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.2023 Apr 3;23(7):3695.
doi: 10.3390/s23073695.

Thin and Scalable Hybrid Emission Filter via Plasma Etching for Low-Invasive Fluorescence Detection

Affiliations

Thin and Scalable Hybrid Emission Filter via Plasma Etching for Low-Invasive Fluorescence Detection

Erus Rustami et al. Sensors (Basel)..

Abstract

Hybrid emission filters, comprising an interference filter and an absorption filter, exhibit high excitation light rejection performance and can act as lensless fluorescent devices. However, it has been challenging to produce them in large batches over a large area. In this study, we propose and demonstrate a method for transferring a Si substrate, on which the hybrid filter is deposited, onto an image sensor by attaching it to the sensor and removing the substrate via plasma etching. Through this method, we can transfer uniform filters onto fine micrometer-sized needle devices and millimeter-sized multisensor chips. Optical evaluation reveals that the hybrid filter emits light in the 500 to 560 nm range, close to the emission region of green fluorescent protein (GFP). Furthermore, by observing the fluorescence emission from the microbeads, a spatial resolution of 12.11 μm is calculated. In vitro experiments confirm that the fabricated device is able to discriminate GFP emission patterns from brain slices.

Keywords: contact imaging; emission filter; fluorescent imaging; image sensor; implantable device; optical filter fabrication.

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Conflict of interest statement

The authors declare that there are no conflict of interest related to this article.

Figures

Figure 1
Figure 1
Schematic of the thin and scalable hybrid filter fabrication using the plasma etching technique.
Figure 2
Figure 2
(a) Schematic of the hybrid filter fabrication using the plasma etching technique. (b) Photograph of the image sensor assembled with the designated printed circuit board.
Figure 3
Figure 3
Photographs of the image sensor before and after filter deposition. (a) After etching, the multisensor area in the chip is flawlessly covered by a hybrid filter. The enlarged image shows the Si remaining on the filter post-etching (black dots). (b) Uniform hybrid filter covering the entire area of the needle-type sensor after etching.
Figure 4
Figure 4
(a) Filter transmission spectra compared with the green fluorescence protein (GFP) emission on a logarithmic scale. (b) Transmission spectra of the interference filter with the various angles of incidence. (c) Transmission spectra of the hybrid filter with the various angles of incidence.
Figure 5
Figure 5
(a) Photograph of the microbead emission captured by the needle sensor. (b) Enlarged image of the ROI, denoted with a yellow square on (a) the merged beads in the upper left corner and the separated beads in the lower right corner; this image is compared with the microscope image (c). (d) Single-microbead emission intensity in the vertical direction, plotted and fitted with the Gaussian distribution. The FWHM is 12.11 μm. (e) Two close microbeads can be distinguished, as the distance between them is almost twice the FWHM.
Figure 6
Figure 6
Fluorescent image from a brain slice captured by the needle sensor integrated with the hybrid filter. Owing to the narrow excitation light, four different irradiation spots (1–4) are required to excite all the sensor imaging areas. These images are merged for a large FOV by simple image processing. An ROI of the merged image, denoted by the dashed square, is enlarged and compared with the image obtained by the fluorescence microscope.
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