In the context ofintegrated circuits, adie is a small block ofsemiconducting material on which a given functional circuit isfabricated. Typically, integrated circuits are produced in large batches on a singlewafer of electronic-gradesilicon (EGS) or other semiconductor (such asGaAs) through processes such asphotolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms:dice,dies, anddie.[1][2] To simplify handling and integration onto aprinted circuit board, most dies arepackaged invarious forms.
Most dies are composed of silicon and used for integrated circuits. The process begins with the production ofmonocrystalline siliconingots. These ingots are then sliced into disks with a diameter of up to 300 mm.[3][4]
These wafers are then polished to a mirror finish before going throughphotolithography. In many steps the transistors are manufactured and connected with metal interconnect layers. These prepared wafers then go throughwafer testing to test their functionality. The wafers are then sliced and sorted to filter out the faulty dies. Functional dies are thenpackaged and the completed integrated circuit is ready to be shipped.
A die can host many types of circuits. One common use case of an integrated circuit die is in the form of acentral processing unit (CPU). Through advances in modern technology, the size of thetransistor within the die has shrunk exponentially, followingMoore's law. Other uses for dies can range fromLED lighting topower semiconductor devices.
Images of dies are commonly calleddie shots.
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