Maurizio Di Paolo Emilio

Gallium Nitride (GaN) power devices are seeing increasing usage across a range of low to medium-power applications including mobile device power adapters, data center power supplies, and e-mobility. The lateral high electron mobility transistor (HEMT) is commonly used. Extending the application range of GaN power devices to higher voltage and power may necessitate the use of the favored vertical geometry. In this article, we will summarize work done by a group from Osaka University, Japan on the GaN substrate and vertical device process flow as well as their physical and electrical characterization. #GaN

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IEEE Xplore

📘 In the August 2025 issue of IEEE Journal of Solid-State Circuits, read about a compact 90-180 GHz, 15-18 dBm power amplifier with novel self-shielding load-open Balun and broadband fourth-order LC ladder power combiner in 28-nm CMOS, and more!🔗 Read more: https://loom.ly/qQZEdMM💻 Learn more about IEEE journal subscription options here: https://loom.ly/aex2hyA#IEEE #IEEEXplore #IEEEJournals #SolidStateCircuits #Circuits #Engineering IEEE Solid-State Circuits Society

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Thomas Coughlin

Data centers need storage and memory to provide the data needed for AI training and inference. Kioxia will be showing their high capacity PCIe 5.0 SSD and Pliops will be showing their shared storage used to improve LLM inference performance.

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Global 5G Evolution

Keysight Technologies's new eBook explores the fundamentals of 6G, highlighting key technologies- Terahertz frequencies, AI/ML, RIS. Which of these technologies do you believe will have the biggest impact on the future of wireless communication?"Next-Generation Wireless: A Guide to the Fundamentals of 6G" is designed to provide an overview of the key concepts & technologies driving the development of 6G⛲✧˖°〃🐋⋆⋆🫧⋆｡˚⋆🧿Key 6G Technologies🧊Terahertz (THz) Frequencies: Exploration of the use of higher frequency bands (above 100 GHz) to achieve higher data rates & lower latency. This includes THz channel characteristics, propagation challenges, potential applications🧊AI & ML: The role of AI/ML in network optimization, resource management, security, other aspects of 6G. This includes AI-native air interfaces & intelligent network management 🧊Reconfigurable Intelligent Surfaces (RIS): The use of smart surfaces to control the propagation of radio waves, improving coverage, capacity, energy efficiency🧊Integrated Sensing & Communication (ISAC): The convergence of communication & sensing functionalities, enabling new applications in areas like environmental monitoring, industrial automation, autonomous driving🧊Advanced Multiple Input Multiple Output (MIMO): Further advancements in MIMO technologies, such as massive MIMO & cell-free MIMO, to improve spectral efficiency & network capacity🧊Network Slicing & Edge Computing: Enhanced network slicing capabilities to support diverse use cases with varying requirements & the integration of edge computing to reduce latency & enable local processing of data🧊Security Considerations: Addressing the security challenges posed by the new technologies & architectures of 6G🧿6G Use Cases: Potential applications of 6G, such as:🧊Extended Reality (XR): Immersive experiences like VR & AR with ultra-high data rates & low latency🧊Digital Twins: Creating virtual replicas of physical systems for simulation, optimization, control🧊Holographic Communications: Enabling realistic 3D holographic projections for communication & collaboration🧊Connected Robotics & Automation: Advanced automation in industries like manufacturing, logistics, healthcare 🧿Testing & Measurement Challenges: Given Keysight's focus on test measurement solutions, the eBook discusses the challenges associated with testing 6G technologies, particularly at THz frequencies, how these challenges can be addressed🧿Standardization & Future Outlook: Discussion on the ongoing standardization efforts for 6G & future direction of R&D˖°𓇼🌊⋆🫧💟 To gain monthly insights on #technology & #innovations, subscribe to #global5gevolution newsletter (https://lnkd.in/ge9gsyjE) & tune in for latest edition on “5G-Advanced”💟 Or subscribe to #global5gevolution YouTube channel (https://lnkd.in/g8M7YvKq) & tune in for latest episode “Industry5.0 ORAN Rel19 IoT”; click comment box 💟 Follow us on Kaneshwaran Govindasamy & Global 5G Evolution

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Keysight Technologies

As data centers evolve, so must your approach to 1.6T Ethernet #validation. This white paper unpacks the testing methodologies and #automation tools that simplify #interconnect performance analysis and ensure reliable deployment.Access the paper and discover how to validate with confidence using Keysight’s INPT-1600GE and ITS software: https://ow.ly/TQVi50WyQmc

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Semiconductor Engineering

A chiplet economy requires standards, organization, and tools — and that’s a problem.By Brian Bailey.https://lnkd.in/gaHtXCDd#chiplets #semiconductor #HBM #3DIC #EDA #UCIeVidya Neerkundar Mark Kuemerle Marvell Technology Siemens Digital Industries Software Benjamin Prautsch Fraunhofer IIS, Division Engineering of Adaptive Systems Mayank Bhatnagar Cadence Marc Swinnen Ansys Abhijeet Chakraborty Synopsys Inc Takeo Tomine Bob Patti NHanced Semiconductors, Inc. Pratyush Kamal TSMC Rozalia Beica Rapidus Corporation

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KIOXIA America, Inc.

