• Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2013
  • OSA Technical Digest (online) (Optica Publishing Group, 2013),
  • paper OW3D.5
  • https://doi.org/10.1364/OFC.2013.OW3D.5
OFC

Heterogeneous Photonic Integration for Microwave Photonic Applications

Gregory Fish

Author Information
Author Affiliations

Gregory Fish*

Aurrion Inc, 130 Robin Hill Road, Suite 300, Goleta, CA 93117, USA

*Corresponding author:greg.fish@aurrion.com

Optical Fiber Communication Conference 2013

From the session
Microwave Integrated Photonics (OW3D)

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Abstract

As the component count rises in photonic systems, photonic integration becomes increasingly attractive from a cost, power consumption, and footprint perspective due to the ability to reduce the on-chip to off-chip interfaces and simplify packaging. Although photonic integration has been investigated in many forms over the last decade, the incompatibility of passive and active devices in standard integration platforms has limited their use in both military and commercial systems. In this talk, we review the advances in a heterogeneous silicon integration platform that provides state of the art active and passive devices integrated on silicon substrates for microwave systems-on-chip.

© 2013 Optical Society of America

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More Like This
Heterogeneous Integration on Silicon Photonics

Alexander W. Fang, Brian R. Koch, Jae Shin, Erik J. Norberg, Eric Hall, and Gregory Fish
TuN3_1 Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2013

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