to Support 128GB of DDR4 on Core 9th Gen Desktop Processors".AnandTech. RetrievedOctober 23, 2018.
  38. ^ab"Intel® H310 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  39. ^ab"Intel® B365 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  40. ^ab"Intel® B360 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  41. ^ab"Intel® H370 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  42. ^ab"Intel® C246 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  43. ^ab"Intel® Q370 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  44. ^ab"Intel® Z370 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  45. ^ab"Intel® Z390 Chipset Product Specifications".Intel. RetrievedMay 9, 2023.
  46. ^Alcorn, Paul (April 3, 2018)."Intel Adds To Coffee Lake CPU Family, Outs New 300-Series Chipsets".Tom's Hardware. RetrievedApril 3, 2018.
  47. ^Cutress, Ian (October 5, 2017)."The AnandTech Coffee Lake Review: Initial Numbers on the Core i7-8700K and Core i5-8400".AnandTech. RetrievedApril 3, 2018.
  48. ^Cutress, Ian (October 8, 2018)."Intel Announces 9th Gen Core CPUs: Core i9-9900K (8-Core), i7-9700K, & i5-9600K".AnandTech. RetrievedOctober 8, 2018.
Desktop sockets
Slot
PGA
  • 370 (1998–2001)
  • 423 (W 2000–2001)
  • 478 (N 2001–2004)
LGA
Mobile sockets
Server sockets
Xeon processors
Slot
PGA
  • 603 (2001–2004)
  • 604 (2002–2007)
LGA
Itanium processors
Pre-Pentium IIPGA Sockets
Retrieved from "https://en.wikipedia.org/w/index.php?title=LGA_1151&oldid=1269880676"
Categories:
Hidden categories:

[8]ページ先頭

©2009-2025 Movatter.jp