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TheThin Shrink Small Outline Package (TSSOP) is a rectangularsurface mount plasticintegrated circuit (IC) package with gull-wing leads.
They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operational amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless,Disk drives, video/audio andconsumer electronics.[1]
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standardSOIC package. It is also smaller and thinner than aTSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.
Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. Theexposed pad will be soldered on thePCB to transfer heat from the package to the PCB. In most applications, the exposed pad is connected to ground.[2]
The Heat sink thin shrink small outline package[3] (HTSSOP) isTexas Instruments name for a TSSOP with an exposed pad on the bottom side.[4] There are some other manufacturers who use the same name.
