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WinChip

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Series of CPUs

WinChip
General information
IDT WinChip Marketing sample
Launched	1997; 28 years ago (1997)
Discontinued	1999; 26 years ago (1999)
Marketed by	IDT
Designed by	Centaur Technology
CPUID code	0540h, 0541h, 0585h, 0587h, 058Ah, 0595h
Performance
Max.CPU clock rate	180 Mhz to 266 Mhz
FSB speeds	60 MT/s to 100 MT/s
Cache
L1cache	64KiB (C6, W2, W2A and W2B) 128 KiB (W3)
L2 cache	Motherboard dependent
L3 cache	none
Architecture and classification
Technology node	0.35 μm to 0.25 μm
Microarchitecture	Single, 4-stage,pipeline in-order execution
Instruction set	x86-16,IA-32
Physical specifications
Cores	1
Packages	CPGA (C6, W2, W2A, W3) PPGA (W2B)
Sockets	Socket 5 Socket 7 Super Socket 7
Products, models, variants
Core names	C6 W2, C6+ W2A W2B W3
Brand name	WinChip
History
Successor	Cyrix III

TheWinChip series is a discontinuedlow-power Socket 7-basedx86 processor that was designed byCentaur Technology and marketed by its parent companyIDT.

Overview

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Design

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The design of the WinChip was quite different from other processors of the time. Instead of a largegate count anddie area, IDT, using its experience from theRISC processor market, created a small and electrically efficient processor similar to the80486, because of its singlepipeline andin-order execution microarchitecture. It was of much simpler design than its Socket 7 competitors, such asAMD K5/K6, which weresuperscalar and based on dynamic translation to bufferedmicro-operations with advanced instruction reordering (out of order execution).

Use

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WinChip was, in general, designed to perform well with popular applications that did few floating point calculations, if any. This includedoperating systems of the time and the majority of software used in businesses. It was also designed to be a drop-in replacement for the more complex, and thus more expensive, processors it was competing with. This allowed IDT/Centaur to take advantage of an established system platform (Intel'sSocket 7).

Later developments

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WinChip 2, an update of C6, retained the simple in-order execution pipeline of its predecessor, but added dual MMX/3DNow! processing units that could operate in superscalar execution.^[1] This made it the only non-AMD CPU on Socket 7 to support 3DNow! instructions. WinChip 2A addedfractional multipliers and adopted a 100 MHzfront side bus to improve memory access and L2 cache performance.^[2] It also adopted aperformance rating nomenclature instead of reporting the real clock speed, similar to contemporary AMD andCyrix processors.

Another revision, the WinChip 2B, was also planned. This featured a die shrink to 0.25 μm, but was only shipped in limited numbers.^[3]

A third model, the WinChip 3, was planned as well. This was meant to receive a doubled L1 cache, but the W3 CPU never made it to market.^[3]

Performance

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Although the small die size and low power-usage made the processor notably inexpensive to manufacture, it never gained much market share. WinChip C6 was a competitor to theIntel Pentium andPentium MMX,Cyrix 6x86, and AMD K5/K6. It performed adequately, but only in applications that used littlefloating point math. Its floating point performance was simply well below that of the Pentium and K6, being even slower than the Cyrix 6x86.^[4]

Decline

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The industry's move away fromSocket 7 and the release of theIntel Celeron processor signalled the end of the WinChip. In 1999, theCentaur Technology division of IDT was sold toVIA. Although VIA branded the processors as "Cyrix", the company initially used technology similar to the WinChip in itsCyrix III line.^[5]

Data

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Winchip C6 (0.35 μm)

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All models supportedMMX^[6]
The 88 mm² die was made using a 0.35 micron 4-layer metal CMOS technology.^[6]
The 64 Kib L1 Cache of the WinChip C6 used a 32 KB 2-way set associative code cache and a 32 KB 2-way set associative data cache.^[6]

