![]() The A6X chip used in the fourth-generation iPad | |
General information | |
---|---|
Launched | November 2, 2012 |
Discontinued | October 16, 2014 |
Designed by | Apple Inc. |
Common manufacturer | |
Product code | S5L8955X |
Performance | |
Max.CPUclock rate | 1.4 GHz[1] |
Cache | |
L1cache | 32 KB instruction + 32 KB data[2] |
L2 cache | 1 MB[3] |
Architecture and classification | |
Application | Mobile |
Technology node | 32 nm.[4] |
Microarchitecture | Swift[1] |
Instruction set | ARMv7-A:[1]ARM,Thumb-2 with "armv7s" extensions (integer division, VFPv4, Advanced SIMDv2)[5] |
Physical specifications | |
Cores |
|
GPU | PowerVR SGX554MP4 (quad-core)[1] |
Products, models, variants | |
Variant | |
History | |
Predecessor | Apple A5X |
Successor | Apple A7(APL5698 variant) |
TheApple A6X is a32-bitsystem-on-a-chip (SoC) designed byApple Inc., part of theApple silicon series. It was introduced with and only used in the4th generation iPad, on October 23, 2012. It is a high-performance variant of theApple A6 and the last 32-bit chip Apple used on an iOS device before Apple switched to64-bit. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, theApple A5X.[6] Software updates for the 4th generation iPad ended in 2019 with the release ofiOS 10.3.4 for cellular models, thus ceasing support for this chip as it was discontinued with the release ofiOS 11 in 2017.
The A6X features a 1.4 GHz custom Apple-designedARMv7-A architecture baseddual-core CPU called Swift,[1] introduced in theApple A6.[7] It includes an integrated quad-corePowerVR SGX554MP4graphics processing unit (GPU)[1] running at 300 MHz[citation needed] and a quad-channelmemory subsystem.[1] The memory subsystem supports LPDDR2-1066 DRAM, increasing the theoretical memory bandwidth to 17 GB/s.[3]
Unlike theA6, but similar to theA5X, the A6X is covered with a metalheat spreader, includes no RAM, and is not apackage-on-package (PoP) assembly. The A6X is manufactured bySamsung on aHigh-κmetal gate (HKMG) 32 nm process. It has a die with an area of 123 mm2, 30% larger than the A6.[4]