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| Names | |
|---|---|
| Preferred IUPAC name 2-Diazonaphthalen-1(2H)-one | |
| Other names 1,2-Naphthoquinone diazide | |
| Identifiers | |
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3D model (JSmol) | |
| ChemSpider |
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| Properties | |
| C10H6N2O | |
| Molar mass | 170.171 g·mol−1 |
Except where otherwise noted, data are given for materials in theirstandard state (at 25 °C [77 °F], 100 kPa). | |
Diazonaphthoquinone (DNQ) is adiazo derivative ofnaphthoquinone. Upon exposure to light, DNQ converts to a derivative that is susceptible to etching. In this way, DNQ has become an important reagent in photoresist technology in the semiconductor industry.[1]
Diazonaphthoquinone sulfonic acid esters are components of commonphotoresist materials. Such photoresists are used in the manufacture of semiconductors.[2][3][4] In this application DNQs are mixed withNovolac resin, a type ofphenolicpolymer. The DNQ functions as a dissolution inhibitor. During the masking/patterning process, portions of the photoresist film are exposed to light while others remain unexposed. In the unexposed regions of the resist film, the DNQ acts as a dissolution inhibitor and the resist remains insoluble in the aqueous base developer. In the exposed regions, the DNQ forms aketene, which, in turn, reacts with ambient water to form a base soluble indene carboxylic acid. The exposed regions of the photoresist film become soluble in aqueous base; thus allowing the formation of a relief image during development.
Upon photolysis, DNQ undergoes aWolff rearrangement to form a ketene. The ketene adds water to formindene-carboxylic acid.[5]