Processor model	Frequency	FSB	Mult.	L1 cache	TDP	CPU core voltage	Socket	Release date	Part number(s)	Introduction price
WinChip 180	180 MHz	60MT/s	3	64KiB	9.4 W	3.45—3.6 V	Socket 5 Socket 7 Super Socket 7 CPGA 296	13 October 1997	DS180GAEM	$90
WinChip 200	200 MHz	66 MT/s	3	64 KiB	10.4 W	3.45—3.6 V	Socket 5 Socket 7 Super Socket 7 CPGA 296	13 October 1997	DS200GAEM	$135
WinChip 225	225 MHz	75 MT/s	3	64 KiB	12.3 W	3.45—3.6 V	Socket 7 Super Socket 7 CPGA 296	13 October 1997	PSME225GA
WinChip 240	240 MHz	60 MT/s	4	64 KiB	13.1 W	3.45—3.6 V	Socket 5 Socket 7 Super Socket 7 CPGA 296	November 1997?	PSME240GA

WinChip 2 (0.35 μm)

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All models supportedMMX^[3] and3DNow!^[3]
The 95 mm² die was made using a 0.35 micron 5-layer metal CMOS technology.^[3]
The 64 Kib L1 Cache of the WinChip 2 used a 32 KB 2-way set associative code cache and a 32 KB 4-way set associative data cache.

Processor model	Frequency	FSB	Mult.	L1 cache	TDP	CPU core voltage	Socket	Release date	Part number(s)
WinChip 2-200	200 MHz	66MT/s	3	64KiB	8.8 W	3.45—3.6 V	Socket 5 Socket 7 Super Socket 7 CPGA 296		3DEE200GSA 3DFF200GSA
WinChip 2-225	225 MHz	75 MT/s	3	64 KiB	10.0 W	3.45—3.6 V	Socket 7 Super Socket 7 CPGA 296		3DEE225GSA
WinChip 2-240	240 MHz	60 MT/s	4	64 KiB	10.5 W	3.45—3.6 V	Socket 5 Socket 7 Super Socket 7 CPGA 296		3DEE240GSA
WinChip 2-250	250 MHz	83 MT/s	3	64 KiB	10.9 W	3.45—3.6 V	Super Socket 7 CPGA 296	?

WinChip 2A (0.35 μm)

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All models supportedMMX^[1] and3DNow!^[1]
The 95 mm² die was made using a 0.35 micron 5-layer metal CMOS technology.^[3]
The 64 Kib L1 Cache of the WinChip 2A used a 32 KB 2-way set associative code cache and a 32 KB 4-way set associative data cache.^[1]

Processor model	Frequency	FSB	Mult.	L1 cache	TDP	CPU core voltage	Socket	Release date	Part number(s)
WinChip 2A-200	200 MHz	66MT/s	3	64KiB	12.0 W	3.45—3.6 V	Socket 5 Socket 7 Super Socket 7 CPGA 296	March 1999?	3DEE200GTA
WinChip 2A-233	233 MHz	66 MT/s	3.5	64 KiB	13.0 W	3.45—3.6 V	Socket 5 Socket 7 Super Socket 7 CPGA 296	March 1999?	3DEE233GTA
WinChip 2A-266	233 MHz	100 MT/s	2.33	64 KiB	14.0 W	3.45—3.6 V	Super Socket 7 CPGA 296	March 1999?	3DEE266GSA
WinChip 2A-300	250 MHz	100 MT/s	2.5	64 KiB	16.0 W	3.45—3.6 V	Super Socket 7 CPGA 296		3DEE300GSA

WinChip 2B (0.25 μm)

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All models supportedMMX^[7] and3DNow!^[7]
The 58 mm² die was made using a 0.25 micron 5-layer metal CMOS technology.^[3]
The 64 Kib L1 Cache of the WinChip 2B used a 32 KB 2-way set associative code cache and a 32 KB 4-way set associative data cache.^[7]
Dual-voltage CPU: while the processor core operates at 2.8 V, the externalinput/output (I/O) voltages remain 3.3 V for backwards compatibility.

