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| Company type | Corporation |
|---|---|
| Industry | Semiconductors |
| Founded | 1987; 39 years ago (1987) |
| Headquarters | Taichung,Taiwan |
Key people | Arthur Yu-Cheng Chiao (Chairman &CEO) Tung-Yi Chan (President) |
| Products |
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| Website | www |
Winbond Electronics Corporation (Chinese:華邦電子公司;pinyin:Huábāng Diànzǐ Gōngsī) is aTaiwan-based corporation founded in 1987. It producessemiconductors and several types ofintegrated circuits (ICs) includingdynamic random-access memory,static random-access memory,serial flash,microcontrollers, andSuper I/O chips.
Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.[citation needed]
Winbond was established in 1987 inHsinchu Science Park in Taiwan.[1][2] Its founder came from theIndustrial Technology Research Institute.[3] From 1987 to 1988J.J Pan and Partners designed and constructed afabrication plant known asIC Wafer Fab I Plant. This facility would produce 6 inchwafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond calledIC Wafer Fab II Plant.[4]
In 1992 Winbond joined the PrecisionRISC Organization and licensedHP'sPA-RISC architecture to design and manufacture chips forX terminals and printers.[5]
Winbond acquired affiliated chipset makerSymphony Laboratories, ofSan Jose, California, in October 1995.[6]
Winbond was affected by power cuts caused by the1999 Jiji earthquake forcing the company to pause manufacturing.[7] By 2002 Winbond had 4,000 employees.[1] In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees.[8] In August 2004,Infineon announced a deal with Winbond to build a factory to make DRAM.[9]
The computer IC,consumer electronics IC, and logic product foundry divisions of Winbond were spun off asNuvoton Technology Corporation on 1 July 2008.[citation needed]
In 2010 Winbond was manufacturingDDR2 DRAM using technology licensed fromQimonda.[10]
In 2019Karamba Security partnered with Winbond to make secure embedded flash products.[11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium.[12]
| Semiconductors |
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| Computers |
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| Defunct | |||||||||||
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