TheKOMDIV-32 (Russian:КОМДИВ-32) is a family of 32-bitmicroprocessors developed and manufactured by theScientific Research Institute of System Development (NIISI) of theRussian Academy of Sciences.^[1][2] The manufacturing plant of NIISI is located inDubna on the grounds of theKurchatov Institute.^[3] The KOMDIV-32 processors are intended primarily for spacecraft applications and many of them areradiation hardened (rad-hard).

These microprocessors are compatible withMIPS R3000 and have an integrated MIPS R3010 compatiblefloating-point unit.^[4]

• 0.5 μmCMOS process, 3-layer metal
• 108-pin ceramicQuad Flat Package (QFP)
• 1.5 million transistors, 8KB L1 instruction cache, 8KB L1 data cache, compatible withIDT 79R3081E

• 0.5 μmCMOS process

• 0.35 μm CMOS process

• 0.35 μmsilicon on insulator (SOI)CMOS process
• 108-pin ceramicQuad Flat Package (QFP)
• working temperature from -60 to 125 °C

• 0.5 μmsilicon on insulator (SOI)CMOS process
• 108-pin ceramicQuad Flat Package (QFP)
• cache (8KB each for data and instructions)
• working temperature from -60 to 125 °C

• 0.5 μm SOI CMOS process
• 240-pin ceramic QFP
• radiation tolerance to not less than 200 kRad, working temperature from -60 to 125 °C
• System-on-a-chip (SoC) includingPCI master / slave, 16GPIO, 3UART, 3 32-bittimers
• cache (8KB each for data and instructions)
• second-sourced by MVC Nizhny Novgorod under the name1904VE1T (Russian:1904ВЕ1Т) with a clock rate of 40 MHz

• development nameRezerv-32
• 0.35 μm SOI CMOS process
• 108-pin ceramic QFP
• radiation tolerance to not less than 200 kRad, working temperature from -60 to 125 °C
• triple modular redundancy on block level with self-healing
• both registers and cache (4KB each for data and instructions) are implemented as dual interlocked storage cells (DICE)

• 0.25 μm SOI CMOS process; manufacturing to be moved toMikron
• 256-pin ceramic QFP
• production planned for 2016 (previously this device was planned to go into production in 2014 under the name 1907VE1T or 1907VM1T)^[12]
• radiation tolerance to not less than 200 kRad
• SoC includingSpaceWire,GOST R 52070-2003 (Russian version ofMIL-STD-1553),SPI, 32GPIO, 2UART, 3timers,JTAG
• cache (8KB each for data and instructions)

• development nameSkhema-10
• 0.25 μm SOI CMOS process; manufacturing to be moved toMikron
• 675-pin ceramicBGA
• SoC includingSpaceWire, GOST R 52070-2003 (MIL-STD-1553),RapidIO,SPI,I²C, 16GPIO, 2UART, 3 32-bittimers,JTAG, DSP (same command set as DSP in1890VM7Ya)
• DDR2 SDRAM controller withECC
• cache (8KB each for data and instructions)
• working temperature from -60 to 125 °C

• development nameObrabotka-10
• 0.25 μm SOI CMOS process; manufactured byMikron
• 256-pin ceramic QFP
• SoC includingSpaceWire, GOST R 52070-2003 (MIL-STD-1553),SPI, 32GPIO, 2UART, 3timers,JTAG
• radiation tolerance to not less than 200 kRad
• triple modular redundancy in processor core
• both registers and cache (4KB each for data and instructions) are implemented as dual interlocked storage cells (DICE) with 1 parity bit per byte for cache andHamming code for registers
• SECDED for external memory
• working temperature from -60 to 125 °C

• development nameSkhema-23
• 0.25 μm SOI CMOS process; manufactured byMikron
• 407-pin ceramicPGA
• SoC including 8-channelSpaceWire, GOST R 52070-2003 (MIL-STD-1553),SPI,I²C,CAN bus, 32GPIO, 2UART, 3timers,JTAG
• cache (8KB each for data and instructions)

• development nameObrabotka-26
• 0.25 μmsilicon on insulator (SOI)CMOS process; manufactured byMikron
• 407-pin ceramicPGA
• SoC including 4-channelSpaceWire, GOST R 52070-2003 (MIL-STD-1553),SPI,I²C,RapidIO,GPIO, 2UART, 3timers,JTAG,PCI, co-processor for image processing
• cache (8KB each for data and instructions)

• development nameObrabotka-29
• 0.25 μmsilicon on insulator (SOI)CMOS process; manufactured byMikron
• PGA
• SoC including 4-channelSpaceWire, GOST R 52070-2003 (MIL-STD-1553),SPI, 32GPIO, 2UART, 3timers, 128KB SRAM
• triple modular redundancy in processor core

• KOMDIV-64, 64-bit MIPS processors developed by NIISI
• Mongoose-V, a 32-bit MIPS processor for spacecraft applications developed forNASA
• Soviet integrated circuit designation

• Radiation-hardened microprocessors
• Avionics computers
• MIPS implementations
• 32-bit microprocessors

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• Articles containing Russian-language text