BREAKING NEWS!!! KIOXIA Broadens 8th Generation BiCS FLASH SSD Portfolio with High-Performance Data Center NVMe SSDs to Maximize GPU Utilization in AI and HPC Workloads - KIOXIA CD9P Series PCIe 5.0 SSDs - See the full press release here: https://lnkd.in/gKJJUibQ

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ESI Group

#SafetyFirst 🚜 Keysight's #VirtualProvingGround for #EVSafety development represents a uniform environment to assess and virtually qualify a design long before a single physical validation prototype is built. Learn more: https://hubs.ly/Q03Cw32q0#SimulationX #SystemSimulation #VirtualPrototyping

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Jeff Child

Check out our All About Circuits article by Duane Benson. Announced today, Silicon Labs newest SoC increases small-device edge computing performance while reducing cost and power consumption to deliver a 10-year operating life with a coin cell. https://lnkd.in/eeMsEMMY

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StorageReview.com

Broadcom is pushing Ethernet deeper into AI fabrics. The new Thor Ultra NIC is UEC compliant at 800G and targets clusters that scale to 100k XPUs with tight latency control and stronger congestion management.Key takeaways• 800G per host link designed for high fan-in and east-west AI traffic• UEC compliance aimed at predictable latency and lossless behavior at scale• Advanced congestion control and telemetry for stable multi-tenant fabrics• Accelerator aware offloads to keep GPUs and XPUs fed without CPU penalty• Built for very large clusters with reliability, observability, and serviceability in mindRead the full story:https://lnkd.in/gWeNcDYb#Broadcom #UEC #Ethernet #AIFabrics #Networking #DataCenter #AIInfrastructure #StorageReview Broadcom

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Raj Yavatkar

In the realm of high-bandwidth, low-energy optical connectivity, a groundbreaking advancement is underway. Enter a laser-free optical interconnect leveraging micro-LEDs as the light source. Picture a scenario where numerous blue microLEDs are intricately connected to a photodetector array via multicore imaging fibers, facilitating data transmission speeds exceeding 1.6Tbps, all achieved at an incredibly low power consumption of 1-1.5pJ/bit. The spotlight shines on Avicena Tech, a Sunnyvale, CA startup, as semiconductor manufacturing giant TSMC aligns its support behind this innovative microLED-based connectivity initiative.Explore the full story in the recent IEEE Spectrum article: https://lnkd.in/gDPGUNyh Bardia PezeshkiChris PfistnerRob Kalman

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Samuel K. Moore

New, nanosheet transistors seem to be delivering everything Mukesh Khare, Peide Ye, and Thomas Ernst promised they would when they described them in Spectrum in 2019. In research reported last week at #ISSCC2025, #Intel and #TSMC both used them to shrink SRAM (critical processor memory circuits). At the same time #Synopsys showed that there are new ways to shrink SRAM using the transistor nanosheets seek to replace.https://lnkd.in/eRqJ5G7j

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Dylan Martin

Ampere Computing is hoping to grow its Arm CPU business by enticing more channel partners to work with the chip designer through its new Systems Builders program, which seeks to create more flexibility and lower costs for AI and cloud computing infrastructure. Unveiled Thursday, the Ampere Systems Builders program is bringing together several IT infrastructure players, including U.S.-based Supermicro, to speed up the development and delivery of server platforms for AI and cloud-native computing, with a focus on using standards such as the Open Compute Project’s data center modular hardware system (DC-MHS) to drive “interoperability, customization and faster time to market.”The other companies participating in Ampere’s program include Giga Computing, the server arm of Taiwanese electronics giant Gigabyte, as well as Pegatron-owned ASRock Rack in Taiwan and U.S.-based Jabil. Ampere is also working with other chip designers, namely U.S.-based Broadcom and South Korea-based Rebellions, whose components can be incorporated into systems developed as part of the program.In an interview with CRN, Ampere Chief Product Officer Jeff Wittich said the company’s Systems Builders program has two goals.The first goal is meant to make its products, including the AI-optimized AmpereOne M processors it released last year, more accessible in the channel. “What we hope is the next step is that we get a lot of attention and interest out of those channel partners, and we can start to pull them into the program," he said. The other goal of Ampere’s Systems Builders program is to provide channel partners and customers with more flexibility and choice for AI computing infrastructure.“If we get the wrong solution, we’re going to consume potentially multiple times more power [and] a ton more money, which at some point it just means that the business model becomes unsustainable but in a way that wasn’t necessary, and it also makes it really difficult for other players to participate in the market,” he said.For more details on how the program works, why Ampere thinks it's needed and how it will set the stage for future chips it designs, please check out my story on CRN: https://lnkd.in/ghkQQB7R

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Nikkei Asia

BREAKING: TSMC will not use Chinese tools in its latest 2-nanometer chipmaking production lines -- the most advanced in the entire industry -- which will go into mass production this year. https://lnkd.in/gM8PB7k8

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