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| CXMT | |
Native name | 长鑫存储技术有限公司 |
Romanized name | Zhǎngxīn Cúnchú Jìshù Yǒuxiàn Gōngsī |
| Formerly | Innotron Memory Hefei Chang Xin Hefei Rui-li Integrated Circuit Manufacturing |
| Company type | Private |
| Industry | Semiconductors |
| Founded | May 2016; 9 years ago (2016-05) |
| Headquarters | , China |
Key people | Zhu Yiming (Chairman & CEO) |
| Products | DRAM |
Number of employees | 3,000 (2019) |
| Website | www |
ChangXin Memory Technologies (CXMT;Chinese:长鑫存储;pinyin:zhǎngxīn cúnchú)[a] is a Chinese semiconductorintegrated device manufacturer headquartered inHefei,Anhui, specializing in the production ofDRAM memory.
As of 2020[update], ChangXin manufacturedLPDDR4 andDDR4 memory on a 19 nmprocess, with a capacity of 40,000 wafers per month.[1] The company was producing 720,000 wafers per quarter by the end of 2025.[2]
Together withFujian Jinhua Integrated Circuit (JHICC) and Xi'an UniIC Semiconductors, Innotron was one of a set of Chinesesemiconductor plants established in 2016 to compete with global manufacturers of computer memory.[3][4][5] In 2017, a $7.2 billion deal for a 125,000, 12" (300mm) wafer per month production fabrication plant was announced.[6] Innotron's factory was completed by the middle of 2017,[4] and production equipment was installed at the plant in late 2017. Trials and mass production were scheduled for late 2018 and early 2019.[7][8] In 2018, CEO Zhu Yiming was reported to have visitedASML to discuss the purchase ofextreme ultraviolet lithography machines.[8]
Initially, Innotron was thought to have chosen 8GBLPDDR4 memory as its first product. At the time, analysts claimed thatpatent and IP issues would present a barrier to its competing with major manufacturers.[4] In the middle of 2018, trial production of 19 nm 8GB LPDDR4 was reported to have begun.[9] Innotron's initial capacity was ~20,000 wafers per month; a small output in terms of the industry as a whole.[3]
In 2019, Innotron, which had changed its name toChangxin Memory Technologies, was reported to have made some design changes in an attempt to avoid possible technology-related sanctions deriving from theChina–United States trade war.[10] In December 2019, in an interview withEE Times, the company stated its first fab was in production and producing 20,000 wafers per month, making 8GB LPDDR4 and DDR4 DRAM at 19 nm.[11]
The company is reported to have increased production to 6% of the world DRAM output as of Q1 2025 with aim to increase to 10% by Q4 2025.[12] It started sellingDDR5 SDRAM around the start of 2025.[13]
In 2022, theJames M. Inhofe National Defense Authorization Act for Fiscal Year 2023 banned the U.S. federal government from buying or using chips from CXMT.[14] In March 2024,Bloomberg News reported that theUnited States Department of Commerce'sBureau of Industry and Security was weighing sanctions on CXMT.[15]
As of 2019, CXMT had over 3,000 employees, and runs a fab with a 65,000 square meters clean room space.[citation needed] Over 70% of its employees are engineers working on various research and development related projects. CXMT uses its 10G1 process technology (aka 19 nm) to make 4 Gb (gigabit) and 8 GbDDR4 memory chips. It has licensed intellectual property originally created byQimonda.[16]
LPDDR4 RAM was added to the product portfolio in 2020.[17]
