Semiconductor fabrication plants are factories whereintegrated circuits (ICs), also known asmicrochips, are manufactured. They are either operated byIntegrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or bypure play foundries that manufacture designs from fabless companies and do not design their own ICs. Some pure play foundries likeTSMC offer IC design services, and others, likeSamsung, design and manufacture ICs for customers, while also designing, manufacturing and selling their own ICs.

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• Wafer size – largest wafer diameter that a facility is capable of processing. (Semiconductor wafers are circular.)
• Process technology node – size of the smallest features that the facility is capable of etching onto the wafers.
• Production capacity – a manufacturing facility's nameplate capacity. Generally max wafers produced per month.
• Utilization – the number of wafers that a manufacturing plant processes in relation to its production capacity.
• Technology/products – Type of product that the facility is capable of producing, as not all plants can produce all products on the market.

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Operating fabs include foundries fromTSMC,GlobalFoundries, Silex Microsystems,Tower Semiconductor,Advanced Micro Foundry,VTT,SilTerra andIHP Microelectronics amongst others.^[1]