Processor model	Frequency	FSB	Mult.	L1 cache	TDP	CPU core voltage	Socket	Release date	Part number(s)	Introduction price
WinChip 2B-200	200 MHz	66MT/s	3	64KiB	6.3 W	2.7—2.9 V	Socket 7 Super Socket 7 PPGA 296		3DFK200BTA
WinChip 2B-233	200 MHz	100 MT/s	2	64 KiB	6.3 W	2.7—2.9 V	Super Socket 7 PPGA 296

WinChip 3 (0.25 μm)

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All models supportedMMX^[8] and3DNow!^[8]
The 75 mm² die was made using a 0.25 micron 5-layer metal CMOS technology.^[3]
The 128 Kib L1 Cache of the WinChip 3 used a 64 KB 2-way set associative code cache and a 64 KB 4-way set associative data cache.^[8]
Dual-voltage CPU: while the processor core operates at 2.8 volts, the externalinput/output (I/O) voltages remain 3.3 volts for backwards compatibility.

Processor model	Frequency	FSB	Mult.	L1 cache	TDP	CPU core voltage	Socket	Release date	Part number(s)
WinChip 3-233	200 MHz	66MT/s	3	128KiB	? W	2.7—2.9 V	Socket 7 Super Socket 7 CPGA 296
WinChip 3-266	233 MHz	66 MT/s	3.5	128 KiB	8.4 W	2.7—2.9 V	Socket 7 Super Socket 7 CPGA 296	Samples only	FK233GDA
WinChip 3-300	233 MHz	100 MT/s	2.33	128 KiB	8.4 W	2.7—2.9 V	Super Socket 7 CPGA 296	Samples only	FK300GDA
WinChip 3-300	266 MHz	66 MT/s	4	128 KiB	9.3 W	2.7—2.9 V	Socket 7 Super Socket 7 CPGA 296
WinChip 3-333	250 MHz	100 MT/s	2.5	128 KiB	8.8 W	2.7—2.9 V	Super Socket 7 CPGA 296
WinChip 3-333	266 MHz	100 MT/s	2.66	128 KiB	9.3 W	2.7—2.9 V	Super Socket 7 CPGA 296

References

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^^a ^b ^c ^d"PROCESSOR Version A Data Sheet"(PDF). January 1999. Archived from the original on March 22, 2003. Retrieved2 November 2011.
^Hare, Chris."Processor Speed Settings". Archived fromthe original on 28 April 2007. Retrieved24 April 2007.
^^a ^b ^c ^d ^e ^f ^g ^h"IA-32 implementation: Centaur WinChip 2".SandPile.org. Archived fromthe original on 27 April 2007. Retrieved29 April 2007.
^Pabst, Thomas (9 October 1997)."The IDT WinChip C6 CPU".Tom's Hardware. Retrieved29 April 2007.
^Witheiler, Matthew (5 January 2001)."The New VIA Cyrix III: The Worlds First 0.15 Micron x86 CPU".AnandTech. Retrieved29 April 2007.
^^a ^b ^c"IA-32 implementation: Centaur WinChip".Sandpile. Retrieved13 May 2007.
^^a ^b ^c"PROCESSOR Data Sheet for WinChip 2 version B"(PDF). April 1999. Archived from the original on October 13, 2011. Retrieved2 November 2011.
^^a ^b ^c"PROCESSOR Data Sheet"(PDF). April 1999. Archived from the original on June 14, 2001. Retrieved2 November 2011.

External links

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Wikimedia Commons has media related toWinChip.

v t e VIA Technologies
Lists	Microprocessors Chipsets Nano Eden C7 C3
Products	VIA Nano VIA Eden VIA CoreFusion VIA C7 VIA C3 Cyrix III
See also	VIA PadLock Centaur Technology WonderMedia Zhaoxin JV